6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

______________________

FORM 6-K

REPORT OF A FOREIGN ISSUER

PURSUANT TO RULE 13A-16 OR 15D-16

OF THE SECURITIES EXCHANGE ACT OF 1934

For July 2006

______________________

ASML Holding N.V.

De Run 6501

5504 DR Veldhoven

The Netherlands

(Address of principal executive offices)

______________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-Fx Form 40-F [_]

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes [_] No x

If ''Yes'' is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

Exhibits

99.1 "ASML Announces Update of its Share Buyback Program," press release dated July 4, 2006

99.2 "ASML Announces Update of its Share Buyback Program," press release dated July 11, 2006

99.3 "ASML Expands Immersion Product Suite with Introduction of Advanced 40nm Immersion System," press release dated July 11, 2006

99.4 "ASML Marks Technology and Market Leadership with Shipment of 500th TWINSCAN System," press release dated July 11, 2006

99.5 "ASML Announces Completion of its Share Buyback Program," press release dated July 18, 2006

99.6 "40 nm and below: Extending water-based immersion towards the limit - Semicon West 2006," presentation dated July 11, 2006

99.7 "2006 Second Quarter Results," presentation dated July 19, 2006

"Safe Harbor" Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to, economic conditions, product demand and industry capacity, competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in filings with the U.S. Securities and Exchange Commission.

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

ASML HOLDING N.V. (Registrant)

Date: August 10, 2006	By:	/s/ Peter T.F.M. Wennink
		Peter T.F.M. Wennink
		Executive Vice President
		and Chief Financial Officer

2

EX-99

Exhibit 99.1

ASML Announces Update of its Share Buyback Program

VELDHOVEN, the Netherlands, July 4, 2006 – ASML Holding NV (ASML) today announced progress in connection with its share buyback program disclosed on April 19, 2006 as follows:

• To effect share repurchases under its buyback program, ASML enters into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares that are to be purchased by the broker and delivered to ASML, as well as timing of purchases, is left to the discretion of the broker, within pre-agreed ranges.

• During the period from June 26 through June 30, 2006, ASML acquired 3,750,000 of its shares from the broker pursuant to the share buyback program, at an average price of EUR 15.82 per share.

• The aggregate amount of shares bought back up to and including June 30, 2006 is 19,929,998 and represents 78.4 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

• ASML’s share buyback program was announced on April 19, 2006 and will terminate on April 18, 2007.

• ASML intends to cancel its repurchased shares.

About ASML

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

ASML

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com

tel: +31.40.268.6572

fax: +31.40.268.3655

1

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

2

EX-99

Exhibit 99.2

ASML Announces Update of its Share Buyback Program

VELDHOVEN, the Netherlands, July 11, 2006 – ASML Holding NV (ASML) today announced progress in connection with its share buyback program disclosed on April 19, 2006 as follows:

• To effect share repurchases under its buyback program, ASML enters into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares that are to be purchased by the broker and delivered to ASML, as well as timing of purchases, is left to the discretion of the broker, within pre-agreed ranges.

• During the period from July 3 through July 7, 2006, ASML acquired 2,250,000 of its shares from the broker pursuant to the share buyback program, at an average price of EUR 15.84 per share.

• The aggregate number of shares bought back up to and including July 7, 2006 is 22,179,998 and represents 87.3 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

• ASML’s share buyback program was announced on April 19, 2006 and will terminate on April 18, 2007.

• ASML intends to cancel its repurchased shares.

About ASML

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

ASML

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com

tel: +31.40.268.6572

fax: +31.40.268.3655

1

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

2

EX-99

Exhibit 99.3

ASML Expands Immersion Product Suite with Introduction of Advanced 40nm Immersion System

SAN FRANCISCO, California – SEMICON West 2006 – July 11, 2006 – ASML Holding NV (ASML) today introduced the semiconductor industry’s most advanced lithography system, the ASML TWINSCAN™ XT:1900i. In combination with ASML proprietary low k1 capabilities, this new system extends optical lithography for volume production to 40-nanometer (nm) and below. ASML’s newest 193-nm wavelength immersion scanner surpasses the company's previous numerical aperture (NA) achievements, delivering a new industry NA benchmark of 1.35, the near practical limit for water-based immersion technology.

With the introduction of this latest immersion system, ASML now offers immersion solutions for its customers for resolutions from 65- to 40-nm with three different products that allow for seamless system transition by customers: from one resolution to the next. The XT:1400i is already being used in production and the first qualification lots have now been produced on the XT:1700i with production ramp-up at customer sites expected to follow as early as Q4 2006.

“This fifth generation immersion system builds upon the success of its predecessors to satisfy customer’s needs for continuous shrink. The XT:1900i is an immersion system for the most critical layers," said Martin van den Brink, executive vice president, marketing and technology, ASML. “We introduced our first immersion R&D system in Q4 2004 and, so far, ASML has shipped 20 ASML immersion systems to three continents. We continue our immersion leadership and we now offer our customers a full suite of immersion products.”

The new XT:1900i is based on previous generations of immersion technology proven on systems installed at customer sites worldwide. The XT:1900i leverages the TWINSCAN platform’s dual wafer stage functionality for parallel dry metrology and wet exposure to further extend ASML’s industry leading productivity to 131 wafers per hour (125 exposures). To support the 40-nm production application, overlay performance is further enhanced. The proven in-line catadioptric lens design ensures reticle compatibility with previous systems.

While the XT:1700i is ideally suited for volume production at the 45-nm node and is currently being shipped in volume to customers, the XT:1900i will specifically enable volume production for logic devices down to 32-nm and memory devices at 40-nm and below.

ASML expects to begin shipping the XT:1900i by mid 2007.

About ASML

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

1

For more information on lithography and definitions of technical terms, please see the Lithography Glossary in the “Press” section of ASML.com.

ASML

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com

tel: +31.40.268.6572

fax: +31.40.268.3655

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

2

EX-99

Exhibit 99.4

ASML Marks Technology and Market Leadership with Shipment of 500th TWINSCAN System

VELDHOVEN, the Netherlands, July 11, 2006 – ASML Holding NV (ASML) today announced that it is preparing to ship its 500th TWINSCAN™ lithography system. This milestone demonstrates the acceptance of the TWINSCAN platform as the semiconductor industry’s standard for 300-millimeter (mm) lithography, which has helped ASML sustain the leading market share position for the past several years.

Until the introduction of the TWINSCAN platform in 2000, critical wafer measurements proved a bottleneck to wafer throughput in the litho cell. The TWINSCAN system’s innovative dual-stage separates the process of wafer exposure from metrology and performs both processes in parallel, while improving throughput by more than 50 percent.

“Some 1 million wafers per day are processed by the current installed base of TWINSCAN systems, comprising i-line, 248-nanometer (nm), 193-nm dry and immersion systems,” said Bert Koek, Vice President and Business Unit Manager, ASML. “The TWINSCAN platform with its dual-stage advantage is not only reliable but it also provides the productivity increases necessary to support cost-effective, high-volume manufacturing. ASML also uses the same platform for 193-nm immersion development and production, thanks to high modularity and flexibility. We are now preparing our TWINSCAN platform for the 32-nm node.”

Since its introduction in 2000, TWINSCAN products have continued to be the platform of choice among customers globally. Sixty-eight percent of TWINSCAN systems have shipped to Asia, 25 percent to the United States and seven percent to Europe. Two Asian chipmakers have the largest number of TWINSCAN systems among ASML customers. ASML has also shipped more than 10 TWINSCAN systems to several customers in Japan.

“Dual-stage technology is an advancement that also improved imaging and overlay because more measurements can be done without impacting the increased productivity. It became a stepping stone for accelerating immersion development and progress,” said Jan Smits, Senior Vice President and Business Unit Manager, ASML. “Performing measurements dry while exposing wet has allowed our TWINSCAN platform to leapfrog any new metrology recipes needed for wet environments, a problem that single-stage immersion systems have not yet overcome.”

The milestone 500th TWINSCAN system will be shipped this quarter to Asia.

About ASML

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

1

ASML

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com

tel: +31.40.268.6572

fax: +31.40.268.3655

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

2

EX-99

Exhibit 99.5

ASML Announces Completion of its Share Buyback Program

VELDHOVEN, the Netherlands, July 18, 2006 – ASML Holding NV (ASML) today announced completion of its share buyback program disclosed on April 19, 2006 as follows:

• During the period from July 10 through July 13, 2006, ASML acquired 3,270,298 of its shares from its broker pursuant to the share buyback program, at an average price of EUR 15.48 per share.

• The aggregate number of shares bought back up to and including July 13, 2006 is 25,450,296 and represents 100 percent of the announced objective of maximum EUR 400 million to be repurchased during the term of the program.

• ASML’s share buyback program announced on April 19, 2006 and completed on July 13, 2006 represents 5.25 percent of outstanding shares.

• To effect share repurchases under its buyback program, ASML entered into forward purchase transactions with a broker acting as principal. Under the terms of these transactions, the exact number of shares to be purchased by the broker and delivered to ASML, as well as timing of purchases, was left to the discretion of the broker, within pre-agreed ranges.

• ASML intends to cancel its repurchased shares.

About ASML

ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML.

ASML

Tom McGuire

Vice President Communications

corpcom@asml.com

tel: +31.40.268.5758

fax: +31.40.268.3655

Angelique Paulussen

Senior Director Corporate Communications

corpcom@asml.com

tel: +31.40.268.6572

fax: +31.40.268.3655

1

Craig DeYoung

Vice President Investor Relations

craig.deyoung@asml.com

tel: +1.480.383.4005

fax: +1.480.383.3976

Franki D'Hoore

Director European Investor Relations

franki.dhoore@asml.com

tel: +31.40.268.6494

fax: +31.40.268.3655

2

EX-99

40 nm and below
Extending water-based immersion towards the limit

Martin van den Brink

Executive Vice President Marketing and Technology

Contents

Inspiration: Market drivers

Immersion: Ramping to volume production

Innovation: Pushing ArF Lithography to 40 nm and below

/ Slide 2

Customers’ appetite for shrink continues unabated

10

12

200

100

80

60

40

Logic

DRAM

NAND

11

07

09

08

04

06

05

01

03

02

00

/ Slide 3

Shrink drives cost per function and market growth

Source: Gartner Dataquest, iSuppli, ASML

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

NAND cost, $ / GB

NAND size, GB

0.01

0.10

1.00

10.0

100

1,000

10,000

0

5,000

10,000

15,000

20,000

25,000

30,000

NAND Revenue, M$

Projected  cross-
over
HDD - NAND, GB

60-80 GB

2-16 GB

80-150 GB

1 GB

4 GB

8 GB

10-20 GB

/ Slide 4

Resolution, CD uniformity & overlay drive shrink

Layout 6 transistor SRAM Cell

CD

CD

CDU &
Overlay

X-section
through Cell

Source: IMEC, TI

Node

Aggressive

Typical

Relaxed

130 nm

2.00

2.50

3.00

90 nm

1.00

1.25

1.50

65 nm

0.45

0.55

0.80

45 nm

0.20

0.27

0.34

32 nm

0.10

0.13

0.19

/ Slide 5

Source: IMEC

CD control and overlay are critical for device yield

/ Slide 6

Shrink drives overlay requirements

0

5

10

15

20

25

30

2004

2005

2006

2007

2008

2009

2010

2011

2012

NAND

DRAM

Logic

/ Slide 7

Lithography drives increased die per wafer

Typical

Aggressive

Relaxed

868

1234

1803

2344

28 mm²

37 mm²

54 mm²

76 mm²

Die Size

Die / Wafer

45 nm

32 nm

Design Rule:

45 nm

32 nm

Resolution (CD)

256 MB SRAM example

/ Slide 8

0.00

0.50

1.00

1.50

2.00

2.50

3.00

3.50

65

45

Increased die per wafer drives lower cost die

* Assuming 20% wafer processing cost
increase per node, 65nm = €1200 / wafer,
die yield = 85%

Design Rule [nm]

Relaxed

Typical

Aggressive

256 MB SRAM

32-nm node

/ Slide 9

ASML products are key enablers for shrink

10

12

200

100

80

60

40

Logic

DRAM

NAND

11

07

09

08

04

06

05

01

03

02

00

ASML Product
Introduction

XT:1400

XT:1700i

AT:1200

AT:850

/ Slide 10

Performance
Size (=Cost)
Yield

Cost

Size (=cost)
Yield

Lithography

Productivity

Overlay

Resolution
CD Control

Lithography: drives Performance, Cost, Size, Yield
A key enabler for the semiconductor industry

Lithography

/ Slide 11

Contents

Inspiration: Market drivers

Immersion: Ramping to volume production

Innovation: Pushing ArF Lithography to 40 nm and below

/ Slide 12

ASML achievements in immersion leadership

2003

90 nm

1^st scanning
immersion
imaging

XT:1250i
0.85 NA, 70 nm

2004

AT:1150i
0.75 NA, 90 nm

1^st ICs
fabricated

2005

XT:1400i
0.93 NA, 65 nm

42 nm

Immersion
Volume
Production

2006

XT:1700i
1.2NA, 45 nm

Immersion
processing at
single defect
level

/ Slide 13

THIS QUARTER 2006:

SHIPPING 500^th TWINSCAN SYSTEM

TWINSCAN, with dual wafer stages, is the economically
and technically proven lithography solution

8

US

Europe

Asia

125

Total & Immersion

2

10

35

340

/ Slide 14

TWINSCAN dual stages are ideal for immersion

Immersion exposure

Immersion shower head

Dry alignment

Dry wafer mapping

(focus & levelling)

/ Slide 15

TWINSCAN dual wafer stages offer the most extensive
integrated metrology and calibration capability

Wafer height map

Calibration of process -
focus

Alignment mark positions

Pupil intensity and polarization

Slit uniformity

Lens aberrations

Reticle shape deformations

Expose position

Metrology position

Dual wafer stage concept is key enabler for automatic integrated

MEASUREMENT  -  CALIBRATION  -  OPTIMIZATION

Both wafer
stages are being
used in both
positions

Both wafer stages  
contain integrated
metrology sensors

/ Slide 16

Dual wafer stages

Dual wafer stages enable parallel wafer
processing for unparalleled throughput

SWAP

UNLOAD

LOAD

Metrology position

Expose position

DRY METROLOGY

O

O

Lens
utilization

Single wafer stage

Timeline for 1 wafer cycle  

LOAD

DRY METROLOGY

EXPOSE

UNLOAD

O

O

Dry focus: additional wet

single stage overhead

Lens
utilization

Timeline for 1 wafer cycle  

Compatibility:   Dry focus and alignment - compatible with existing processes

Accuracy:   Highly accurate, multi point wafer metrology without productivity penalty

Cost:   Maximized lens utilization – the most expensive part of the scanner

Dual wafer stage advantage

EXPOSE

/ Slide 17

_Overlay

_Productivity

_Defects

_{Containment
of
water}

_{Minimize
evaporation}

_{Prevent
drying stains}

_{Maximize
scan speed}

The immersion challenge triangle

/ Slide 18

hydrophilic

Air curtain allows for high speed scanning for  
increased productivity

0

25%

50%

75%

100%

20°

120°

Air Curtain

Productivity
Advantage

Air Curtain OFF

40°

60°

80°

100°

Receding contact angle

Air Curtain ON

Resists & developer
soluble top coats

hydrophobic

solvent soluble

/ Slide 19

0.006 def/cm² ( 3 defects )

XT:1400i @ 500-mm/s speed: Only 3 immersion
defects

100-nm L/S

In cooperation with TEL

/ Slide 20

Scanner:

ASML XT:1400i

@ 500mm/sec

Track

TEL Lithius i+

Process:

BARC AZ-Clariant 1CD5

Resist TOK TArF6011

TC TOK TILC031

Inspection:

KLA-Tencor 2365

TSMC

Single Digit Defect Zone

0.001

0.01

0.1

1

10

Nov-04

Feb-05

May-05

Sep-05

Dec-05

Mar-06

1

10

100

1000

10000

Defect levels comparable to ‘dry’ systems
demonstrated

/ Slide 21

Immersion dual-stage overlay of 7 nm

Day 1

Day 2

Day 3

0

2

4

6

8

10

12

X

Y

XT:1700i

/ Slide 22

Lens design and manufacturing innovation for max NA

8

0

2

4

6

10

12

0.75

2001

0.85

2003

0.93

2005

1.2

2006

NA

Year

Water Immersion

0

2

4

6

10

12

Dry (air)

1100

1200

1400

Catadioptric design

Geometric scaling

Dioptric designs

Lens Design

1700i

/ Slide 23

Benefits of in-line catadioptric lens design

Source: Carl Zeiss SMT patent applications

Catadioptric

Folded Designs

In-line

Dioptric

Single barrel design provides mechanical stability & ease of adjustment

Low angles of incidence on mirrors for polarization control and transmission

Fewer optical elements resulting in lower cost, lens heating and flare

/ Slide 24

No mask Image flip!  Reticle compatibility

Benefits of in-line catadioptric lens design

-

In- Line catadioptric

even # mirrors

Refractive

Lenses

F

F

Reticle

compatibility

-

even # mirrors

Refractive

Lenses

Reticle

compatibility

Folded catadiotric

F

Reticle

uneven # mirrors

Reticle

incompatibility

/ Slide 25

In-line catadioptric lens is manufacturing and
performance proven

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Mean

1700i

1

1400  

2

3

4

5

6

7

8

9

10

11

12

13

14

15

Lens Production

/ Slide 26

Excellent polarization performance at multiple systems

88

90

92

94

96

98

100

0

0.5

1

1.5

2

2.5

Polarization Purity

Multiple
Systems

Polarization Purity variation across field

/ Slide 27

Polarized imaging down to 42 nm

550-mm/s scan speed

/ Slide 28

Data proven excellent CD control across wafer

550-mm/s scan speed

Using reticle error and process correction

Full Wafer CDU 1.4 nm

45-nm Dense Lines

Intra Field CDU 0.9 nm

45-nm Dense Lines

/ Slide 29

Imaging of challenging contact layers

/ Slide 30

Contents

Inspiration: Market drivers

Immersion: Ramping to volume production

Innovation: Pushing ArF Lithography
to 40 nm and below

/ Slide 31

“40nm and below”

Highest NA

ArFi lens: 1.35 NA

Improved Overlay
6 nm

Highest Productivity

Fastest Scanning Stages:
131 wph

@ 125 exposures / wafer

TWINSCANXT:1900i provides the best resolution,
productivity and overlay

/ Slide 32

Milestones in immersion leadership

/ Slide 33

Lens design and manufacturing innovation for max NA

8

0

2

4

6

10

12

0.75

2001

0.85

2003

0.93

2005

1.2

2006

NA

Year

Water Immersion

0

2

4

6

10

12

Dry (air)

2007

1.35

1100

1200

1400

1700i

1900i

/ Slide 34

ASML mask and system enhancements extend
lithography to the limit of k ₁

Offline Dual stage wafer
height mapping

Focus Dry, Expose Wet

Mask enhancement
techniques &
optimization software

DoseMapper for optimum
CD Uniformity

Application specific
lens setup

Flexible off-axis &
polarized illumination

In-built wave-front, polarization
and pupil metrology

Illumination source
optimization & software

+

=

/ Slide 35

Polarized dipole
Illumination

1:1 Dense Lines
using 6% att-PSM

Image in film calc.

+/-3% dose error

+/-10% CD spec

XT:1900i is designed for 40-nm volume production

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

35

40

45

50

55

60

Resolution half-pitch [nm]

XT:1900i
1.35 NA

XT:1400i
0.93 NA

XT:1700i
1.2 NA

XT:1400i : 1100 nm DoF @ 55 nm

  XT:1700i : 950 nm DoF @ 42 nm  

/ Slide 36

ASML products enableshrink

10

12

200

100

80

60

40

Logic

DRAM

NAND

11

07

09

08

04

06

05

01

03

02

00

ASML Product
Introduction

XT:1400

XT:1700i

AT:1200

AT:850

XT:1900i

/ Slide 37

Cost per function continues downward trend

ASML aligns to customer value drivers by
delivering lower cost per function

850

KrF

1150

ArF

1250

ArF

1400

ArF

1700

ArFi

1900

ArFi

0.00

0.20

0.40

0.60

0.80

1.00

1.20

2000

2002

2004

2006

2008

2010

0.00

0.20

0.40

0.60

0.80

1.00

1.20

2000

2002

2004

2006

2008

2010

850

KrF

1150

ArF

1250

ArF

1400

ArF

1700

ArFi

1900

ArFi

/ Slide 38

TWINSCAN XT:1900i: 40 nm and below

Volume production at 40 nm and below

Fifth generation immersion tool on TWINSCAN dual
wafer stage platform with improved overlay 6 nm and
131 W/hr productivity

Proven catadioptric lens concept with manufacturing
and volume ramp up capability

Enabling our customer to continue aggressive device
shrinks for increased functionality at lower costs

/ Slide 39

Extending water-based immersion towards the limit

ASML offers full suite of TWINSCAN immersion products
withresolutions from 65- to 40-nm and below

20 immersion systems shipped to customer sites on three
continents

TWINSCAN XT:1900i most advanced immersion system
of the industry and ready for shipment by mid 2007

TWINSCAN customer acceptance: 500 system shipments

/ Slide 40

Commitment