6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF A FOREIGN ISSUER
PURSUANT TO RULE 13A-16 OR 15D-16
OF THE SECURITIES EXCHANGE ACT OF 1934

For September 2008

ASML Holding N.V.

De Run 6501
5504 DR Veldhoven
The Netherlands
(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F þ     Form 40-F o

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes o     No þ

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

TABLE OF CONTENTS

Exhibit 99.1

Exhibit 99.2

Exhibit 99.3

Exhibit 99.4

Exhibits

99.1	Citi Investment Research Technology Conference, presentation dated September 3, 2008;
99.2	Jefferies 2nd Annual Technology Conference, presentation dated September 10, 2008;
99.3	“ASML Supervisory Board Nominates Pauline van der Meer Mohr as New Member”, press release dated September 12, 2008;
99.4	“ASML Updates Industry on Significant Progress in EUV Lithography Program; Reveals Roadmap that Extends Semiconductor Manufacturing to 11 Nanometers and Beyond”, press release dated September 30, 2008.

     “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development and customer acceptance of new products, ability to enforce patents and protect intellectual property rights, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML’s Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission.

SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	ASML HOLDING N.V. (Registrant)
Date: October 3, 2008	By:	/s/ Peter T.F.M. Wennink
		Peter T.F.M. Wennink
		Executive Vice President and Chief Financial Officer

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EX-99.1

Exhibit 99.1
 

Citi Investment Research Technology Conference New York, 2008 Eric Meurice Chief Executive Officer September 3, 2008

Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semi- conductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development and customer acceptance of new products, ability to enforce patents and protect intellectual property rights, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the US Securities and Exchange Commission.

Agenda HOW IS THE OVERALL MARKET DEVELOPING SHORT-TERM? IS THE CURRENT MARKET ENVIRONMENT COMPROMISING ASML SECULAR GROWTH MODEL?

Current market environment No change from last quarter guidance Global macro-economic uncertainty drives minimum CAPEX build Weakness in capacity order bookings from all customers, all sectors, all regions Utilization still good in Logic, but customers with no mid term demand visibility invest sparingly DRAM pricing stabilizing after Q2 increases Unit FLASH demand at 37% vs. 53% growth forecasts Most orders are for Leading Edge Immersion Over 80% of Q3 sales is expected to be immersion Immersion demand is sustained: Foundry 45 nm Flash 45 nm to 35 nm transition DRAM 5x nm ramp

Leadership in immersion Shipped 30 immersion systems in Q1 + Q2 Booked 20 immersion systems in Q2 Backlog at midyear includes 27 immersion systems Reiterate Q3 bookings guidance - we expect immersion bookings in the third quarter to be similar to that of the second quarter, but cannot easily guide on the number of orders for non-leading edge systems. On track to nearly double immersion revenue in 2008 compared with 2007

Source: ASML Last data point: June 2008 Overall IC unit growth is robust @ 10% Year to Year IC unit sales compared with year before 0 20 40 60 80 100 120 140 160 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 2% 4% 6% 8% 10% 12% 14% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Market researchers reduce their 2008 IC revenue forecasts down to 6% on average Oct - - 06 Jan - - 07 Apr - - 07 Aug - - 07 Nov - - 07 Feb - - 08 Jun - - 08 Sep - - 08 Dec - - 08 Mar - - 09 2007 - - 2008 Revenue Gorwth Forecast [%] 2008 Semiconductor revenue growth forecast over time 0% 5% 10% 15% 20% 25% Oct-06 Jan-07 apr-07 Aug-07 Nov-07 Feb-08 Sep-08 Dec-08 Mar-09 Dataquest (June 08) IC Insights (June 08) iSuppli (April 08) Semico (June 08) SIA (Jun 08) VLSI Research (Mar 08) WSTS (June 08) Average ASML

DRAM Operating margins of leading DRAM makers recovering (but for most companies still negative) through aggressive shrink and 200 mm retirement Weakening end-user demand could delay expected shortages of DRAM from end 2008 into H1 2009 Consolidation efforts within tier 2 players continuing Continuous price pressure will drive shrink fueling immersion demand Access to capital remains critical Source: ASML Last data point: June 2008 DRAM unit sales compared with year before 0 2 4 6 8 10 12 14 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Source: DRAMeXchange (8/08), ASML MCC DRAM spot and contract prices moving side ways since beginning of 2008 Main DRAM spot & contract prices (01/06 - 2008YTD) 0 1 2 3 4 5 6 7 8 Jan-06 Feb-06 Mar-06 Apr-06 May-06 Jun-06 Jul-06 Aug-06 Sep-06 Oct-06 Nov-06 Dec-06 Jan-07 Feb-07 Mar-07 Apr-07 May-07 Jun-07 Jul-07 Aug-07 Sep-07 Oct-07 Nov-07 Dec-07 Jan-08 Feb-08 Mar-08 Apr-08 May-08 Jun-08 Jul-08 Aug-08 Chip ASP [$US] 300 mm fully- loaded-costs for 6x nm 1 Gb DRAM 300 mm fully- loaded costs for 5x nm 1 Gb DRAM 200 mm cash- costs for 80nm 512 Mb DRAM 300 mm cash- costs for 80nm 512 Mb DRAM 512Mb DDR2 667 SPOT ASP 512Mb DDR2 667 CONTRACT ASP 1Gb DDR2 667 SPOT ASP 1Gb DDR2 667 CONTRACT ASP

DRAM 200 mm capacity retirement accelerated in 2008 due to persistent price pressure Source: ASML estimates Expected DRAM 200 mm capacity retirement (Q1/08-Q4/09) - -160 - -140 - -120 - -100 - -80 - -60 - -40 - -20 0 20 Q1/08 Q2/08 Q3/08 Q4/08 Q1/09 Q2/09 Q3/09 Q4/09 Capacity [200 mm equiv. KWSM]

NAND NAND ASPs keep declining due to lower than forecasted end-user demand However YTD unit growth still above 40% Current chip production costs above market prices resulting in significant losses Overcapacity expected to extend into 2009 Long term NAND application roadmap remains a strong driver for shrink Short term capex funding continues to be an issue for most manufacturers Source: ASML Last data point: June 2008 NAND unit sales compared with year before 0 0.5 1.0 1.5 2.0 2.5 3.0 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 10% 20% 30% 40% 50% 60% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Logic + MPU Logic revenues and profitability is very strong MPU sales recovering from seasonal low Investments expected to recover in 2009, especially for 45 nm, driven by record fab utilizations and additional leading-edge demand Source: ASML Last data point: June 2008 Logic unit sales compared with year before 0 5 10 15 20 25 30 35 40 45 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 2% 4% 6% 8% 10% 12% 14% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Agenda HOW IS THE OVERALL MARKET DEVELOPING SHORT-TERM? IS THE CURRENT MARKET ENVIRONMENT COMPROMISING ASML SECULAR GROWTH MODEL?

Litho Market Secular Growth Drives ASML's Growth Chip processing becomes more challenging Average selling price of a system increases (US$ million) Technology leadership brings increased market share ASML's business driven by chip unit sales Chips become more complex Average number of layers per wafer increases with IC complexity The chip industry is growing

Source: ASML, SEMI The secular growth Model: Market share growth ASML Market Share (revenue) 0% 10% 20% 30% 40% 50% 60% '84 '86 '88 '90 '92 '94 '96 '98 '00 '02 '04 '06 Success in Japan Immersion ArF in volume TWINSCAN PAS 5500 Scanner

2008- 2009 : Shrink opportunities for all sectors 10 12 Resolution, "Shrink" (nm) 200 100 80 60 40 Logic DRAM NAND 11 07 09 08 04 06 05 01 03 02 00 ASML Product Introduction XT:1400 XT:1700i AT:1200 AT:850 Double Patterning XT:1900i EUV Immersion EUV DPT Source: ASML May 2008

Market share development A natural "catch up" by our competition on immersion for 55 nm / 45 nm nodes after 1 or 2 years of virtual absence ASML leadership still intact for 2008/2009 in tool throughput, overlay and NA, delivering to customers A cost effective solution for 5X nm / 4X nm nodes A unique capability to extend to 3X nm / 2X nm nodes ASML product leadership to potentially grow with the introduction of An improved TWINSCAN architecture (XT:1950H) A new architecture in 2009 for double patterning Litho+ support package EUV in 2010 ASML cost leadership to be enhanced by Aggressive overall cost structure reductions Expected Euro rate stability or slow depreciation

ASML Vision and Strategy Articulation ASML currently operates within a lithography market which has a potential to double within the next 5 to 10 years. There is significant growth potential for us if we execute Strategy: "Over-execute" in all areas of our business Invest more in R&D to (1) strengthen the lead by introducing new advanced litho products and (2) increase performance regularly on standard products Reduce COGS through continuous redesigns, supply chain partnerships and Asian sourcing Reduce manufacturing cost through cycle time reduction OPEX flex so as to target an income from operations to net sales of 10-15 % at the low end of the business cycle and 20-25% at the high end of the cycle

Conclusions Guidance for lower revenue 2008 (may see - 20% versus 2007) unchanged Uncertainty as to when Litho Capacity build orders would materialize, but 2009 strong immersion growth from NAND 4x nm, DRAM 5x nm and Logic 4x and 3x nm will sustain ASML revenue robustness ASML to maintain technology leadership in order to sustain long term growth

EX-99.2

Exhibit 99.2
 

Jefferies 2nd Annual Technology Conference New York, 2008 Craig DeYoung VP, Investor Relations & Corporate Communications September 10th, 2008

Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semi- conductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development and customer acceptance of new products, ability to enforce patents and protect intellectual property rights, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the US Securities and Exchange Commission.

Agenda HOW IS THE OVERALL MARKET DEVELOPING SHORT-TERM? IS THE CURRENT MARKET ENVIRONMENT COMPROMISING ASML SECULAR GROWTH MODEL?

Current market environment No change from last quarter guidance Global macro-economic uncertainty drives minimum CAPEX build Weakness in capacity order bookings from all customers, all sectors, all regions Utilization still good in Logic, but customers with no mid term demand visibility invest sparingly DRAM pricing stabilizing after Q2 increases Unit FLASH demand at 37% vs. 53% growth forecasts Most orders are for Leading Edge Immersion Over 80% of Q3 sales is expected to be immersion Immersion demand is sustained: Foundry 45 nm Flash 45 nm to 35 nm transition DRAM 5x nm ramp

Leadership in immersion Shipped 30 immersion systems in Q1 + Q2 Booked 20 immersion systems in Q2 Backlog at midyear includes 27 immersion systems Reiterate Q3 bookings guidance - we expect immersion bookings in the third quarter to be similar to that of the second quarter, but cannot easily guide on the number of orders for non-leading edge systems. On track to nearly double immersion revenue in 2008 compared with 2007

Source: ASML Last data point: June 2008 Overall IC unit growth is robust @ 10% Year to Year IC unit sales compared with year before 0 20 40 60 80 100 120 140 160 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 2% 4% 6% 8% 10% 12% 14% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Market researchers reduce their 2008 IC revenue forecasts down to 6% on average Oct - - 06 Jan - - 07 Apr - - 07 Aug - - 07 Nov - - 07 Feb - - 08 Jun - - 08 Sep - - 08 Dec - - 08 Mar - - 09 2007 - - 2008 Revenue Gorwth Forecast [%] 2008 Semiconductor revenue growth forecast over time 0% 5% 10% 15% 20% 25% Oct-06 Jan-07 apr-07 Aug-07 Nov-07 Feb-08 Sep-08 Dec-08 Mar-09 Dataquest (June 08) IC Insights (June 08) iSuppli (April 08) Semico (June 08) SIA (Jun 08) VLSI Research (Mar 08) WSTS (June 08) Average ASML

DRAM Operating margins of leading DRAM makers recovering (but for most companies still negative) through aggressive shrink and 200 mm retirement Weakening end-user demand could delay expected shortages of DRAM from end 2008 into H1 2009 Consolidation efforts within tier 2 players continuing Continuous price pressure will drive shrink fueling immersion demand Access to capital remains critical Source: ASML Last data point: June 2008 DRAM unit sales compared with year before 0 2 4 6 8 10 12 14 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Source: DRAMeXchange (8/08), ASML MCC DRAM spot and contract prices moving side ways since beginning of 2008 Main DRAM spot & contract prices (01/06 - 2008YTD) 0 1 2 3 4 5 6 7 8 Jan-06 Feb-06 Mar-06 Apr-06 May-06 Jun-06 Jul-06 Aug-06 Sep-06 Oct-06 Nov-06 Dec-06 Jan-07 Feb-07 Mar-07 Apr-07 May-07 Jun-07 Jul-07 Aug-07 Sep-07 Oct-07 Nov-07 Dec-07 Jan-08 Feb-08 Mar-08 Apr-08 May-08 Jun-08 Jul-08 Aug-08 Chip ASP [$US] 300 mm fully- loaded-costs for 6x nm 1 Gb DRAM 300 mm fully- loaded costs for 5x nm 1 Gb DRAM 200 mm cash- costs for 80nm 512 Mb DRAM 300 mm cash- costs for 80nm 512 Mb DRAM 512Mb DDR2 667 SPOT ASP 512Mb DDR2 667 CONTRACT ASP 1Gb DDR2 667 SPOT ASP 1Gb DDR2 667 CONTRACT ASP

DRAM 200 mm capacity retirement accelerated in 2008 due to persistent price pressure Source: ASML estimates Expected DRAM 200 mm capacity retirement (Q1/08-Q4/09) - -160 - -140 - -120 - -100 - -80 - -60 - -40 - -20 0 20 Q1/08 Q2/08 Q3/08 Q4/08 Q1/09 Q2/09 Q3/09 Q4/09 Capacity [200 mm equiv. KWSM]

NAND NAND ASPs keep declining due to lower than forecasted end-user demand However YTD unit growth still above 40% Current chip production costs above market prices resulting in significant losses Overcapacity expected to extend into 2009 Long term NAND application roadmap remains a strong driver for shrink Short term capex funding continues to be an issue for most manufacturers Source: ASML Last data point: June 2008 NAND unit sales compared with year before 0 0.5 1.0 1.5 2.0 2.5 3.0 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 10% 20% 30% 40% 50% 60% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Logic + MPU Logic revenues and profitability is very strong MPU sales recovering from seasonal low Investments expected to recover in 2009, especially for 45 nm, driven by record fab utilizations and additional leading-edge demand Source: ASML Last data point: June 2008 Logic unit sales compared with year before 0 5 10 15 20 25 30 35 40 45 1 2 3 4 5 6 7 8 9 10 11 12 Month Units [B] 0% 2% 4% 6% 8% 10% 12% 14% Growth [%] 2007 Cumm 2008 Cumm Growth YTD YoY-3mma

Agenda HOW IS THE OVERALL MARKET DEVELOPING SHORT-TERM? IS THE CURRENT MARKET ENVIRONMENT COMPROMISING ASML SECULAR GROWTH MODEL?

Litho Market Secular Growth Drives ASML's Growth Chip processing becomes more challenging Average selling price of a system increases (US$ million) Technology leadership brings increased market share ASML's business driven by chip unit sales Chips become more complex Average number of layers per wafer increases with IC complexity The chip industry is growing

Source: ASML, SEMI The secular growth Model: Market share growth ASML Market Share (revenue) 0% 10% 20% 30% 40% 50% 60% '84 '86 '88 '90 '92 '94 '96 '98 '00 '02 '04 '06 Success in Japan Immersion ArF in volume TWINSCAN PAS 5500 Scanner

2008- 2009 : Shrink opportunities for all sectors 10 12 Resolution, "Shrink" (nm) 200 100 80 60 40 Logic DRAM NAND 11 07 09 08 04 06 05 01 03 02 00 ASML Product Introduction XT:1400 XT:1700i AT:1200 AT:850 Double Patterning XT:1900i EUV Immersion EUV DPT Source: ASML May 2008

Market share development A natural "catch up" by our competition on immersion for 55 nm / 45 nm nodes after 1 or 2 years of virtual absence ASML leadership still intact for 2008/2009 in tool throughput, overlay and NA, delivering to customers A cost effective solution for 5X nm / 4X nm nodes A unique capability to extend to 3X nm / 2X nm nodes ASML product leadership to potentially grow with the introduction of An improved TWINSCAN architecture (XT:1950H) A new architecture in 2009 for double patterning Litho+ support package EUV in 2010 ASML cost leadership to be enhanced by Aggressive overall cost structure reductions Expected Euro rate stability or slow depreciation

ASML Vision and Strategy Articulation ASML currently operates within a lithography market which has a potential to double within the next 5 to 10 years. There is significant growth potential for us if we execute Strategy: "Over-execute" in all areas of our business Invest more in R&D to (1) strengthen the lead by introducing new advanced litho products and (2) increase performance regularly on standard products Reduce COGS through continuous redesigns, supply chain partnerships and Asian sourcing Reduce manufacturing cost through cycle time reduction OPEX flex so as to target an income from operations to net sales of 10-15 % at the low end of the business cycle and 20-25% at the high end of the cycle

Conclusions Guidance for lower revenue 2008 (may see - 20% versus 2007) unchanged Uncertainty as to when Litho Capacity build orders would materialize, but 2009 strong immersion growth from NAND 4x nm, DRAM 5x nm and Logic 4x and 3x nm will sustain ASML revenue robustness ASML to maintain technology leadership in order to sustain long term growth

EX-99.3

Exhibit 99.3

ASML Media Relations Contacts

Lucas van Grinsven — Corporate Communications — +31 40 268 3949

ASML Investor Relations Contacts

Craig DeYoung — Investor Relations — +1 480 383 4005

Franki D’Hoore — Investor Relations — +31 40 268 6494

ASML Supervisory Board Nominates Pauline van der Meer Mohr as New Member

VELDHOVEN, the Netherlands, September 12, 2008 — The Supervisory Board of ASML Holding NV (ASML) is pleased to announce it will nominate Mrs. Pauline van der Meer Mohr for appointment as a member of its Board by the Annual General Meeting of Shareholders, which is scheduled to be held on March 26, 2009.

Her candidacy is based on the strengthened recommendation right that ASML’s Works Council has in relation to this nomination and will fill the vacancy due to Rolf Deusinger’s resignation earlier this year.

Mrs. Van der Meer Mohr was Senior Executive Vice President of Human Resources at ABN AMRO. Prior to joining ABN AMRO she was Head of Group Human Resources at TNT and held various senior executive roles at Shell.

ASML is delighted to welcome Mrs. Van der Meer Mohr to the company and is confident ASML will benefit greatly from her extensive experience gained in various industries.

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. ASML has more than 6,750 employees, serving chip manufacturers in more than 60 locations in 16 countries.

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EX-99.4

Exhibit 99.4

ASML Media Relations Contacts

Lucas van Grinsven — Corporate Communications — +31 40 268 3949

ASML Investor Relations Contacts

Craig DeYoung — Investor Relations — +1 480 383 4005

Franki D’Hoore — Investor Relations — +31 40 268 6494

ASML Updates Industry on Significant Progress in EUV Lithography Program; Reveals Roadmap that Extends Semiconductor Manufacturing to 11 Nanometers and Beyond

Lake Tahoe, California, USA, September 30, 2008 — ASML Holding NV (ASML) presents today at the 2008 International Symposium on Extreme Ultraviolet Lithography (EUV) on recent achievements in its EUV lithography program and unveils a production system roadmap that supports cost-effective chip manufacturing to at least 11 nanometers (nm).

The NXE series of lithography machines will be built on an evolved TWINSCAN™ platform. Design of the first production system is complete, the supply chain is fully engaged and system manufacturing has started. ASML currently has orders for five of these systems from Memory and Logic customers on three continents.

“EUV lithography remains the most attractive option for extending Moore’s Law,” stated Martin van den Brink, ASML’s executive vice president of marketing and technology. “As a single-exposure, multi-node technology, EUV offers the greatest extendibility at the lowest cost of ownership.”

NXE production systems are the result of the learning and infrastructure development made possible by ASML EUV Alpha Demo Tools (ADT). In August 2006 ASML shipped the industry’s first full-field EUV exposure tools. One EUV ADT was installed at IMEC in Leuven, Belgium and another at CNSE in Albany, New York, USA.

EUV Technology Milestones

Both IMEC and Albany have EUV development programs being executed on ADT systems with continuously improving performance results.

• The first functional devices made using EUV lithography on full-field chips were published in February 2008.

• The contact layer of a functional 32-nm SRAM cell printed using EUV lithography was demonstrated in July 2008.

• Progress with photoresist development has yielded 28-nm half pitch images using single exposure, conventional illumination, and no OPC (Optical Proximity Correction). OPC is

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a photolithography enhancement technique that modifies the chip design pattern on the mask to compensate for image errors due to diffraction.

• System overlay has been improved to 5 nm, the same distance a human hair grows in 1 second.

• Throughput has seen a ten-fold increase since the ADT systems were first installed.

• The first prototype LPP (Laser Produced Plasma) system is operational and 100W burst power was achieved on schedule. LPP is one method of generating EUV photons for imaging and will be used in the first NXE production systems. Discharge-produced-plasma (DPP) is another method which is currently used in the ASML EUV ADT.

• In addition to critical development work on ADT that enables EUVL for production, critical technology milestones have been reached on hardware for the volume production platform.

About EUV

EUV lithography systems transfer patterns onto silicon wafers by projecting extreme ultra-violet light through a vacuum-contained lens. Today’s most advanced lithography systems use an Argon Fluoride produced laser with a wavelength of 193 nm. EUV photons are produced by exciting a tin-based plasma and have a wavelength of only 13.5 nm. The significant reduction in imaging wavelength is what enables continued shrink of semiconductor devices.

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. ASML has more than 6,750 employees, serving chip manufacturers in more than 60 locations in 16 countries.

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