6-K

FORM 6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

REPORT OF FOREIGN PRIVATE ISSUER

Pursuant to Rule 13a-16 or 15d-16

of the Securities Exchange Act of 1934

For the month of July, 2012

Commission File Number 000- 13355

ASM INTERNATIONAL N.V.

(Translation of registrant’s name into English)

VERSTERKERSTRAAT 8

1322 AP ALMERE

THE NETHERLANDS

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x    Form 40-F  ¨

Indicate by check mark if the registrant is submitting the form 6-K in paper as permitted by Regulation S-T Rule 101(b)(l):  ¨

Note: Regulation S-T Rule 101(b)(1) only permits the submission in paper of a Form 6-K if submitted solely to provide an attached annual report to security holders.

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule l0l(b)(7):  ¨

Note: Regulation S-T Rule l0l(b)(7) only permits the submission in paper of a Form 6-K if submitted to furnish a report or other document that the registrant foreign private issuer must furnish and make public under the laws of the jurisdiction in which the registrant is incorporated, domiciled or legally organized (the registrant’s “home country”), or under the rules of the home country exchange on which the registrant’s securities are traded, as long as the report or other document is not a press release, is not required to be and had not been distributed to the registrant’s security holders, and, if discussing a material event, has already been the subject of a Form 6-K submission or other Commission filing on EDGAR.

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule l2g3-2(b) under the Securities Exchange Act of 1934.    Yes  ¨    No  x

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82-                    .

Exhibits
Exhibit 99.1	ASM International N.V. introduces New High Productivity Epitaxy, PEALD and PECVD Systems

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

Dated: July 12, 2012	ASM INTERNATIONAL N.V.
		/S/    HANS ZWEERS
		Hans Zweers
		Director Accounting and External Reporting

ASM INTERNATIONAL N.V.

(THE “REGISTRANT”)

(COMMISSION FILE NO. 0-13355)

EXHIBIT INDEX

TO

FORM 6-K

DATED July 12, 2012

Exhibit No.	Exhibit Description	Filed Herewith
99.1	ASM International N.V. introduces New High Productivity Epitaxy, PEALD and PECVD Systems		X

EX-99.1

Exhibit 99.1

ASM International N.V. introduces New High Productivity Epitaxy,

PEALD and PECVD Systems

ALMERE, The Netherlands - July 10, 2012 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM), today launched two new advanced deposition systems. The new systems deliver industry-leading process performance for epitaxy, plasma enhanced atomic layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD), targeting 300 mm high volume manufacturing (HVM).

First, the company introduced the Intrepid^™ XP, a single wafer Epi process tool that can be configured with up to four epitaxy reactor modules. The Intrepid^™ XP deposits advanced strained silicon based Epi films that are used to lower power consumption in CMOS transistors at 20nm and beyond.

“Intrepid^™  combines our advanced and proprietary transistor Epi technology that we have been developing in recent years, with ASM’s multi-chamber XP platform. We have improved every aspect of ASM’s pioneering Epi equipment and created a tool extendible to future 3D transistor technologies” said Peo Hansson, General Manager of ASM’s Thermal Products Business Unit.

Second, ASM also introduced its XP8 system, a high productivity single wafer process tool, for both PEALD and PECVD applications. XP8 accommodates up to 8 chambers for PEALD or PECVD, which can also be integrated together on the same platform.

“As more layers require the control and conformality of PEALD, as well as the high throughput of PECVD, the high productivity of the XP8 is critical to ensure our customers maintain acceptable cost per wafer,” said Tominori Yoshida, general manager of ASM’s Plasma Products Business Unit.

PEALD and PECVD chambers can be clustered on the XP8 to target double and quadruple patterning spacers, low-k, and other applications.

“ASM has been recognized for bringing to market innovative process technologies that drive next-

generation devices,” said Chuck del Prado, President and Chief Executive Officer of ASM International. “At the same time, manufacturability and productivity are key requirements for wide-scale adoption of these process innovations. The new systems released on our XP and XP8 platforms complement our leadership in process performance with high productivity.”

About ASM

ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International’s common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI’s web site at www.asm.com.

# # #

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company’s reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

ASM International:

Erik Kamerbeek

Investor Relations

+31 88 100 8500

Erik.Kamerbeek@asm.com

Mary Jo Dieckhaus

Investor Relations

+1 212 986 2900

MaryJo.Dieckhaus@asm.com

Media Contact:

Ian Bickerton

+31 20 6855 955

+31 625 018 512