6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF A FOREIGN ISSUER
PURSUANT TO RULE 13A-16 OR 15D-16
OF THE SECURITIES EXCHANGE ACT OF 1934

For October 5, 2010

ASML Holding N.V.

De Run 6501
5504 DR Veldhoven
The Netherlands
(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F þ          Form 40-F o

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes o          No þ

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b):

TABLE OF CONTENTS

Ex-99.1

Exhibits

99.1 “ASML and Brion Unveil Software that will Optimize EUV Manufacturing of the Most Advanced Chips,” press release dated September 14, 2010

“Safe Harbor” Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average selling price, gross margin and expenses. These forward looking statements are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), including the impact of general economic conditions on consumer confidence and demand for our customers’ products, competitive products and pricing, the impact of manufacturing efficiencies and capacity constraints, the pace of new product development and customer acceptance of new products, our ability to enforce patents and protect intellectual property rights, the risk of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, changes in exchange rates and other risks indicated in the risk factors included in ASML’s Annual Report on Form 20-F and other filings with the US Securities and Exchange Commission.

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     SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	ASML HOLDING N.V. (Registrant)
Date: October 5, 2010	By:	/s/ Peter T.F.M. Wennink
		Peter T.F.M. Wennink
		Executive Vice President and Chief Financial Officer

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EX-99.1

Exhibit 99.1

Media Relations Contacts
Lucas van Grinsven — Corporate Communications — +31 40 268 3949 — Veldhoven, the Netherlands
Ryan Young — Communication US — +1 480 383 4733 — Tempe, Arizona, USA

Investor Relations Contacts
Craig DeYoung — Investor Relations — +1 480 383 4005 — Tempe, Arizona, USA
Franki D’Hoore — Investor Relations — +31 40 268 6494 — Veldhoven, the Netherlands

ASML and Brion Unveil Software that will Optimize EUV Manufacturing of the Most Advanced Chips

Monterey, Calif., September 14, 2010 — Next generation semiconductor production will be facilitated by a new product introduced today by Brion Technologies, a division of ASML. Brion’s new Tachyon NXE provides accurate predictive modeling specifically for ASML Extreme Ultraviolet (EUV) scanners, the upcoming technology for the chip industry which will enable smaller, faster, cheaper and more energy-efficient semiconductors. The accurate EUV modeling in Tachyon NXE will reduce both the development time and cost to produce chips on EUV systems.

The Tachyon NXE software package seamlessly integrates with existing Tachyon products to enable the simulation of the EUV lithography process. In developing Tachyon NXE, Brion has incorporated TWINSCAN NXE:3100 scanner characteristics, models, and data to accurately describe the optical performance of the system. By simulating the behavior of the new scanner in software, this Tachyon NXE model can efficiently predict and correct NXE-specific effects before the start of chip production, helping to decrease EUV mask re-spins and shorten the learning cycles during final mask development.

The Optical Proximity Correction (Tachyon OPC+) and Lithography Manufacturability Check (Tachyon LMC) applications from Brion can now incorporate the new software model of ASML’s EUV pre-production scanners, six of which will ship before mid-2011. These applications have been optimized for accuracy, file size and run-time as uniquely required by EUV. In multiple DRAM test cases, Brion has demonstrated the capability to perform full field (~8 cm2) EUV mask data correction in less than 8 hours on a single Tachyon system.

“Tachyon NXE is the result of a multi-year investment by ASML and Brion to accurately model the performance of NXE scanners,” said Jim Koonmen, general manager of Brion. “The industry transition to EUV will require a significant learning curve. ASML and Brion are uniquely positioned to help reduce the duration and cost of that curve through Tachyon NXE.”

ASML and Brion are committed to providing widespread access to the accurate NXE:3100 and NXE:3300 scanner models and to continuously improve the entire lithographic process for chipmakers. Therefore, Brion will continue to invest in Tachyon NXE in order to continuously improve its capabilities, while also developing a separate product that will enable customer access to NXE-specific effects within a broad range of simulation tools. This second product will be available in the near future.

About Computational Lithography

Computational lithography is the use of computer modeling to predict, correct, optimize and verify imaging performance of the lithography process over a range of patterns, processes, and system conditions.

About EUV

EUV is a new lithographic method using a source wavelength 15 times shorter than current lithography systems, enabling semiconductor scaling to resolutions of 10 nanometers (nm) and smaller. EUV, the leading candidate for manufacturing advanced semiconductors at the 22nm technology generation and beyond, will support Moore’s Law — the trend towards more powerful, energy-efficient yet affordable chips — for at least another 10 years.

About Brion Technologies

Brion Technologies is a division of ASML and an industry leader in computational lithography for integrated circuits. Brion’s TachyonTM platform enables capabilities that address chip design, photomask making and wafer printing for semiconductor manufacturing. Brion is headquartered in Santa Clara, California. For more information: www.brion.com

About ASML

ASML is the world’s leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. ASML provides systems and service to chip manufacturers at more than 60 locations in 15 countries.