Receivables
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Feb. 28, 2013
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Disclosure Text Block [Abstract] | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Receivables | Receivables
As of February 28, 2013 and August 30, 2012, related party receivables included $39 million and $62 million, respectively, due from Aptina primarily for sales of image sensors under a wafer supply agreement. (See "Equity Method Investments" note.) As of February 28, 2013 and August 30, 2012, other receivables included $2 million and $63 million, respectively, from our currency hedges. As of February 28, 2013 and August 30, 2012, other receivables included $39 million and $34 million, respectively, due from Intel for amounts related to NAND Flash and certain emerging memory technologies product design and process development activities under cost-sharing agreements. As of August 30, 2012, other receivables also included $17 million due from Nanya for amounts related to DRAM product design and process development activities under a cost-sharing agreement. (See "Derivative Financial Instruments," "Consolidated Variable Interest Entities" and "Equity Method Investments" notes.) |