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Memory IC Product End-of-Life	6 Months Ended
Jun. 30, 2024
Memory IC Product End-of-Life [Abstract]
Memory IC Product End-of-Life	Note 12. Memory IC Product End-of-Life Taiwan Semiconductor Manufacturing Corporation (TSMC) is the sole foundry that manufactures the wafers used to produce the Company’s memory IC products. TSMC has informed the Company that TSMC is discontinuing the foundry process used to produce wafers, in turn, necessary to manufacture the Company’s memory ICs. As a result, in May 2023, the Company informed its customers that the Company would be initiating an end-of-life (EOL) of its memory IC products. As of June 30, 2024, the Company had a non-cancelable purchase order backlog for its memory IC products of approximately $9.1 million. The Company expects to fulfill this backlog and complete final shipments of its memory IC products by March 31, 2025.

Memory IC Product End-of-Life

6 Months Ended

Jun. 30, 2024

Memory IC Product End-of-Life [Abstract]

Note 12. Memory IC Product End-of-Life

Taiwan Semiconductor Manufacturing Corporation (TSMC) is the sole foundry that manufactures the wafers used to produce the Company’s memory IC products. TSMC has informed the Company that TSMC is discontinuing the foundry process used to produce wafers, in turn, necessary to manufacture the Company’s memory ICs. As a result, in May 2023, the Company informed its customers that the Company would be initiating an end-of-life (EOL) of its memory IC products. As of June 30, 2024, the Company had a non-cancelable purchase order backlog for its memory IC products of approximately $9.1 million. The Company expects to fulfill this backlog and complete final shipments of its memory IC products by March 31, 2025.