6-K

FORM 6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

REPORT OF FOREIGN PRIVATE ISSUER

Pursuant to Rule 13a-16 or 15d-16

of the Securities Exchange Act of 1934

For the month of April, 2008

Commission File Number 000-13355

ASM INTERNATIONAL N.V.

(Translation of registrant’s name into English)

JAN VAN EYCKLAAN 10

3723 BC BILTHOVEN

THE NETHERLANDS

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x    Form 40-F  ¨

Indicate by check mark if the registrant is submitting the form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1):  ¨

Note: Regulation S-T Rule 101(b)(1) only permits the submission in paper of a Form 6-K if submitted solely to provide an attached annual report to security holders.

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7):  ¨

Note: Regulation S-T Rule 101(b)(7) only permits the submission in paper of a Form 6-K if submitted to furnish a report or other document that the registrant foreign private issuer must furnish and make public under the laws of the jurisdiction in which the registrant is incorporated, domiciled or legally organized (the registrant’s “home country”), or under the rules of the home country exchange on which the registrant’s securities are traded, as long as the report or other document is not a press release, is not required to be and had not been distributed to the registrant’s security holders, and, if discussing a material event, has already been the subject of a Form 6-K submission or other Commission filing on EDGAR.

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.    Yes  ¨    No  x

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82-                     .

Exhibits
Exhibit 99.1	ASM International N.V. to exit RTP.
Exhibit 99.2	ASMI announces its Roadmap to Front-end Peer Group Profitability.
Exhibit 99.3	Presentation Roadmap to Front-end Peer Group Profitability.

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

Dated: April 30, 2008	ASM INTERNATIONAL N.V.
		/s/    ARNOLD J.M. VAN DER VEN
		Arnold J.M. van der Ven
		Managing Director and Chief Financial Officer

ASM INTERNATIONAL N.V.

(THE “REGISTRANT”)

(COMMISSION FILE NO. 0-13355)

EXHIBIT INDEX

TO

FORM 6-K

DATED April 30, 2008

Exhibit No.	Exhibit Description	Filed Herewith
99.1	ASM International N.V. to exit RTP.	X
99.2	ASMI announces its Roadmap to Front-end Peer Group Profitability.	X
99.3	Presentation Roadmap to Front-end Peer Group Profitability.	X

EX-99.1

Exhibit 99.1

ASM International N.V. to Exit RTP

BILTHOVEN, the Netherlands, April 28, 2008 – ASM International N.V. (Nasdaq: ASMI and Euronext Amsterdam: ASM) announced today that it will exit the rapid thermal processing (RTP) market in 2008. Conditions for exiting this business will be determined in the coming quarters. The Company said that any decision will ensure continued service and support to its existing customer base. For continued support and service of our customers ASMI prefers a transfer of the product to a 3^rd party taking over all commitments. Additionally, the Company said that the exit plan will ensure that its 2009 front-end P&L and operating results will definitely not be impacted anymore by the RTP Product Line.

The intended exit from RTP is part of ASMI’s program to further streamline its wafer processing product portfolio and to focus on front-end operations’ sustained profitability. Chuck del Prado, President and Chief Executive Officer of ASM International, stated, “Although we have always believed in the exceptional breakthrough technology of our Levitor^® RTP systems, as have several leading-edge customers, we have decided to really focus on ASMI’s core strengths in the front end growth areas of ALD technology (both thermal and plasma enhanced, in batch and single wafer), PE-CVD, single wafer Epitaxy, and thermal/LPCVD batch processing”.

About RTP

ASMI’s Levitor RTP is a rapid thermal processing system employing a floating wafer concept that provides uniform, emissivity-independent heating for 200mm and 300mm wafers. The unparalleled temperature uniformity can result in improved yield on sensitive, nano-scale devices. ASMI’s RTP operations are located in Almere, the Netherlands.

About ASM

ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International’s common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI’s web site at www.asm.com.

# # #

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics

and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company’s reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

Contact:	Erik Kamerbeek –	+31 30 229 8500
	Mary Jo Dieckhaus –	+1 212 986 2900

EX-99.2

Exhibit 99.2

ASMI announces its Roadmap to Front-end Peer Group Profitability

A comprehensive operating plan combined with organisational changes to increase

focus on Front-end profitability and create shareholder value

Bilthoven, the Netherlands, April 28, 2008 — ASM International N.V. (NASDAQ: ASMI and Euronext Amsterdam: ASM) today announced details of its plan to achieve operating profit margins for its Front-end business in line with its peer group in 2009.

The company also announced a significant change to the organisational structure of the Front-end business.

Highlights of the Roadmap

Financial

Strong management commitment to reach peer profitability in 2009

• Revenue growth above market growth

• Expand operating profit margins of the Front-end business to 11-13% in 2009, from 3.4% in 2007

• Increase cash generation by reducing relative working capital by €30m from 2007 to the end of 2009 and limiting total net capex to €30-35m for the combined period 2008 and 2009

As part of its preliminary 2008 first quarter results for the Front-end, the company announced an improved net earnings break-even level of around €90m amid challenging markets vs. €110m on average in 2007, an indication that initiatives introduced in 2007 are starting to yield results.

For 2010 and beyond ASMI expects to continue to outgrow the market and to achieve operating profit margins at the top half level of its peer group.

Organisation and Operations

• Create a truly global organisation with focus on commercialisation of our strong product portfolio

• Appoint VP Global Sales and Service, VP Global Operations and VP Front-end Products

• Review incentive structure and alignment with the new organisational structure

• Continue FEMS, global sourcing initiative and production platform reduction to further improve gross margin

• Divest RTP and NP product lines

• Close head office in Bilthoven and move to Almere

1

Mr Chuck del Prado, chief executive, commented:

“The plans we have announced today are ambitious, but also deliverable. They build on the significant investments we made in our Front-end product lines in the first half of this decade and the progress made over the past two years to improve profitability and represent an acceleration of the ambitions of ASMI. We recognize that the profitability of our Front-end business needs further improvement. We are committed to change and have made hard choices to further accelerate the commercialisation of our Front-end business. We believe our technology leadership and strong market positions ideally position our Front-end business to deliver superior growth.

In the Front-end business we continue to make good progress decreasing cost levels and improving profitability, despite the challenging operating environment. The changes we are making to the focus, organisation and culture of the company will propel growth and transform the cost structure of the Front-end business and pay further benefits when market conditions start to improve,

As new CEO I am strongly committed, together with the team, to aggressively realise the upside potential of the Front-end business and deliver value to our shareholders”.

Contacts:

Mary Jo Dieckhaus	+ 1 212 986 29 00
Erik Kamerbeek	+ 31 30 229 85 00

Background

ASM International consists of two businesses – the 53.1% owned Back-end business, ASM Pacific Technology (ASM PT); and the 100% owned Front-end business. Today’s announcement focuses on the actions the company is taking to meet its target of achieving peer-group profitability in the Front-end business in 2009 and outlines its vision for 2010 and beyond.

In the late 1990s, the evolution of the Front-end business was seriously damaged by a protracted patent dispute with Applied Materials, which led to costs of approximately $120m for the company. At the same time ASMI was forced to spend heavily to retool the Front- end business so that it had a product suite fit for market. This essential investment programme – focused on repositioning the product portfolio in 300mm – was financed by use of dividends from the ASM PT business.

By 2006 this process was substantially completed. The Front-end business had built up an excellent IP portfolio with strong market positions. As a result, the focus was shifted in 2006 to profitability.

Progress in 2006 and 2007

In furtherance of the aim for peer group profitability, ASMI announced a number of financial targets in 2006 for its Front-end business:

2006 – Become EBITDA positive (Result: EBITDA of €17m)

2

2007 – Achieve positive net earnings (Result: net earnings of €7.7m¹)

2009 – Achieve peer group profitability

The company met both its 2006 and 2007 targets and improved EBIT by nearly €50m over these two years. The Front-end operations remain less profitable, however, than their peers, with a 3.4% EBIT margin in 2007 compared to a peer group average of 9.1% over the calendar year 2007.² It was in order to close this gap that the company articulated the third target in 2006 – achieve peer group profitability in 2009.

The announcement today focuses on the steps that have been and/or will be taken to achieve this target.

Roadmap to Front-end Peer Group Profitability in 2009

The company’s key strengths are a leading IP portfolio, excellent market positions and worldwide sales to the top 10 global IC-manufacturers.

Leveraging from this position the company will execute the following action plan to achieve peer group profitability in 2009:

1. Drive revenue growth

2. Expand operating margin

3. Improve cash conversion

4. Change organisational structure and culture

1 Drive Revenue Growth

A crucial focus for the company going forward is to further improve the commercialisation of its products. This involves promoting the “customer voice” much higher up the organisation. A new organisation structure with an aligned incentive structure and the appointment of a VP Global Sales and Service will enable a much more focussed approach to driving revenue growth.

Although the market is forecast to decline in the short-term, ASMI expects to significantly outperform owing to strong positions in high growth segments (PE-CVD; TP-ALD, CP-ALD and EPI); aggressive growth in ALD; and the significant opportunity in PE-CVD. Additionally, revenue growth will be enhanced by accelerating focus and penetration into Asia as well as the Memory and Foundry segments.

Based on current market assumptions ASM expects to achieve Front-end revenues of €440-480m in 2009, a change of -2% to +6% from 2007 versus an expected market decline of 9%, according to Gartner³. ASMI also expects to continue to outgrow the market in 2010 and beyond.

¹ Excludes the expense from early extinguishment of the convertible debt for €10m.

² Peer group selection based on four criteria; scale, market leadership, product overlap and product diversification. Scale and market leadership are the most important criteria as they are the key contributors to profitability due to operating leverage and focus. Based on these criteria ASM’s Front-end peer group consists of Aixtron, Axelis, Mattson, Novellus, Semitool, Varian and Veeco

³ Gartner 14 April 2008 – “Forecast: Semiconductor Capital Equipment Contracts Hard in 2008”

3

2 Expand Operating Margin

The new management team commits to an operating margin target of 11-13% by 2009.

The key elements to achieve this target are gross margin improvement and operating expense reductions.

Based on current market assumptions gross margin is expected to increase from 32.2% in 2007 to 37-39% in 2009. The key contribution will come from:

– Continuation of FEMS – Shift of Front-end production to Singapore, in which ASMI has invested since 2004. FEMS reduced materials costs by €16m from 2005 to 2007 and is expected to further reduce this by €15m-€20m in 2009 as benefits from phase 1 will start to ramp up and as it will enter into the second and third phase of its program; Merge in Transit, Design for Manufacturing and Final Assembly and Testing

– Global Sourcing – This initiative is expected to contribute at least an additional €10m to gross margin by 2009 and will be one of key focus areas for the new VP Global Operations

– Platform Reduction – All single wafer applications and product lines will have migrated to one single product platform by 2010 and all single wafer products will use the same Equipment Front-end Module by 2009, which is manufactured by FEMS. This will drive standardization across all Front-end products and is expected to reduce costs by €10-€20m in 2010/2011

Based on current market assumptions the company expects to reduce operating expenses from €130m in 2007 to €114-125m in 2009. The key contribution will come from:

– Divest RTP and NP product lines. Combined operating loss amounted to €3.5m in 2007 and operating expenses €4.5 m

– Streamline SG&A. Standardization of general and administrative functions and global roll-out of SAP. Consolidation and standardization of production at FEMS. Closure of the Dutch head office in Bilthoven and consolidation in Almere location. Central approach to documentation and training

– Global disciplined approach to R&D resource and budget allocation, which will be driven by a newly appointed VP FE Products

The initiatives outlined will accelerate the progress the company has been making over the past years.

3 Improve cash conversion

The Front-end business will focus on working capital reduction and capital expenditures efficiency.

The relative working capital improvement will have a positive impact on cash level of over €30m from 2007 to 2009. Net capital expenditure will not exceed depreciation, will not exceed 4% of revenues in 2008 and 2009 and will amount to €30-35m for 2008 and 2009 combined.

4

4 Change organisational structure and culture

The announced organisational change of the Front-end business represents a far-reaching and critical change to the way the company will be run. The new organisational structure is an essential underpin to the financial commitments the company is making.

The organisational structure of the Front-end business will shift from a regional structure with geographical silos to a truly global structure. The newly appointed VPs for Global Sales and Service, Global Operations and FE Products will directly report to the CEO. There will be clear objective settings for the entire organisation introducing stronger (financial) accountability in the company, which is further underlined by a medium and long term incentive programme.

The new global organisational structure will drive a cultural change in the organisation, and will promote improved focus, efficiency, commercialisation and execution.

Vision for 2010 and beyond

ASMI’s ambition to create value extends well beyond achieving peer-group margins for the Front-end business by 2009. The combination of a strong product portfolio and superior market positions, aligned to an enhanced sales focus, will help to continue to outgrow the market in 2010 and beyond. Furthermore Front-end operating margin for 2010 and beyond is targeted at the top half of the peer group.

ASMI continues to believe that the convergence of the Front-end and Back-End activities within the industry, already underway, will accelerate further from 2011. From this date ASMI expects to unlock the commercial potential of its unique combination of both activities within one company.

Preliminary Q1 2008 Front-end Results

ASMI will report its 2008 first quarter results for Front-end on May 5. Preliminary results show that improvement initiatives taken in 2007 already yield results. The Front-end business reports preliminary revenues of €83.9m vs. earlier guidance of €77-83m. The gross margin for Q1 at 34.0% compares favourably to 30.0% in Q1 2007 and 32.2% for FY2007. Despite the challenging market circumstance in the Wafer Fab Equipment industry, ASM’s Front-end business reports a positive EBIT with improved quarterly net earnings break-even level from €110m on average in 2007 to around €90m in the first quarter of 2008.

About ASM

ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International’s common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI’s web site at www.asm.com.

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking

5

statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company’s reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

6

EX-99.3

Exhibit 99.3

Roadmap to Front-end Peer Group Profitability

28 April 2008

© 2008 ASM

Proprietary Information

Safe Harbour Statements

All matters discussed in this document, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission. All statements are made as of the date provided and we assume no obligation nor intend to update or revise any forward-looking statements to reflect future developments or circumstances.

© 2008 ASM

Proprietary Information

April 2008

2

Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

© 2008 ASM

Proprietary Information

April 2008

3

Focus of the Roadmap Presentation

ASM International

100.0%

53.1%

ASM FE ASM PT

Front-end activities ASM Pacific Technology / Back-end activities

FTE: 2,116 FTE: 9,989

Focus of Today

Note: Total employment as of 31 December 2007.

© 2008 ASM Proprietary Information April 2008 4

Past

Built excellent IP portfolio and strong market positions

Focus on technology development

Regional organisation

Broad portfolio of product lines

No clear communicated performance measures before 2006

Introduction

Going Forward

Increase market share by levering strong IP portfolio and focus on high growth segments. Leadership in ALD

Focus on driving revenue growth and improving profitability

Global organisation with stronger financial accountability & focus

Divest product lines RTP and NP

Three clear 2009 performance measures linked to shareholder value creation:

1. Outgrow the market

2. Expand EBIT margins to 11% – 13%

3. Improve cash conversion

Change in focus towards stronger commercialization, operational execution & accountability to drive profitability

© 2008 ASM

Proprietary Information

April 2008

5

Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

© 2008 ASM

Proprietary Information

April 2008

6

Strong Technology and

Leading IP Portfolio…

Strong technology with leading patent portfolio

• 4th best semiconductor capital equipment patent portfolio

Top 10 SemiCap Equipment Manufacturers (2007)

Adjusted Adjusted 2006 U.S. Pipeline Pipeline Pipeline Pipeline Pipeline Pipeline Rank Company / Organization Patents Impact Impact Generality Originality Power Power(1)

1 ASML Holding 297 1.48 1.16 1.92 1.09 1,897 1,491

2 KLA-Tencor 127 2.81 2.45 2.88 0.98 1,632 1,427

3 Applied Materials 369 1.74 1.62 1.91 1.15 1,397 1,298

4 ASM International 95 3.97 3.97 3.03 1.06 1,060 1,060

5 FormFactor 36 5.00 5.00 2.87 1.25 726 726

6 Micronic Laser Systems 14 5.00 5.00 3.68 1.27 457 457

7 Amberwave Systems 15 5.00 4.24 4.96 0.99 426 362

8 Tokyo Electron 237 0.90 0.90 1.22 1.11 309 309

9 Adv. Semicon. Engineering 83 1.44 1.44 1.58 0.88 306 306

10 Aixtron 13 5.00 5.00 3.72 1.06 257 257

Source: IEEE Spectrum November 2007.

1. Pipeline power is a function of patent pipeline growth, patent citation frequency, the variety of technologies underlying the patent and the patent originality.

© 2008 ASM Proprietary Information April 2008 7

… with Excellent Market Positions and

Worldwide Sales

Leading market positions

#1 to #3 in all four established market segments (Transistor Products ALD, EPI, Vertical Furnaces and PE-CVD)

Strong potential to further improve our market position per product line

ASM’s Front-end market segments expected to grow faster than the overall market

Worldwide sales

• Now supplier to all the top 10 global IC-manufacturers

• Growing contribution and momentum beyond Logic into Memory & Foundry segments and Asia

1. VLSI research reports and Management estimates.

2. VLSI Research Inc., January 2008.

ASM FE Addressable Market

Market Segment Position(1) Market Size ($m)(2)

2007E 2012E CAGR

• Epitaxy (Si, SiGe) 2 435 770 12%

• Vertical Furnace 3 1,998 1,966 0%

• Plasma Enhanced CVD 3 1,143 1,825 10%

• Of which Low-k films 2 354 850 19% Strong

• Atomic Layer CVD 366 806 17% Position

• Transistor Products ALD

(Hafnium based High-K 1 films)

• RTP To be divested

2007 ASM FE Revenue Breakdown

US Europe 25% 18%

Japan

17%

Asia

40%

© 2008 ASM

Proprietary Information April 2008

8

We Have Made Significant Financial and

Operational Improvements…

2000-2005 Major Investments in FE Portfolio

Focus on Profitability From 2006

Cash outflow due to patent litigation with Applied Materials of ~$120m(1), in 1998

Repositioning product portfolio in 300mm financed by ASM PT dividend

Investments in FEMS started in 2004

Revenue growth despite FX impact

Best-in-class product portfolio and strong market positions in high growth segments

Positive 2007 net earnings

Commitment on return of ASM PT dividends to shareholders 2007-2009

EBIT(2) Revenue

€m €m 10.1% 450.9

14.4%

409.4

(1.1%) 357.9

(2.6%)

(4)

(9) (8.9%) 2005 2006 2007

EBIT(2)

(16.0%) (15.8%) €m 16 1 (32) 3.4%

0.3%

(43)

(45) (8.9%)

(32)

2001 2002 2003 2004 2005 2005 2006 2007

Including legal costs of ~$40m.

EBIT excluding discontinued operations; including €7m charges regarding Capacitor Products in 2005.

© 2008 ASM

Proprietary Information

April 2008

9

…and Achieved Targets for 2006 and 2007

Target

• Positive EBITDA

• Gross margin improvement 2006 • Working capital improvement

• Gross margin increase by 1.5% through FEMS

• Positive net earnings

Front- • Gross margin improvement through end FEMS

• Increase SE Asia focus

2007 • No use of ASM PT dividend for FE capex

• Reduce operating loss for product lines in development from €45m(2) in 2005 to single digit in 2007

• Positive operating cash flow

Excludes the expense from early extinguishment of convertible debt for €10m.

Includes discontinued operations; excluding €7m charges regarding Capacitor Products.

Result

EBITDA €17m (4.2% margin) 333

Gross margin increase by 6.1% to 31.2% 333

Reduced working capital by 18 days 333

+1.5% contributed by FEMS 333

• Net earnings €7.7m(1) 33 3

• Gross margin increase 1% to 32.2% 33 3 through further FEMS progress

• Customer wins in Taiwan, Korea and China 33 3

• Used ASM PT dividend for repurchase of 33 3 convertibles and shares and cash dividend

• Operating loss for product lines in ~33 3 development €10.0m

• Not achieved due to working capital changes 33 3

© 2008 ASM

Proprietary Information

April 2008

10

However, Still Less Profitable than Peers

CY 2007 EBIT Margin

25.0% 23.5%

20.0%

16.7%

15.0%

9.6% 9.4% Avg. peer EBIT margin: 9.1%

10.0%

5.2%

5.0% 3.4% 2.7%

0.0%

(5.0%) (3.3%) ASM FE Varian Novellus Aixtron Mattson Semitool Veeco Axcelis

Further improvement required

We are confident achieving 2009 peer profitability

Source: Company reports.

© 2008 ASM Proprietary Information April 2008 11

Front-end Peer Selection

€m Key Financials Scale Market Product Product Name EV CY07 Sales Leadership Overlap Diversification

808 215

246 277

84 183 1,308 1,074 183 147 1,623 710 376 283

Not Similar Very Similar

Peers selected on 4 criteria and ranked in order of importance(1)

Scale and Market Leadership most important contributors to profitability due to operating leverage and focus

Product Overlap and Product Diversification align sub-vertical trends and variances across margins per product

Source: Financials per FactSet as of 25 April 2008.

1. Order of importance ranked from left (Scale) to right (Product Diversification).

© 2008 ASM Proprietary Information April 2008 12

Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

© 2008 ASM

Proprietary Information

April 2008

13

Key FE Value Creation Drivers

1. Drive revenue growth

2. Expand operating margin

3. Improve cash conversion

4. Change organisational structure and culture

We are committed to create shareholder value

© 2008 ASM

Proprietary Information

April 2008

14

Key Financial Improvements by 2009

€m 2007 2009

Outgrow the Revenue 451 440 – 480 market

Gross margin % 32.2% 37 – 39%

Expand Operating expenses 130 114 – 125 operating margin

Operating margin % 3.4% 11 – 13%

Total Net Capex of €30-35m for 2008 + 2009 Improve cash Reduce relative working capital 25% by 2009 conversion

We commit to a 2009 FE operating margin of 11% – 13% based on current market assumptions

© 2008 ASM

Proprietary Information

April 2008

15

2009 EBIT Margin Range of 11%-13%

EBIT Bridge 2007A – 2009E at Mid Point Targets

€m

80

(1)

62 13%

60 +12

55 +26 (1)

40 48 11%

16 +1 20

0

EBIT 2007A Revenue Gross Margin Opex EBIT 2009E Growth Improvement Reduction

We are confident to reach our 2009 EBIT margin targets, which implies an EBIT improvement of ~€40m versus 2007

Note: Divestiture of RTP and NP product lines contributes €3.5m to EBIT improvement. All numbers subject to rounding.

1. Based on target revenue range of €440-480m.

© 2008 ASM Proprietary Information April 2008 16

1. Drive Revenue Growth

Challenging Market Environment

Wafer Fab Equipment Market Forecast

$bn

2007 – 2009 growth (9.3%)

40 2007 – 2010 growth 4.6% 15.3% 20%

35 9.8% 15%

10.0%

30 10%

25 5%

20 0%

15 (5%)

(17.4% )

10 (10%)

5 (15%)

(20%)

2007 2008 2009 2010

WFE ($bn) Growth %

Gartner predicts market to drop over 17% in 2008 followed by a recovery in 2009 and 2010

Source: Gartner 14 April 2008 – “Forecast: Semiconductor Capital Equipment Contracts Hard in 2008”.

© 2008 ASM Proprietary Information April 2008 17

1. Drive Revenue Growth

We Will Outgrow the Market

Market expected to decline by 9% from 2007 – 2009

We expect a revenue decline of 2% to a growth of 6%

Strong positions in high growth segments

ASM has established positions in Front-end market segments that are expected to grow faster than the overall market (PE-CVD, TP-ALD, CP-ALD and EPI)

Aggressive growth in ALD

ASM will leverage current success at industry leader to the fast followers

Growth applies to TP-ALD, CP-ALD and Vertical Furnace ALD

Significant opportunity PE-CVD

By strengthening Global Product Marketing

Penetration into Korea

Strong technology portfolio in growth applications

© 2008 ASM

Proprietary Information

April 2008

18

1. Change of

Sales Organization

2. Appointment

VP Global Sales & Service

3 Focus and Penetration

1. Drive Revenue Growth

Key Initiatives

Change sales organization from region based to a global organization by Q3 2008 reporting on CEO level

Brings customer voice to highest level of ASM organization

Drives organization from Technical/Product focus to Customer focus (‘commercialization’)

Will drive higher revenue

Hire and appoint VP Global Sales & Service by Q2 2008

External candidate with excellent track record in the industry

Accelerate focus and penetration into Memory & Foundry segments and Asia

Key initiatives underpin our objective to outgrow the market

© 2008 ASM

Proprietary Information

April 2008

19

2. Expand Operating Margin

Key Elements

€m Targets

2007A 2009E

Gross Margin 145 163-187 Improvements 32.2% 37-39%

Operating 130 114-125 Expenses 28.7% 26% Reductions

EBIT Margin

3.4%

11%—13%

© 2008 ASM

Proprietary Information

April 2008

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2. Expand Operating Margin

Appointment of VP Global Operations

VP Global Operations

Responsibilities

FEMS

Global sourcing

Lean manufacturing strategy

Make / Buy strategy

Global capacity planning

Worldwide inventory management

Working capital management

Lead time reduction

Worldwide quality management

Environmental, health & safety plan

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•

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Candidate Profile

Current GM of ASM Europe since 2004

Managed move Vertical Furnace to FEMS; will proliferate best known methodologies to other products

Increased VF gross margin by 8.5% in 3 years

VP Global Operations to drive cost saving measures globally, directly reporting to CEO

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2. Expand Operating Margin

Gross Margin – FEMS

History of FEMS (FE Manufacturing Singapore)

Established with strong support from ASM PT in 2004 (clear operational synergy between FE and BE)

FEMS is our hub for low cost manufacturing to serve all ASM products (being fed by low cost operations in China, Malaysia and India)

Typically Generics and Other Materials constitute the largest component COGS, therefore first priority and focus of FEMS phase 1

COGS Breakdown Before FEMS

Services (20% )

Generics Final and Other Assembly Materials and Test (70% ) (10% )

FEMS reduced materials costs by €16m from 2005 to 2007

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Phase 1

Generics and Other Materials

• Fabrication of certain parts at FEMS

• Local sourcing / purchasing of certain parts by FEMS

• Subassembly at FEMS

Results

2005: Start HVM of A412-generic (furnace 300mm)

2006: Start HVM of A400-generic (furnace 200mm) and E2000-generic (EPI 200mm)

2007: Start HVM of E3200-generic (EPI 300mm)

2008: Start Eagle XP-generic (PE-CVD)

2009: Start HVM Pulsar-reactor (TP 300mm) + other products

2. Expand Operating Margin

Gross Margin – FEMS

•2 Design for Manufacturing

Engagement (DFM) by FEMS

– Scope: Generic modules

– Timing: To be determined

in Q2/Q3 2008

Further opportunity

FEMS expected to yield additional materials cost reduction of around €15-20m by 2009 and more thereafter

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Phase 2

Merge in Transit and Design for Manufacturing (DFM)

•1 Merge in transit: Direct Partial shipments from FEMS to customers

– Scope: Modules with no customization

– Timing: Start in 2008

Phase 3

Final Assembly and Testing

•1 Scope to be determined on a product by product basis

– Two categories : Customization needed / No customization needed

– Timing: Roll out starting in 2009

2. Expand Operating Margin

Gross Margin – Global Sourcing

Global Sourcing

Accelerate global sourcing initiative

Stronger bargaining power

One single interface to suppliers

Overhead reduction

Cost reductions through make (at FEMS) vs. buy (through global sourcing) decision

Currency independency

Roll out of global sourcing plan by Q3 2008

Additional reduction of total material purchasing costs in 2009 by at least €10m

Global sourcing initiative is expected to contribute at least an additional €10m to gross margin by 2009

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2. Expand Operating Margin

Gross Margin – Platform Consolidation

Single Wafer Platform Consolidation Equipment Front-end Module

• Move all single wafer applications to one • All single wafer products will use the same single product platform by 2010 EFEM (Equipment Front-end Module) starting

3 The Eagle/Dragon platform has been in 2009. This EFEM Product will be selected manufactured at FEMS

3 Already used by PE-CVD and CP products

• Standardization across all Front-end products

Process Technology Platform

AL-CVD LP-CVD Thermal PE-CVD Epitaxy (Incl. (PE)ALD) and RT-CVD Process (Incl. Low-k)

A400/412 Batch

Divest

Platform Levitor SW 2008 Epsilon SW

Polygon SW 2010

2009

Eagle /

Product SW

Dragon

Platform consolidation and EFEM expected to yield €10-20m additional cost savings by 2010/2011

Note: Polygon, Epsilon, Levitor, Eagle, and Dragon are registered ASM owned trademarks. A400, A412, PEALD and ALCVD are our trademarks.

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2. Expand Operating Margin

Operating Expenses

Opex Efficiency Improvement and Cost Variability Increase

1 Opex reduction through RTP and NP divestments

Results of RTP and NP will no longer affect Front-end P&L from Q1 2009

2 Streamline SG&A costs

Standardization of general and administrative functions (SAP)

Consolidation and standardization of production at FEMS

Consolidation of Dutch offices (move HQ to Almere)

Central approach to documentation and training

3 Global disciplined approach to R&D resource and

budget allocation

• Strongly enabled by appointed VP FE Products (former COO)

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2. Expand Operating Margin

Summary Key Initiatives

Impact

1 FEMS Continuation • Material Cost-reduction expected by 2009 €15 – 20m

2 Global Sourcing • Additional benefits of over €10m in 2009 €10m+

Platform • Move all single wafer applications to one single product

3 Consolidation platform by 2010 €10 – 20m

• All single wafer products will use the same EFEM

& EFEM starting in 2009

4 Divest RTP • RTP has negative contribution of €2.8m to 2007 EBIT €3m

5 Divest NP • NP has negative contribution of €0.7m to 2007 EBIT €1m

6 Global R&D • Central prioritization and allocation of R&D budget p.m. Planning • Appointment of VP FE Products Appoint VP Global • Candidate has improved VF Gross Margin by 8.5% in 3 7 p.m.

Operations years

Dutch • Close Bilthoven head office and consolidate operations

8 p.m.

Office Consolidation in Almere

Key initiatives underpin our ambitious cost saving objectives

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2. Expand Operating Margin

Results Q1 2008 On the Right Track

Preliminary Q1 2008 Results(1)

€m Q1 2008 Q4 2007 Q1 2007

Revenue 83.9 106.3 116.3

Gross margin 28.5 37.7 34.9

Margin % 34.0% 35.5%(2) 30.0%

Operating expenses 28.3 33.4 31.5

% of Revenue 33.7% 31.3% 27.1%

EBIT 0.2 4.3 3.4

Margin % 0.3% 4.1% 3.0%

Comments

Q1 revenue at €83.9m, versus the guidance of €77-83m

28% y-o-y revenue decline in Q1 due to market conditions and adverse FX movement (impact 6.1%)

Gross margin at 34.0% vs. 30.0% in Q1 2007 and 32.2% for FY2007

EBIT positive

Quarterly net earnings break-even level around €90m versus €110m on average in 2007

Clear commitment to continue to return excess capital to shareholders

Initiatives introduced in 2007 are yielding results

The numbers presented are unaudited.

Q4 2007 gross margin of 35.5% contains one-off licensing result.

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3. Improve Cash Conversion

Focus on Working Capital and Capex

1 Working capital reduction

End of 2009 relative working capital will be at least 25% lower compared to the end of 2007 3 positive impact on cash level in excess of €30m

2 Capital efficiency

Net capex not to exceed depreciation in 2008 and 2009

Net capex not to exceed 4% of revenue in 2008 and 2009

Total net capex for 2008 + 2009 not to exceed €30m—€35m

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4. Change Organisational Structure and

Culture From Geographical Silos …

Old Organisation Key Issues

• Regionally orientated

CEO

businesses

CFO

• Sales organisation reports to COO regional GM, i.e. European sales reports to European GM

GM GM GM

CTO ASM ASM ASM FEMS • No comprehensive “global

Europe America Japan

account management”

PE-VF + EPI + CVD +

RTP TP • Operations are led on a

CP

RS&S

RS&S RS&S for regional basis and

Asia

organisational improvement

RM RM RM

initiatives are local

RS&S Regional Sales & Service RM Regional Manufacturing

Old structure needs change

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4. Change Organisational Structure and

Culture … To a Truly Global Organisation

New Organisation Key Benefits

• VP Global Sales & Service

??Sales organisation no longer reports to regional GMs but to CEO Global VP

??Enables true global account management

CFO • VP Global Operations

??Ownership of FEMS

??Streamlining of manufacturing processes globally

??Focus on improving gross margins, i.e. global sourcing

??Focus on operating expense reduction

VP • VP FE Products

Global VP VP ??Driving and monitoring execution of the product roadmaps CTO Global FE Global Sales & for all products Operations Products Marketing Service ??Central prioritization and allocation of R&D budget

• Focus of GMs

??Product strategy, product roadmaps, product engineering, GM GM GM drive product penetration, product support and escalation management, regional finance & HR

PECVD &

EPI & TP VF & RTP CP

• Enables clear objective setting for entire organization

• Establishes stronger (financial) accountability

• Supported by medium & long term incentive structure for broad group of employees

New global structure and culture drive focus, efficiency, commercialisation and execution

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Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

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Concluding Remarks

Peer Group Profitability by 2009 & More to Come…

Peer Group Profitability by 2009 More to Come

• Create Front-end value by • Capture significant further Front-realizing peer profitability by end value upside by 2010 2009

• Continue to outgrow the market in 2010 and beyond 1 • Drive revenue growth

• Achieve operating margin at top half of peer group 2 • Expand operating margin

3 • Improve cash conversion • Unlock commercial potential by Front-end and Back-end 4 • Change organisational convergence from 2011 onwards

structure and culture

Change in focus towards stronger commercialization, operational execution & accountability to drive profitability

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Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

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Convergence of FE and BE

Why 3D Integration?

Form Factor

Increases functionality per unit

Reduction of interconnect length improves device

Performance

speed and reduces power consumption

3D integration is less expensive than shrinking 2D Cost design rules, helped by the re-use of IP with improved modularity

3D technologies will enable performance, form factor and cost requirements to meet the demand of next generation devices

This requires integrated FE and BE process and manufacturing technologies

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Convergence of FE and BE

The (R)evolution Has Started: A Few Examples

Toshiba: CIS, April 1, 2008 Intel: MPU and Memory, Sept. 2006

Backed by Toshiba’s …wowed the media at through chip via Intel’s Developer technology to allow Forum with promises mounting and assembly of an 80-core chip of camera components within five years, in the chip wafer during ….TSV … marries manufacturing, … processor cores directly with system memory.

Samsung: NAND and DRAM, 2007 Micron: CIS, March 2008

Samsung Electronics Co. Micron demonstrates Ltd claims to have for the first time its developed the ‘first’ all- leadership with its DRAM stacked memory innovative through-package using ‘through wafer-interconnect silicon via’ (TSV) technology, which technology, … enables smaller, sleeker packages.

ASM International is the only BE and FE provider and the company is ready for 3D Integration

http://www.toshiba.com/taec/; Bernstein, IBM October 2007 and http://www.news.com/IBM-connects-chips-for-better-bandwidth/2100-1006_3-6175355.html?tag=item; http://www.eetasia.com/ART_8800462235_480300_NT_abf1ee89.HTM, and Samsung (picture); http://www.aptina.com/news/press/

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Convergence of FE and BE

ASM is Best Structured for 3D Integration

Building synergy and common vision is critical as this market is still emerging

ASM is the only company that has Front-end and Back-end products unified in a single company. Competitors are only able to provide one side of the solution.

ASM to focus on:

Front-end equipment with low Back-end cost

Back-end equipment with Front-end technology

Both groups have strengths to address and facilitate the 3D integration market

Front-end

Wafer level BEOL process and equipment technology

Interface chemistry

ALCVD and plasma processing knowledge

Fab equipment market knowledge

Back-end

Die level process

Wafer and die handling and alignment

Low cost manufacturing platforms and infrastructure

Packaging market knowledge

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Agenda

Introduction

Current situation FE

Roadmap to peer profitability FE in 2009

Concluding remarks

Appendix

FE and BE convergence

Peer selection criteria

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Front-end Peer Selection Criteria

Ultratech

Midsize Product Market Product

Criteria Scale Overlap Leadership Diversification Criteria

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