6-K

FORM 6-K

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

REPORT OF FOREIGN PRIVATE ISSUER

Pursuant to Rule 13a-16 or 15d-16

of the Securities Exchange Act of 1934

For the month of December, 2006

Commission File Number 000-13355

ASM INTERNATIONAL N.V.

(Translation of registrant’s name into English)

JAN VAN EYCKLAAN 10

3723 BC BILTHOVEN

THE NETHERLANDS

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x    Form 40-F  ¨

Indicate by check mark if the registrant is submitting the form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1):  ¨

Note: Regulation S-T Rule 101(b)(1) only permits the submission in paper of a Form 6-K if submitted solely to provide an attached annual report to security holders.

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7):  ¨

Note: Regulation S-T Rule 101(b)(7) only permits the submission in paper of a Form 6-K if submitted to furnish a report or other document that the registrant foreign private issuer must furnish and make public under the laws of the jurisdiction in which the registrant is incorporated, domiciled or legally organized (the registrant’s “home country”), or under the rules of the home country exchange on which the registrant’s securities are traded, as long as the report or other document is not a press release, is not required to be and had not been distributed to the registrant’s security holders, and, if discussing a material event, has already been the subject of a Form 6-K submission or other Commission filing on EDGAR.

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.    Yes  ¨    No  x

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): 82-                     .

Exhibits
Exhibit 99.1	Press release ASM International brings high-k plasma enhanced ALD to high volume manufacturing.
Exhibit 99.2	Press release ASM International and IMEC demonstrate three generations of Aurora® low-k materials.

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

Dated: December 8, 2006	ASM INTERNATIONAL N.V.
		/s/    ARNOLD J.M. VAN DER VEN
		Arnold J.M. van der Ven
		Managing Director and Chief Financial Officer

ASM INTERNATIONAL N.V.

(THE “REGISTRANT”)

(COMMISSION FILE NO. 0-13355)

EXHIBIT INDEX

TO

FORM 6-K

DATED DECEMBER 8, 2006

Exhibit No.	Exhibit Description	Filed Herewith
99.1	Press release ASM International brings high-k plasma enhanced ALD to high volume manufacturing.	X
99.2	Press release ASM International and IMEC demonstrate three generations of Aurora® low-k materials.	X

EX-99.1

ASM International N.V.

ASM International Brings High-k Plasma Enhanced

ALD to High Volume Manufacturing

BILTHOVEN, THE NETHERLANDS, December 5, 2006—ASM Japan K.K., a subsidiary of ASM International N.V. (NASDAQ: ASMI and Euronext Amsterdam: ASM), today introduced its Stellar^TM 3000 multi-chamber, single-wafer plasma enhanced atomic layer deposition (PEALD) tool designed for high volume IC manufacturing of high-k dielectric films for capacitors. ASM also announced it has already shipped Stellar 3000 systems to strategic customers.

Stellar represents the industry’s first single-wafer PEALD high-k tool suited for 300mm high volume manufacturing, offering throughputs of up to 40 wafers per hour for a typical process. It targets PEALD processes for high-k dielectric films for DRAM capacitors and metal-insulator-metal (MIM) capacitors used in embedded DRAM devices and advanced RF analog products. As capacitor areas decrease with each technology node DRAM makers are forced to deploy high-k films via ALD.

“It has been suggested that DRAM manufacturers’ requirements for higher throughput could not be achieved with single-wafer ALD processes,” stated Norio Saitoh, ASM ALD Business Unit Manager responsible for the Stellar product line. “By bringing our proven single-wafer PEALD film performance to a multi-chamber platform in the Stellar, ASM ensures that productivity is no longer sacrificed for quality and the low cost of ownership requirements of high volume capacitor production are met.”

“The ALD equipment market is reaching its prime. An increasing number of ALD applications are now moving from R&D to production environments,” said Risto Puhakka, President, VLSI Research, Inc. “This is driving growth in the ALD equipment market from $173M in 2006 to more than $300M by 2009. For the ALD market to continue its growth path, it is critical that ALD equipment suppliers such as ASM bring production worthy tools to market that offer both CoO reduction and technology improvements.”

PEALD offers considerable benefits for capacitors at the 90, 65, 45 and 32 nm process nodes, including ALD processing at low temperatures (<300 °C), which is important for eDRAM and other capacitors integrated into back-end process steps. PEALD deposits high-k films with higher density, lower leakage and higher breakdown voltage, compared to MOCVD. The tool can run all key high-k dielectric applications, extending machine lifetime for varied processes and multiple process generations.

Stellar is a low cost, high throughput ALD system combining a small footprint (3.5 m²) with a high speed simultaneous dual wafer exchange design. Stellar is highly reliable, integrating two PEALD reactors that have been proven on ASM’s ALD cluster tools. A process module slide-out system proves Stellar is designed for easy maintenance and minimal downtime in manufacturing.

The compact 2-chamber system offers at least a 50 percent reduction in clean room space, compared to traditional 300mm cluster style ALD or MOCVD tools. It offers high speed parallel processing with two PEALD reactors that enable direct plasma on wafer with a minimized reactor volume for 300 mm processing. A 200 mm version is also available.

About ASM

ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International’s common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI’s web site at www.asm.com.

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company’s reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

Contacts:
Mary Jo Dieckhaus	Willem Vermeulen
Investor Relations	Director Central Marketing
+1 212-986-2900	+31 (0)30 229 8411
MaryJo.Dieckhaus@asm.com	Willem.Vermeulen@asm.com

EX-99.2

ASM INTERNATIONAL AND IMEC DEMONSTRATE THREE GENERATIONS OF AURORA^® LOW-K MATERIALS

BILTHOVEN, THE NETHERLANDS, AND LEUVEN, BELGIUM, December 6, 2006—ASM International N.V. (NASDAQ: ASMI and Euronext Amsterdam: ASM) and IMEC announce that they have demonstrated three generations of ASM’s Aurora^® low-k and SiC dielectric barrier materials for IMEC’s 300mm pilot line. These results have been established within the framework of the ASM—IMEC strategic partnership on Back-end-of-Line (BEOL) interconnect technology, which was announced on July 12, 2005. In this strategic partnership, IMEC and ASM will develop novel copper/low-k interconnects on 300mm wafers for application in chips of the nanotechnology era, with feature sizes of 45nm or less.

“The Aurora materials are known for their superior mechanical properties,” comments Tominori Yoshida, ASM’s Business Unit Manager for PECVD. “Better mechanical properties, such as elastic modulus and hardness, and small pore size, usually makes materials more suitable for integration in a multi-layer interconnect and packaging”, he continues. As with the first generation material, the next generations Aurora ultra low-k materials have also been demonstrated by IMEC to have excellent mechanical properties with, for example, an elastic modulus exceeding 9 GPa at a k value of 2.5, and with a pore diameter less than 2nm. These porous Extreme Low-k layers have been successfully patterned by IMEC with ArF immersion lithography into features suitable for 45nm to 32nm device interconnect wiring.

“We are pleased that we can offer our partners the low-k materials and technologies that they need, not only for our baseline interconnect process but also for advanced development for 45nm and 32nm technology. To this end, IMEC collaborates with leading equipment and materials suppliers worldwide to offer our IDM partners all possible options for future technology development” stated Luc Van den hove, IMEC’s Vice President Silicon Process and Device Technology.

As part of the continuing strategic partnership, IMEC and ASM will research multi-layer integrations of Aurora^® Extreme Low-k films (k<2.5) and the feasibility of

even lower k-values, suitable for sub 32 nm technologies. ASM has installed two Eagle^® platforms in IMEC’s 300mm pilot line to provide low-k deposition capabilities for Aurora^® materials with k values ranging from about 3.0 to about 2.3, and SiC dielectric barrier layers with k values ranging from about 5.0 to about 3.8. This set of available materials spans multiple generations of low-k implementations down to the 22nm technology node.

About ASM

ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International’s common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI’s web site at www.asm.com.

About IMEC

IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. Its research focuses on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network of companies, universities and research institutes worldwide position IMEC as a key partner for shaping technologies for future systems.

As an expansion of its wireless autonomous microsystems research, IMEC has created a legal entity in the Netherlands. “IMEC-Nederland” runs activities at the Holst Centre, an independent R&D institute that develops generic technologies and technology platforms for autonomous wireless transducer solutions and systems-in-foil.

IMEC is headquartered in Leuven, Belgium, and has representatives in the US, China and Japan. Its staff of more than 1450 people includes more than 500 industrial residents and guest researchers. In 2005, its revenue was EUR 197 million. Further information on IMEC can be found at www.imec.be.

Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically,

currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics, and other risks indicated in the Company’s filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company’s reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.

Contacts ASM :

Ivo Raaijmakers, + 31 30 229 8587

Mary Jo Dieckhaus, + 1 212 986 29 00

Contacts IMEC

Katrien Marent +32 16 281 880