6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF A FOREIGN ISSUER
PURSUANT TO RULE 13A-16 OR 15D-16
OF THE SECURITIES EXCHANGE ACT OF 1934
For April, 2008

ASML Holding N.V.

De Run 6501
5504 DR Veldhoven
The Netherlands
(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F þ                    Form 40-F o

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes o                    No þ

If “Yes’’ is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

TABLE OF CONTENTS

	Exhibits
	SIGNATURES
EX-99.1
EX-99.2
EX-99.3

Exhibits

99.1 “ASML Discloses Results of Annual General Meeting of Shareholders,” press release dated April 3, 2008

99.2	“ASML Ships 1000th KrF Lithography System; Milestone Confirms KrF Leadership in Productivity and System Extendibility,” press release dated April 22, 2008
99.3	“ASML 2008 First Quarter Results,” presentation dated April 16, 2008

     “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development and customer acceptance of new products, ability to enforce patents and protect intellectual property rights, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML’s Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission.

SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	ASML HOLDING N.V. (Registrant)
Date: May 7, 2008	By:	/s/ Peter T.F.M. Wennink
		Peter T.F.M. Wennink
		Executive Vice President and Chief Financial Officer

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EX-99.1

ASML Media Relations Contacts

Lucas van Grinsven — Corporate Communications – +31 40268 3949

ASML Investor Relations Contacts

Craig DeYoung — Investor Relations – +1 480 383 4005

Franki D’Hoore — Investor Relations – +31 40 268 6494

ASML Discloses Results of Annual General Meeting of Shareholders

VELDHOVEN, the Netherlands, April 3, 2008 — ASML Holding NV (ASML) today announces the results of its Annual General Meeting of Shareholders held on April 3, 2008.

The Annual General Meeting of Shareholders adopted ASML’s statutory financial statements for the year ended December 31, 2007.

In addition, the General Meeting of Shareholders approved the following items:

• Discharge of the members of the Board of Management and the Supervisory Board from liability for their responsibilities in the financial year 2007.

• Preparation of Regulated Information in the English language.

• Proposal to adopt a 2007 dividend of EUR 0.25 per ordinary share of EUR 0.09. Payment date will be May 14, 2008.

• Updated Remuneration Policy (version 2008) for the Board of Management.

• Performance stock arrangement, including the number of shares, for the Board of Management.

• Number of stock options for Board of Management and the number of stock options, respectively shares, for employees.

• Re-appointment of Messrs. A.P.M. van der Poel and F.W. Fröhlich as members of the Supervisory Board, effective April 3, 2008.

• Proposal to authorize the Board of Management for a period of 18 months from April 3, 2008: (i) to issue shares or rights to subscribe for shares in the capital of the Company, limited to 5 percent of the issued share capital of the Company at the time of the authorization; (ii) to issue an additional 5 percent of the issued share capital only in connection with mergers and/or acquisitions; and (iii) to authorize the Board of Management to restrict or exclude the pre-emption rights in connection with any such issuance, all subject to the approval of the Supervisory Board.

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• Proposal to extend the existing authority of the Board of Management to acquire through October 3, 2009 a maximum of 30% of ASML’s outstanding share capital subject to the approval of the Supervisory Board. The shares can be acquired at a price between the nominal value of the shares acquired and 110 percent of the average market price for these securities on Euronext Amsterdam or Nasdaq Global Select Market. The AGM also authorized the cancellation of up to 20% of the outstanding share capital of ASML [as of April 3, 2008].

The following subjects were also discussed at the General Meeting of Shareholders:

• The Company’s business and financial situation.

• Evaluation of the performance of the External Auditor.

• ASML’s reserves and dividend policy. ASML has grown to become an efficient, cash generative company in the semiconductor industry, and this will now be reflected by regular dividend payments. However, share buybacks will remain a preferred way to return cash to ASML’s shareholders, as they deliver great long term value and allow ASML to be flexible with opportunities to reward our investors. ASML reiterated its commitment to return cash to shareholders when gross cash is above a target of between EUR 1.0 billion and EUR 1.5 billion.

• The intended re-appointment of Mr. E. Meurice.

• The composition of ASML’s Supervisory Board in 2008. Ms. H.C.J. van den Burg, Mr. O. Bilous, Mr. J.A. Dekker and Mr. J.W.B. Westerburgen will retire by rotation in 2009. Mr. J.A. Dekker will not be available for re-appointment because of the fulfillment of his twelve year term.

Presentation materials and a recording of the audiocast of the 2008 Annual General Meeting of Shareholders are available at ASML.com.

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. ASML has more than 6,500 employees, serving chip manufacturers in more than 60 locations in 16 countries.

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EX-99.2

ASML Media Relations Contacts

Lucas van Grinsven — Corporate Communications – +31 40268 3949

ASML Investor Relations Contacts

Craig DeYoung — Investor Relations – +1 480 383 4005

Franki D’Hoore — Investor Relations – +31 40 268 6494

ASML Ships 1000th KrF Lithography System; Milestone Confirms KrF Leadership in Productivity and System Extendibility

VELDHOVEN, the Netherlands, April 22, 2008 — ASML Holding NV (ASML) today announces that it has shipped its 1000th KrF lithography system. This milestone shipment to a South Korean customer highlights the proven performance of ASML’s KrF technology for affordable and highly productive lithography in semiconductor manufacturing. As proof of its commitment to lithography value-of-ownership, ASML has increased scanner throughput by approximately 10 percent every year to a level of 150 wafers per hour today (300mm diameter). Later this year, KrF systems will be able to process 165 wafers per hour, and this trend will continue in the years to come. In parallel, productivity enhancement packages (PEPs) are made available to retroactively enhance the productivity of the scanner installed base.

KrF-based lithography is used to process an average of 30 percent of the layers in 65-nanometer (nm) node computer chips. That number increases to around 40 percent as chipmakers move to the 45-nm node, according to ASML data.

World leader in productivity

The 1000th KrF system will be used for the production of memory chips where productivity and total cost of ownership of lithography systems play key roles in generating competitive products.

• One customer exposed a record of 3,603 wafers (300mm) in a single day on one of its ASML KrF systems.

• Four KrF scanners from ASML have processed more than 1 million wafers in a single year, setting new productivity records.

• A total of 82 semiconductor manufacturers worldwide are using ASML’s KrF lithography systems.

• The combined installed base of ASML KrF scanners (TWINSCANTM and PAS 5500) processes more than 1.1 million wafers per day.

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Maximum extendibility

ASML offers semiconductor manufacturers an extensive roadmap for further improvements to extend the success of KrF, including the introduction of the TWINSCAN XT:1000 with the ultimate dry numerical aperture of 0.93, and further overlay and throughput enhancements. With the industry’s highest numerical aperture for a KrF system, the TWINSCAN XT:1000 will offer a resolution of 80nm. This will enable manufacturers to process more mid-critical layers on KrF, delivering cost-per-layer savings of 30 percent or more over ArF production.

KrF systems are forecast by industry analysts to gain in importance over coming years. “Non-critical i-Line layers are gradually shifting into the KrF resolution domain and more and more implants, typically exposed with KrF, are needed to tune transistor performance. Being able to process many mid-critical semiconductor layers with KrF systems offers chip manufacturers the opportunity to control their cost and ultimately deliver more value to electronics producers and consumers. We expect worldwide KrF demand to rise over the coming years, growing easily by double-digit rates and reaching close to 300 scanner shipment levels by 2012,” said G. Dan Hutcheson, CEO of market research firm VLSI Research Inc.

“The success of the semiconductor industry is built on the principle of continuous cost reduction to make computing power and memory more affordable and easy to use, and this is especially relevant in today’s competitive environment. Our customers need to reduce the cost per layer, and ASML’s continuous KrF system improvements help them to achieve this goal,” said Bert Koek, general manager of 300-mm business at ASML.

About KrF and ArF

KrF and ArF refer to the types of laser light sources used to project electrical circuit patterns onto a silicon wafer. The light from a KrF, or krypton fluoride source has a wavelength of 248nm, which ASML manipulates to print circuit features below 100nm. ArF, or argon fluoride induced light sources have a 193nm wavelength, which is currently able to print features as small as 38nm — a nanometer is one millionth of a millimeter. Chip makers use both types of systems in the production process of a single chip. A typical chip consists of up to 30 or 40 layers. ArF and KrF systems are used to image the critical layers (smallest features) and mid-critical layers (slightly larger features, about 250nm down to 90nm), respectively. Remaining (non-critical, larger than about 250nm) features are imaged using an i-Line light source with a wavelength of 365nm.

About TWINSCAN productivity

Equipment depreciation amounts to about half the lithography layer cost for ArF and KrF, and over 70 percent for i-Line. By spreading these fixed costs over more wafers, higher productivity reduces individual wafer cost and improves return on investment. ASML’s TWINSCAN systems expose one wafer while already performing the necessary metrology measurements on the next. As a result, ASML’s latest TWINSCAN systems offer throughputs up to 165 300-mm wafers per hour (wph).

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About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. ASML has more than 6,500 employees, serving chip manufacturers in more than 60 locations in 16 countries.

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EX-99.3

ASML 2008 First Quarter Results ASML continues to execute its leadership strategy and expects gradual order pick-up April 16, 2008

Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward- looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development and customer acceptance of new products, ability to enforce patents and protect intellectual property rights, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the US Securities and Exchange Commission.

ASML - the world's largest supplier of lithography equipment Source: Semi & ASML Leadership in immersion for volume chip manufacturing ASML Canon Nikon East 65 11 24 West North Canon 11% ASML 65% Nikon 24% ASML AMAT TELL KLA East 22 32 25 11 10 West North KLA Tencor ASML Tokyo Electron Lam Research Applied Materials 2003 2004 2005 2006 2007 Q1 1543 2465 2529 3597 3768 Revenue evolution Top 5 semiconductor equipment suppliers Market share 2007

Agenda Market Business summary Outlook

Market

Market in general Global economic weakness drives slowdown of overall 2008 semiconductor capex forecast by analysts and customers DRAM makers reduce capacity plan and are driving prices of memory chips up Two Flash makers delay new factories, flash prices continue to be weak Customer factory utilization rates remain high Independent market researchers are uncertain about semiconductor growth rates

Industry analyst 2008 memory forecasts Source: ASML MCC 1Q 07 2Q 07 3Q 07 4Q 07 1Q 08 Gartner 31 18 20 21 IC Insights 15 15 18 18 8 VLSIR 12 14 14 14.5 14.5 1Q 07 2Q 07 3Q 07 4Q 07 1Q 08 Gartner 49 51 52 40 IC Insights 33 33 20 20 35 VLSIR 28 29 29 28 27.5 Unit Growth Time of Forecast DRAM Unit Growth NAND Unit Growth Gartner IC Insights VLSIR

ASML affected by changing market environment Recent capacity delay decisions by one DRAM factory expansion and two new Flash factories Rationalization efforts amongst Taiwanese DRAM players ongoing Overall economic growth uncertainty delaying capex decisions for Foundries Demand for immersion tools remain strong

ASML's assessment of 2008 worldwide lithography demand March 2008 ASML shipped 260 machines in 2007 with ASP of &128; 12.9 million ASML expects market share gains and substantial ASP growth in 2008 Numbers include new and used equipment Source: ASML April 2008 April 2008

ASML technology leader

Source: ASML Immersion technology used in volume production for 55 nm resolution and beyond ASML immersion installed base 86 tools 25 in the US 53 in ASIA, (16 in Japan) 8 in Europe

Immersion: Fastest technology transition to date 0 1 2 3 4 5 6 7 Jan '05 Mar '05 May '05 Jul '05 Sep '05 Nov '05 Jan '06 Mar '06 May '06 Jul '06 Sep '06 Nov '06 Jan '07 Mar '07 May '07 Jul '07 Sep '07 Nov '07 Jan '08 # wafers exposed on ASML immersion systems (millions) XT:1700i 1st shipment XT:1400i 1st shipment XT:1900i 1st shipment Volume production 8 Source: IEEE 2007, Toshiba Day 1 Day 2 Day 3 Day 4 Day 5 Day 6 Day 7 Peak East 2200 2100 2150 2125 2075 1950 2200 2750 >2750 9

Next generation lithography: EUV Prototypes shipped in 2006 Pilot production machine to ship in early 2010 Albany Leuven

The world's first chips using full-field EUV SRAM cell and full working transistor showed in February 2008 Alpha Demo Tool EUV print 15 GB 3D thick mask panoramic simulation Reference 193 nm print of SRAM bit cell RHEM XP4502J Sample NMOS transistor curve from EUV wafer 0 0 0 0 0 0 0 0 0 0 1 1 1 1 Vg log(Id) Albany Alliance EUV Program RHEM XP4502J Full size AMD Typhoon1 33 mm 22 mm Full size AMD Typhoon1 33 mm 22 mm

Business summary

Q1 results 8th consecutive quarter with sales over &128; 900 million Solid operating margin of 20.5% Cash generation &128; 263 million from operations Backlog at &128;1,167 million, 65 systems Booked 26 systems Shipped 14 immersion tools Record average selling price for new shipped systems of &128; 18.7 million

2003 2004 2005 2006 2007* 2008 Q1 318 453 685 629 949 919 Q2 329 616 763 942 930 Q3 370 611 533 958 934 Q4 526 785 548 1068 955 Total net sales M&128; 1,543 2,465 2,529 3,597 3,768 *2007 numbers are adjusted retrospectively with respect to the change in accounting policy.

Net sales breakdown in value: Q1 2008 Memory Foundry IDM R&D East 64 13 23 5 West North End-use Foundry 13% Memory 64% IDM 23% Numbers have been rounded for readers' convenience Technology KrF ArF dry ArF immersion I line East 14 32 51 3 West North KrF 14% i-Line 3% ArF immersion 51% ArF dry 32% ROW U.S.A Europe Taiwan Korea China Japan ROW Stp 24 7 15 32 14 7 1 West North USA 24% Taiwan 15% Korea 32% Japan 7% Europe 7% China 14% ArF immersion ArF dry KrF i-Line Q1 14 14 13 9 Sales in Units Region Other 1%

* 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been rounded for readers' convenience. Consolidated statement of operations M&128;

Key financial trends 2007 - 2008 Consolidated statement of operations M&128; * 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been rounded for readers' convenience.

Cash flow M&128; * 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been rounded for readers' convenience.

Balance sheet as of March 30th, 2008 M&128; * 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been rounded for readers' convenience.

77% of backlog or &128; 896 million system sales carry Q2 + Q3 shipment dates Q1 net bookings of 26 systems with a value of &128; 312 million including 17 new tools with an ASP of &128; 15.7 million Note: Due to possible customer changes in delivery schedules and to cancellation of orders, our backlog at any particular date is not necessarily indicative of actual sales for any succeeding period Numbers have been rounded for readers' convenience Backlog as of March 30th, 2008

Backlog: value and litho units Backlog Jan 03 39541 Jul 03 Oct 03 Jan 04 Apr 04 Jul 04 Oct 04 Jan 05 Apr 05 Jul 05 Oct 05 Jan 06 Apr 06 Jul 06 Oct 06 Jan 07 Apr 07 Jul 07 Oct 07 Jan 08 Apr 08 Backlog value 1030 870 678 859 993 1357 1800 2053 1691 1377 987 1245 1434 1596 1830 2126 2146 2163 1745 1769 1697 1167 Systems 103 93 62 91 124 163 174 183 131 107 80 87 95 106 127 151 163 148 109 90 89 65 Backlog units

Backlog lithography in value per March 30th, 2008 Total value M&128; 1,167 Technology i-Line 3% ArF immersion 57% KrF 9% ArF dry 31% Region USA 20% Taiwan 13% Korea 30% Other 6% Europe 13% Japan 9% China 9% End-use Memory 56% IDM 30% Foundry 14% Numbers have been rounded for readers' convenience

Outlook

Q2 2008 outlook ASML expects to ship 42 systems ASP for new + refurbished systems expected to be &128; 17.0 million Gross margin approximately 40% R&D is expected at &128; 130 million net of credit SG&A is expected at &128; 58 million Given current market weakness, we are trimming Manufacturing and SG&A variable costs for 2008 second half while keeping R&D stable

Outlook Order pattern translates into weaker net sales for next 2 quarters bringing our current full year sales estimate to about 10% less than our record sales number in 2007 We expect gradual unit order pick-up from Q2 onwards, due to: Improvements in memory supply/demand balance Volume production ramps of 45nm node Flash memory to start in H2 2008 ASML 's market share gains Due to advanced technology tool mix, Q2 bookings value increase will be significant