-----BEGIN PRIVACY-ENHANCED MESSAGE----- Proc-Type: 2001,MIC-CLEAR Originator-Name: webmaster@www.sec.gov Originator-Key-Asymmetric: MFgwCgYEVQgBAQICAf8DSgAwRwJAW2sNKK9AVtBzYZmr6aGjlWyK3XmZv3dTINen TWSM7vrzLADbmYQaionwg5sDW3P6oaM5D3tdezXMm7z1T+B+twIDAQAB MIC-Info: RSA-MD5,RSA, T+Ul+OCW2vJuJOCKz9cwgabNnjW9C+r0wE+bGD2iasOvEORtaLmI36r06Oy3m0lt yfONg0c83fAEJgDzo9iNfA== 0000950136-03-002520.txt : 20031009 0000950136-03-002520.hdr.sgml : 20031009 20031009162851 ACCESSION NUMBER: 0000950136-03-002520 CONFORMED SUBMISSION TYPE: 8-K PUBLIC DOCUMENT COUNT: 2 CONFORMED PERIOD OF REPORT: 20031008 ITEM INFORMATION: Other events ITEM INFORMATION: Financial statements and exhibits FILED AS OF DATE: 20031009 FILER: COMPANY DATA: COMPANY CONFORMED NAME: MERRIMAC INDUSTRIES INC CENTRAL INDEX KEY: 0000706864 STANDARD INDUSTRIAL CLASSIFICATION: RADIO & TV BROADCASTING & COMMUNICATIONS EQUIPMENT [3663] IRS NUMBER: 221642321 STATE OF INCORPORATION: DE FISCAL YEAR END: 0102 FILING VALUES: FORM TYPE: 8-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-09970 FILM NUMBER: 03935229 BUSINESS ADDRESS: STREET 1: 41 FAIRFIELD PL CITY: W CALDWELL STATE: NJ ZIP: 07006-0986 BUSINESS PHONE: 9735751300 MAIL ADDRESS: STREET 1: 41 FAIRFIELD PLACE CITY: WEST CALDWELL STATE: NJ ZIP: 07007-0986 8-K 1 file001.txt FORM 8-K UNITED STATES SECURITIES AND EXCHANGE COMMISSION WASHINGTON, D.C. 20549 FORM 8-K CURRENT REPORT Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934 Date of Report (Date of earliest event reported): October 8, 2003 --------------- MERRIMAC INDUSTRIES, INC. ------------------------- (Exact name of registrant as specified in its charter) Delaware 0-11201 22-1642321 -------- ------- ---------- (State of incorporation) (Commission File Number) (IRS Employer Identification Number) 41 Fairfield Place, West Caldwell, New Jersey 07006 --------------------------------------------- ----- (Address of Principal Executive Offices) (Zip Code) Registrant's telephone number, including area code: (973) 575-1300 -------------- Item 5. Other Events and Required FD Disclosure. Reference is hereby made to the press release of Merrimac Industries, Inc. dated October 8, 2003, which is attached hereto as Exhibit 99.1 and incorporated herein by reference. ITEM 7. Financial Statements, Pro Forma Financial Information And Exhibits. (c) Exhibits. 99.1 Press release dated October 8, 2003 issued by Merrimac Industries, Inc., announcing the completion of refinancing. SIGNATURE Pursuant to the requirements of the Securities Exchange Act of 1934, as amended, the Registrant has duly caused this Report to be signed on its behalf by the undersigned hereunto duly authorized. Dated October 9, 2003 MERRIMAC INDUSTRIES, INC. By: /s/ Robert V. Condon ----------------------------------- Name: Robert V. Condon Title: Vice President, Finance and Chief Financial Officer EX-99.1 3 file002.txt PRESS RELEASE Exhibit 99.1 FOR IMMEDIATE RELEASE - --------------------- CONTACT: Mason N. Carter, Chairman & CEO 973-575-1300, ext. 1202 mnc@merrimacind.com MERRIMAC COMPLETES REFINANCING WEST CALDWELL, N.J. OCTOBER 8, 2003: Merrimac Industries, Inc. (AMEX: MRM) today announced the refinancing of its revolving credit, term loan and letter of credit facility with CIT Business Credit, a unit of CIT Group Inc (NYSE:CIT). The refunding, which replaces a similar facility with another lender, represents a three-year secured revolving credit, term loan and letter of credit facility for $9,250,000. ABOUT MERRIMAC Merrimac Industries, Inc. is a leader in the design and manufacture of Multi-Mix PICO(TM) RF Microwave components, assemblies and micro-multifunction modules (MMFM(R)), serving the wireless telecommunications industry worldwide with enabling technologies for space, defense and commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions(R) with Multi-Mix(R) Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration. The Multi-Mix(R) process for microwave, multilayer integrated MMFM(R) circuitry is a patented method developed by Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated-through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries facilities are registered under ISO 9000, an internationally developed set of quality criteria for manufacturing operations. Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., are located in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, have approximately 210 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated Packaging Solutions(R) for wireless applications. Merrimac (MRM) is listed on the American Stock Exchange. Multi-Mix(R), Multi-Mix PICO(TM), MMFM(R) and Total Integrated Packaging Solutions(R) are trademarks of Merrimac Industries, Inc. For more information about Merrimac Industries, Inc. and Filtran Microcircuits Inc., please visit http://www.merrimacind.com and http://www.filtranmicro.com. -----END PRIVACY-ENHANCED MESSAGE-----