-----BEGIN PRIVACY-ENHANCED MESSAGE----- Proc-Type: 2001,MIC-CLEAR Originator-Name: webmaster@www.sec.gov Originator-Key-Asymmetric: MFgwCgYEVQgBAQICAf8DSgAwRwJAW2sNKK9AVtBzYZmr6aGjlWyK3XmZv3dTINen TWSM7vrzLADbmYQaionwg5sDW3P6oaM5D3tdezXMm7z1T+B+twIDAQAB MIC-Info: RSA-MD5,RSA, I/pgID4VmkSoLpv1XA4zGMR+UzxoYXm/W7969GqcgcGcUSr0S/kCpFV0T/7lH6K0 6EQAFMlSegg++FGsHu6axA== 0001021408-01-509946.txt : 20020410 0001021408-01-509946.hdr.sgml : 20020410 ACCESSION NUMBER: 0001021408-01-509946 CONFORMED SUBMISSION TYPE: 8-K/A PUBLIC DOCUMENT COUNT: 11 CONFORMED PERIOD OF REPORT: 20011107 ITEM INFORMATION: Other events ITEM INFORMATION: Financial statements and exhibits ITEM INFORMATION: FILED AS OF DATE: 20011113 FILER: COMPANY DATA: COMPANY CONFORMED NAME: MICROSEMI CORP CENTRAL INDEX KEY: 0000310568 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 952110371 STATE OF INCORPORATION: DE FISCAL YEAR END: 0930 FILING VALUES: FORM TYPE: 8-K/A SEC ACT: 1934 Act SEC FILE NUMBER: 000-08866 FILM NUMBER: 1784370 BUSINESS ADDRESS: STREET 1: 2381 MORSE AVENUE CITY: IRVINE STATE: CA ZIP: 92614 BUSINESS PHONE: 7149798220 FORMER COMPANY: FORMER CONFORMED NAME: MICROSEMICONDUCTOR CORP DATE OF NAME CHANGE: 19830323 8-K/A 1 d8ka.txt CURRENT REPORT ON FORM 8-K AMENDMENT NO. 1 SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 8-K/A Amendment No. 1 to the CURRENT REPORT ON FORM 8-K THAT WAS FILED NOVEMBER 7, 2001 Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934 Date of Report (Date of earliest event reported): November 5, 2001 - -------------------------------------------------------------------------------- MICROSEMI CORPORATION - -------------------------------------------------------------------------------- (Exact name of Registrant as specified in its charter) Delaware 0-8866 95-2110371 -------- ------ ---------- (State or other jurisdiction (Commission (I.R.S. Employer of incorporation) File Number) Identification No.) 2381 Morse Avenue, Irvine, California 92614 - -------------------------------------------------------------------------------- (Address of principal executive office) (Zip Code) Registrant's telephone number, including area code (949) 221-7100 ----------------------------------------------------------------- Not Applicable ---------------------------------------------------------------- (Former name or former address, if changed, since last report) Item 5. Other Material Information. IMPORTANT FACTORS RELATED TO FORWARD-LOOKING STATEMENTS AND ASSOCIATED RISKS Other than financial results for the periods ended on or before September 30, 2001, the financial information and other text of Exhibit 99.2 through Exhibit 99.12 are comprised of forward-looking information. We cannot represent or assure anyone that the information therein should be relied on for purposes of making an investment in securities. Goals, estimates, projections or beliefs may be based on unreliable suppositions or incorrect premises. Estimates are inherently subject to inaccuracy, and our future financial condition and results may be significantly different from our current expectations. In the process of making our estimates, we make numerous assumptions that may prove wrong, based on known or unknown factors. Other factors that may affect our results are mentioned in our Form 10-K filed December 21, 2000. The Exhibits herein should be read in context of those factors. In the context of these analyst presentations, we presented information based on our own beliefs, and not based on independent validation. Our own information may be incomplete or inaccurate. In this context, each person receiving the information is expected to take care to investigate and analyze fully all relevant facts. Therefore, the Company sought no independent confirmation of its assumptions, any of which could prove wrong in material respects. Circumstances concerning expectations of potential orders are always subject to possibly rapid, adverse change. Design wins are a preliminary indicator of future sales; however design wins may not result in us actually realizing any incremental revenues. Historic information is not necessarily a good indication of a continuing or repeating trend. Past results may not be repeatable. Charts and graphic material do not necessarily translate well into Ascii text and are not identical in scale or form to the originals. The information in Exhibit 99.2 through Exhibit 99.12 may become inaccurate subsequent to the date on which it is first presented. We do not undertake to update such information. We intend to update or supersede such information on a quarterly basis approximately, and not more frequently. Please note that Exhibit 99.12 provides an overview of the presentations set forth in Exhibit 99.3 through Exhibit 99.11. Reference to Exhibit 99.2 through Exhibit 99.12 in this Item 5 does not incorporate such information into this Item. Exhibit 99.2 through Exhibit 99.12 shall not be deemed reported in this Item 5 or reported for purposes of the Securities Act of 1934, as amended, except for reporting such information under Item 9 pursuant to Regulation FD. Item 7. Financial Statements and Exhibits. The Exhibit Index, which immediately follows the signatures hereto, is incorporated herein by this reference. Item 9. Regulation FD Disclosure. On November 5, 2001 and November 6, 2001, the Registrant made 45-minute presentations to Securities analysts and others at the AEA Classic Financial Conference in San Diego, California. A recorded webcast of the presentation will be available until December 31, 2001 at: http://www.microsemi.com/corporate/literature. The Registrant announced such - --------------------------------------------- presentations in the News Release designated as Exhibit 99.1 and incorporated herein by this reference. On November 8, 2001, the Registrant made presentations to securities analysts at the Registrant's corporate headquarters. The presentations were based on publicly available information from SEC filings and the written material designated as Exhibit 99.2 (which served as the basis for the former presentations) and Exhibit 99.3 through Exhibit 99.12 (which served as the bases for the latter presentations). SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized. MICROSEMI CORPORATION (Registrant) Date: November 9, 2001 By: /s/David R. Sonksen ------------------------------------- David R. Sonksen, Executive Vice President, Treasurer, Chief Financial Officer and Secretary INDEX TO EXHIBITS EXHIBIT NO. DESCRIPTION - ----------- -------------------------------------------------------- 99.1 News Release dated November 2, 2001 (1) 99.2 Slide show presentation for AEA Classic Financial Conference (1) 99.3 Slide show presentation- Military Markets (2) 99.4 Slide show presentation- Switching Regulators (2) 99.5 Slide show presentation- Audio Products (2) 99.6 Slide show presentation- Managing Light- CCFL (2) 99.7 Slide show presentation- LED Opportunity (2) 99.8 Slide show presentation- Medical Markets (2) 99.9 Slide show presentation- MMSM (2) 99.10 Slide show presentation- Optical Communications (2) 99.11 Slide show presentation- RFIC Products (2) 99.12 Slide show presentation- Overview of Presentations (2) ___________________________ (1) Incorporated by reference to the like-numbered exhibit to the Current Report on Form 8-K filed November 7, 2001. (2) Filed herewith. EX-99.3 3 dex993.txt MILITARY MARKETS MANAGING TEMPERATURE & POWER Exhibit 99.3 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities AEA| 11/7/2001 | http://www.microsemi.com Slide 1 Microsemi Military Markets Managing Power & Temperature Manuel Lynch, Vice President of Business Development Slide 2 MSCC Mil/Aerospace Leader . Recent acquisitions of NES and CDI round out product offering . Broad product portfolio now being used to increase dollar content per system . End customers focusing back on high reliability vs commercial products - Field failures causing customers to re-analyze approach to military/aerospace systems Military Products RF/Optoelectronics
Microsemi Alpha Industries M/A Comm Semicoa Solid State Devises --------- ---------------- --------- ------- ------------------- High Freq Switches x x x Power PINs x x x x RF Bipolar Power x RF Bipolar Mobile x Photodetectors x x Power Management Microsemi IRF/Omnitrel Linear Tech Semtech Sensitron Solid State Devises --------- ------------ ----------- ------- --------- ------------------- CCFL Controllers x x Class D Audio x LDOs/Regulators x x x x DC:DC Converters x x x PWMs x x x x Ruggedized Modules x x x TEC Controllers x x
TVS Microsemi Semtech Sensitron Solid State Devices --------- ------- --------- ------------------- Surge Protection x x x x Lightning Protection x x EMI Suppression x Zener Regulation x x x Discrete
Microsemi Fairchild (Military) IRF/Omnitrel Semicoa Sensitron Solid State Devices --------- -------------------- ------------ ------- --------- ------------------- Power Rectifiers x MOSFET x x x x x SiC Schottkys x Signal Diodes x x Power Schottkys x x x x Transistors x x x x
Slide 3 Market dynamics, Military . September 11/th/ is changing Military outlook . Budgets increasing, long term programs being awarded - F-22 - Joint Strike Fighter . Market Growth - Military market grows 10-12% annually (5 yr CAGR or 10yr) - Systems using higher electronic content -- Fly by wire - reduces weight, increases agility, increase electronic content -- Smart Targeting/Avionics/IFF - sophisticated war machine, increased electronic content . MSCC outpacing market growth - Increased market share, higher dollar content, acquisitions - Expect that CAGR will be 12-15% over 10 year period Slide 4 . Market dynamics, Satellites . Market Changing Quickly - Cycle time in satellite build going from 36 months to 12 months - New applications (terrain mapping, satellite banking communication, ICBM laser tracking) - Launch vehicles galore - more satellites per launch (translates to innovative product solutions to allow for tight packing) - Insurance risk - customers returning to JANS qualified products - Promise of large satellite constellations (Teledesic) . Market share - Microsemi is the market leader greater than 80% market share . MSCC outpacing market growth - Increased market share through acquisitions - Higher dollar content (smarter products, reduce launch weight, increase content) - Market CAGR 10-12% -- Expect that MSCC CAGR will be 15-18% over next 10 years Slide 5 Market dynamics, CommAircraft . Small part of MSCC overall revenues (less than 3.6%) . Long term projections see growth as flat . MSCC outpacing market growth - Increasing market share, higher dollar content . MSCC outpacing market growth - Increased market share through acquisitions - Higher dollar content (multimedia products, internet in the sky, lightning protection, fly-by-wire) - Market CAGR flat for next 10 years -- Expect that MSCC CAGR will be 2-5% over next 10 years Slide 6 What sets us apart? . Military Systems - MSCC more than 30 year high reliability track-record -- Market entry for new player is nearly impossible -- Established relationship with DSCC/US Govt - Product diversity limits competition -- MSCC is #1 electronic component supplier to Lockheed, Boeing, Raytheon, BAE - Patented CoolPack technology advances legacy military systems (light weight, rugged, increases chip life) - Qualified Military Products (QML Listing) -- System for reducing military design cycle times, pre-approved products . Satellites - Over 3000 JANS (Joint Army, Navy, Space) qualified products - Innovative Battery bypass systems reduces launch weight by up to $1mil - Innovative Solar Panel Diodes allow tighter packing of satellites (foldable solar panels) . Commercial Aircraft - Product diversity limits competition -- MSCC is #1 electronic component supplier to Boeing, Honeywell, Rockwell, AirBus Slide 7 Typical Fighter Content $300 - 500K per plane Power Conversion - - Generators (SCRs, MOSFETs, IGBTs, Linear ICs) - - Inverters (3 Phase Rectifier Bridges) Wing Electronics - - Lightning Protection (TVS Modules) - - Actuation (3 Phase Power Modules) - - Missile Launch (SCRs) Power Distribution - - Power Supplies (FETs, Schottkys, Rectifiers) - - Logic Control Protection (TVS, Zeners) Motor Control - - Wings (3 Phase Power Modules, PWM) - - Canopy (3 Phase Power Modules, PWM) - - Landing Gear (Rectifiers/MOSFETs, Drivers) Cockpit Electronics - - IFF (RF Transistors/PIN Diodes) - - CRT (HV Diodes) - - Backlit Displays (Power Modules) - - Seat Ejection (SCRs) - - Air Flow Control (Power Modules) - - Fire Control (SCRs, Transistors) Radar/Communications - Transmitters (HV Diodes, Varactors, PAs) - - Antennas (PIN Diodes) - - Amplifiers (RF Transistors) [picture of Hermetic Power Modules] [picture of ThinKey patented packages] [picture of fighter jet] Slide 8 Military Aircraft [picture of military helicopter] Power Conversion - - Generators (SCRs, MOSFETs, IGBTs Modules) - - Inverters (3 Phase Rectifier Bridges) Cockpit Electronics - - IFF (RF Transistors/PIN Diodes, HV Modules) - - CRT (HV Diodes) - - Backlit Displays (Power Modules) - - Air Flow Control (Power Modules) - - Fire Control (SCRs, Transistors) Targeting/Fire Control - - Laser Target/Range Finders (HV) - - Squib Fire Circuits (SCRs) Radar/Communications - - Transmitters (HV Diodes) - - Antennas (PIN Diodes) - - Amplifiers (RF Transistors) - - Laser Target/Range Finders [McDonnell Douglas Logo] Slide 9 Spacecraft Opportunities Payload - - All space products Solar Panels - - BDA Diode - - 1N5811 BUSS - - Power Modules (FETS, Schottkys, Rectifiers) Batteries - - Charge/Discharge Circuits (FET Modules) - - Protection (Schottkys) [McDonnell Douglas Logo] [picture of space station] Slide 10 Space Craft Power Distribution [Schematic] S/A Drive Motor/controls, Solar Array, BDA, Battery Charge, Regulators FETS/Diodes, Battery, TO258, Battery Charger/Discharger, Solar Array Shunt, Rectifier Mosfets, BUS, Loads, Motor Controls Gyro, 3o Bridge Mosfets Module, Transmit Receiver, (TWT) or (Solid State Phased Array), Power Conditioning Unit, Mosfets, Diodes, TVS, Zeners, Schottky, Bi-polar Up to $500K/Satellite Slide 11 Battery Bypass Solutions LEO Power configurations [graphic of Figure 1. Direct energy transfer power system] [graphic of Figure 2.NiH2 battery life vs. temperature and depth of discharge] [graphic of Figure 3. NiH2 battery using individual pressure vessel cells] [graphic of Figure 4. NiH2 battery using single pressure vessel] [picture of discrete electronic components] [picture of Patented Battery Bypass Modules] Calendar GEO Cells Estimated Estimated Forecast Year Satellite (x 60) Usage % Usage $1200/ea - -------------------------------------------------------------------------------- 2002 120 7200 70 5040 6,048,000 2003 180 10800 70 7560 9,072,000 Program Leo Satellite (x40) Est % Estimated Usage $600/ea Teledesic 288 11520 100 11520 6,912,000 Slide 12 Solar Panel Diodes Key Customers . Spectrolab . Tecstar . Lockheed . Toshiba . TRW . DASA . Sun Power (Industrial) BDA Diode. 18 mils high! [picture of solar panel] [picture of diodes] Slide 13 Launch Vehicles [picture of rocket and launch vehicle] Communications/Navigation - - Transmitters (HV Diodes) - - Amplifiers (RF Transistors) - - Ring Laser Gyro (HV Diodes, MOSFETs) Motor Control - - Deployment Motor Control(SCR or FETs) - - Thrust Vector Actuation (FETs, SCRs, Transistors) Power Distribution - - Power Supplies (FETs, Schottkys, Rectifiers) - - Logic Control Protection (TVS, Zeners) - - Thermal Battery (Charge/Discharge - Schottkys, FETs, Rectifiers, Modules) Stage Firing - - Squib Fire Circuits (MOSFETs, SCRs) Slide 14 New Launch Vehicles . Sea Launches (Oil Rigs) . Pioneer Space Plane . Eclipse Astroliner . Kelly Space . Rail Gun Launch . Key to note that there are several new technologies emerging with a myriad of Microsemi opportunities. [graphic of aircraft and KST Eclipse Astroliner] Slide 15 Missiles/Torpedos . Thermal Power Conversion . Power Distribution . Receivers/Transmitters . Steering/Control -Flap Sections . Fire Control (from source) . Ring Laser Gyro/Guidance . Cameras . Fuse [picture of military helicopter] [picture of torpedo] Slide 16 Missiles [graphic of missile] Steering - - Flaps (MOSFETs) - - Power rectification (Single Phase Rectifier Bridge) Missile Deployment - - Fire Control (SCRs, Transistors) Gyro/Navigation - - Pitch/Roll Control (MOSFETs) - - ASIC protection (Zeners/TVS) Bomb Fuse - - (SCRs, Transistors) - - Active Seeker/Radar (High Voltage Diodes) - - Laser (Low Voltage, High Power) Seeker/Transmitter - - Active Seeker/Radar (High Voltage Diodes) - - Laser (Low voltage, High Power) Slide 17 Creating Function Blocks [picture of electronic components] . Axial and Melf . Power Limitations . Max is 6 Amps [picture of components] . DO-4/DO-5 . Heavy . Mismatched materials [picture of Hermetic Power Modules] . TO-3/TO-254 . Heavy . Mismatched Materials [picture of discrete components] . X and G Body . 50-100 Amps! . Low Thermal Resistance [picture of Thinkey] . ThinKey(TM) . Schottky Surface Mount . 30, 100 Amp versions . Low Thermal Resistance [picture of CoopPack] . CoolPack . MOSFETs and IGBTs . Light . Low Thermal Resistance Slide 18 Hermetic Power SubSystems [picture of Hermetic Power components [picture] [picture] [picture] [picture] [picture] Sundstrand Generator Modules TRW Satellite Modules Mitsubishi space modules Boeing TWTA modules EX-99.4 4 dex994.txt SWITCHING REGULATORS Exhibit 99.4 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day | | http://www.microsemi.com Slide 1 DC:DC Terms Switching Regulators Paul Pickle, Product Marketing Manager, DC:DC Circuits Slide 2 Agenda . Overview of DC:DC Terms -- "Water in the Bucket" . Focus on Switching Regulators -- Comparing Topologies -- Why Load Share(TM)? -- Applications and Benefits Slide 3 DC:DC Terms . Buck - (Down) . Boost - (Up) . PWM . PFM . Quiescent Power . Efficiency . Power Demand . Switcher . Linear Regulators . Charge Pump [graphic of Linfinity LX8580-00CDD THAI 0034C] Slide 4 Knowing The Application LCD +/-15V, 3.3V @200mA, 700V @ 5mA Strong Arm 1.75V @ 200mA, 3.3V @ 600mA Pentium IV 1.6V @ 50A, 3.3V @ x mA DSP 1.8V @ 90mA, 3.3V @ 50mA DRAM 2.8V @ 10mA Slide 5 Example: PDA Power Management [schematic] 110VAC, AC/DC Converter, LX1552 SG3842, 4.4VDC @ 1.1A, [3.6V, 1.8V @ 500 mA, 2.5V @ 400mA, 3.3V @ 200mA, 5V @ 50mA], Wireless Application 3.6V Switcher PFM/PWM 1.8V @ 500mA 3.6V Switcher PWM 2.5V @ 400mA 3.6V LDO PMOS 3.3V @ 200mA 3.6V Charge Pump 5V @ 50mA Slide 6 Implementation Tradeoffs
Pro Con [schematic] LDO - Input, 5V @ 3A, 1.4V Dropout, --------------- --------------------- Output 3.3V @ 3.0 A Simple Can Be Inefficient Low Cost Heat P in -P out = P Dissipation 1 Device Maximum efficiency at 15W - 9.9W = 5.1W Specific JOJT to VIN %eff = 66% Point of Use Relationship Pro Con [schematic] Switcher - Input, 5V @ 2.15A, --------------- --------------------- output 3.3V @ 3.0A Hight Efficiency Magnetics High Power Noise P in -P out = P Dissipation I/O Adaptable Board Space/Components 10.75W - 9.9W = .85W Complexity % eff = 92% Pro Con [schematic] Charge Pump* - Input, 3.3V @ 111mA, --------------- --------------------- output 5.0V @ 50mA No Magnetics Output Current Limited Simple Boost Efficiency % eff = 68% *90% eff @ V out = 2V in Cost Noise
Slide 7 Switching Regulators Slide 8 History . 1968 - Silicon General: First Integrated PWM Controller IC . 1993 to 1997 - Developed Family of 10 PWM VRM Controller ICs In Conjunction With Intel VRM Specification . 1998 - Ceased Development On VRM Due To Poor Sales and Market Volatility (We Hit A Brick Wall!) . 2001 - Architected New Patented Architecture Targeting Video Card and Other Applications Slide 9 Core Competency / New Strategy . Leverage What We Know Into An Application With An Identified Need . Video Processor Power Demands Were Quickly Exceeding Available Power Budgets . Roadmap For Power Budget Showed a Continued Increase . Can We Make Money In A Desktop Environment? . How Do We Leverage The Video Market Success Into More Dollars - DVD, Gaming Consoles, etc. Slide 10 Targeting Video Processors . What Sets us Apart - Current Sharing Voltage Mode Multipurpose Operation - Patented architecture, best of both worlds Topology Applications Desktop Notebook Video Card - ---------------------------------------------------------- Duty Cycle Semtech Semtech Semtech Sense Resistor Linear Tech Linear Tech RDS(ON) Intersil Intersil Inductor Reactance Semtech Semtech Load Share Microsemi Microsemi . Our Products - LX167X Family of Controllers - Addresses major issues facing high speed video processor companies [schematic] LX1671 - V Out 1 =, L3, +5V, 3.3V, L1, V Out1 =, L3, +5V, 3.3V, V Out 3 = . Target Applications - Graphic Cards - Game Consoles - Next Generation Set-Top Box [Logo nVidia gForce3 Ti] [picture of two monitors] [picture of game machine] Slide 11 What is LoadSHARE(TM)? Slide 12 Current Mode - Sense Resistor . Uses Sense Resistors In Current Path To Balance Current In Each Phases . Best Precision Current Sharing . Sense Resistors Are Costly - Asian Manufacturers Prefer Not To Use Them [schematic] 12V, L3, CFB1, V Out, FB, CFB2, L3, 5V Linear Tech - Notebooks Slide 13 Current Mode - RDS(ON) . Uses FET Resistance In Current Path To Balance Current In Each Phases . Poor Current Sharing Due To Variation In RDS(ON) With Temperature . RDS(ON) Trends Continue Downward Creating A Signal To Noise Problem [schematic] CFB1, 12V, L3, V Out, FB, L3, 5V, CFB2 Intersil - P4 MB Slide 14 Current Mode - Inductor Reactance . Reliant on Additional Matched and Tuned Components . Poor Current Sharing greater than 10% . Very Dependent on Component Types and Tolerances. . No Load Sharing On Multiple Supplies [schematic] 12V, CFB1, L3, V Out, FB, CFB2, L3, 5V On Semi - P4 MB Slide 15 Voltage Mode - Duty Cycle . Open Loop Current Feedback . Poor Current Sharing greater than 10% Even With 1% Accuracy In Duty Cycle (aka. Marketing Scam) . No Load Sharing On Multiple Supplies [schematic] 5V, L3, V Out, FB, L3, 5V Semtech - P4 MB Slide 16 Voltage Mode - LoadSHARE(TM) . Forces Pre-Inductor Switching Output DC Voltage To Be Equal . Inexpensive Components . Load Sharing From Multiple Inputs Via Inductor ESR . less than 10% Current Sharing Tolerance . Programmable Current Sharing Via One Of Three Methods . Good Transient Response . Patented By Microsemi [schematic] 12V, CFB1, L3, V Out, FB, L3, CFB2, 5V MSCC - Video Cards / Notebooks Slide 17 Why LoadSHARE for Video Applications 3.3V @ 6A = 19.8W 5V @ 3A = 15W 12V @ 1A = 12W Accelerated Graphics Port Available Power [schematic] 2.8V @ 3.86A = 10W, Memory Core, 1.4V @ 3.21A = 4.5W, DDR Termination, Memory Bus, 1.6V @ 15A = 24W, Core, [nVidia gForce 3 Ti Logo], I/O, DDR memory PCORE = 24W greater than Any Available Supply!! Slide 18 Sneak Peek - Notebook LoadSHARE(TM) [schematic] U1 LX167x_MLP-Q, FB-1, DF Out 2, EO1 3, EA1-4, DACOUT 5, PWRGD 6, GND 7, VIN 8, ROSC 9, ENA 10, VID4 11, VID3 12, VID2 13, VID1 14, VID0 15, VS2 16, HO2 17, VC2 18, VDD 19, PGN3 20, I-MIN 21, VCCL 22, LO2 23, PGN 24, LO1 25, VS1 26, HO1 27, VC1 28, VC3 29, I-MAX 30, VS3 31, CSHP 32, ILIM 33, LP1 34, LP2 35, EA2-36, EO2 37, FB+ 38, R7 TBD, R8 TBD, C9 TBD, R9 TBD, C10, 4.7uF, VBAT, R10 TBD, R11 TBD, R12 TBD, R13 TBD, R14 TBD, R15 TBD, +5VP, R16 TBD, J1 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, +5V, C1 4700pF, R1 200K, R2 61.9K, C2 4700pF, R3 TBD, C3 4700pF, R4 61.9K, R5 TBD, R6 10.0, +5VP, C7 4.7uF, C8 4.7uF, CR3 1N5817, Si4842DY, Q1, C4 0.1, Si4842DY, Q2, CR1 TBD, +C11 150uF 6.3V, CR2 TBD, L3 100nh, CR4 1N5817, +5VP, C13 4.7uF, TB3 1 CORE+, R17 ZOJ, + C19 270uF 2V, TB4 1 VCORE, TB3 2 CORE-, R18 ZOJ, ED120/2DS, TB4 2 RTN, ED 120/2DS, +C18 270 uF 2V, +C20 270uF 2V, +C21 270uF 2V, L2 4.7 uh, TB1 2, +5VIN, +5VP, TB1 1, +5RTN, +C12 150uF 6.3V, ED120/2DS, TB2 2, +BATT IN, VBAT, TB2 1, BATT RTN, +C15 100uF 25v, ED 120/2DS, CR4 IN5817, +5VP, C3 4.7uF, VBAT, +C16 TBD, Q3 Si4842DY, C5 0.1, L1 4.7uh, Q4 Si4842DY, CR5 IN5817, +5VP, C14 4.7uF, VBAT, +C17 TBD, Q5 Si4842DY, C6 0.1, L2 4.7uh, Q6 Si484 2DY, +C20 270uF, 2V, +C21 270uF, 2V EX-99.5 5 dex995.txt AUDIO PRODUCTS Exhibit 99.5 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day 11/7/2001 http://www.microsemi.com Slide 1 Managing Sound Mike Tanaka, Product Marketing - Audio Products Slide 2 Disclaimer . Some of the information in this presentation may contain projections or other forward-looking statements regarding future events or the future financial performance of Microsemi Corporation. . We wish to caution you that these statements are only predictions and that actual events or results may differ materially. We refer you to the documents the company files from time to time with the Securities and Exchange Commission, specifically, the Company's most recent Form 8-K, 10-K and Form 10-Q. . These documents contain and identify important factors that could cause the actual results to differ materially from those contained in our projections or forward -looking statements. . Amounts shown are estimates of projected revenue growth from new products. These estimates represent the average of the range of company estimates developed from external market research data, as well as internal company market and product forecasts. Amounts could change due to changes in market conditions, customer acceptance and other factors, whether known or unknown to the company at this time. Please refer to Microsemi Safe Harbor Statement. Slide 3 Agenda . Audio Terms . Amplifier Classes . Linear vs. Class-D - Efficiency, Power Consumption, Distortion . Market Size . Applications . Class-D Amplifier Competition . Products . Roadmap . Market Update . Summary - Microsemi is the Class D Leader Slide 4 Audio Term -Frequency Spectrum . The frequency of an AC wave is the number of times per second that the wave makes a complete cycle from zero, through to its maximum positive value, through its maximum negative value, and back to zero. . Expressed in cycles per second (Hz) . 10,000 cycles per second = 10kHz . Frequency range of the human ear is 20Hz to 20kHz. . The complex sound wave is made up of many simple sinusoidal audio waves. Audio (20-20kHz) Microwaves <-------------> <--------------> VHF (30M-300MHz) <---> UHF (300M-3000MHz) <-------> To Heat Waves, -----> Light Waves, X-Rays <------------------------------------------------------------------------------> 10 100 1k 10k 100k 1M 10M 100M 1,000M 10,000M 100,000M (Hz) Slide 5 Audio Term - Distortion . The type of change the signal undergoes from input to output. . THD + N = Total Harmonic Distortion (plus noise) . The sum total of all undesired harmonic energy present in an output signal (expressed as a % of the total output signal). - pure sine wave input, measure output . Hum, buzzing, interference, other harmonics . Three types of distortion - amplitude: input signal amplitude changes do not produce proportionate output changes - frequency: some frequency components are amplified more than others - phase : various frequency components are shifted in phase by different amounts [three graphs of audio input and output] Slide 6 Amplifier Classes . Output voltage swing/Input voltage swing relationship . Output stage design . Based on the amount of time the output devices operate
Amplifier Amplifier Output Transistors Advantages Disadvantages Comments Classes Type - -------- ------------------- ------------------------------- --------------------- --------------------- --------------------- Class A Linear Always conducting for Sound the best, most Waste power, most Only 10% of entire cycle: bias current > linear, lowest inefficient (~20% the "high end" max output current. distortion. efficiency), large/ market heavy, run hot. Class B Linear Opposite operation of Better efficiency Poor linearity around Not used in Class A. Both devices than Class A. crossover region, audio. Two are never "on" at same audible crossover way radio. time. Zero idle bias distortion with current. Each output small signals device is "on" for one half cycle. Class C Linear Output device is "on" Class B efficiency. Distortion. Not used in for less than one half cycle Capable of large audio. Broadcast (pulsed-on). output power. industry for RF transmission. Class AB Linear Combines Class Class A sound Power dissipation Most popular A & B. Mid- quality with good as heat. 50% audio amp conduction, constant efficiency. efficiency. design. bias current Dominate the (barely on). Market. Class D Switching Switch is fully Best efficiency Old design were Use pulse "on" or "off", 80% to 90%. limited to less than modulation. P = I x V = 0. 10kHz. Not as good THD.
Slide 7 Class D vs Linear - Efficiency . Efficiency (1kHz tone): - Linear amp = 55% - AudioMAX/TM/ = 85% . Efficiency comparison using "real music": - Linear amp = 14% - AudioMAX/TM/ = 60% . AudioMAX/TM/ is 4x more efficient than a linear amplifier in actual application
Efficiency Comparison of the Class-D Amplifier ----------------------------------------------------------------------- 100 | - Average Power Out for 20sec. Approx. 512mW | - Across 8.6 Ohm Load | [Microsemi Logo] 80 | | /\ / / \/ \ /\/ /\ /\ | /\ / \ / / /\/ \\ \/ //\//\ ///\ \ / \\ /\ \/ /\ /\/ / / | /\ / \ / / /\ / \ \ \/\ // \/ / \ ./\ /\ // \ \/ // / // 60 | / \ \ / // \ \ / \///\\/\ // /\ // \ .\\\ /// / | \ \/ \ //\/ | /\ / \ // | /\\/// \\/\/\/\\ \/ \ / \/ \/// 40 | / \ \ / \/ / \\//\ \/\/ \/ \/ \/\ | / \/ \/ \/\ | / 20 | / pp p p p p p p p p p p | / p p p p p p p pp p p p p p | / p p p p 0 ----------------------------------------------------------------------- 0 5 10 15 20
Seconds Audio sample from "Hold On Tight" By Electric Light Orchestra / = Microsemi Class-D Amplifier p - Highly Integrated Linear Amplifier Slide 8 Current Consumption . Supply current vs. output power (listening level of 1W RMS per channel) : - Linear amp = 550mA - AudioMAX(TM) = 100mA . AudioMAX(TM) uses 5x less current than a linear amplifier in actual application Total Supply Current (A) 1.4 1.2 o Vcc = 14.5V o 1.0 Rl = 4ohm o o 0.8 o o 0.6 o x 0.4 x o x 0.2 o x x x 0 x ---------------------------------------- 0 1 2 3 4 5 6 Output Power / Channel (W) x = Microsemi [Logo] Class-D Amplifier o = Typical Linear Amplifier (TPA 1517 specification shown here) Slide 9 Power Loss Comparison . Power dissipation (2W RMS continuous output per channel): - Linear amp = 6.5W - AudioMAX(TM) = 400mW . AudioMAX(TM) uses 6W RMS less power than a linear amplifier in actual application Total Power 7 o Dissipation (W) o o 6 o o o 5 o Vcc = 14.5V 4 o Rl = 4ohm 3 o o 2 o 1 x x x x x -------------------------------------------------- 0 1 2 3 4 5 6 Output Power / Channel (W) x = Microsemi [Logo] Class-D Amplifier o = Typical Linear Amplifier (TPA 1517 specification shown here) Slide 10 Linear vs. Class-D Amplifiers
Linear AudioMAX(TM) Class-A, B, C Class-D --------------- -------------- Efficiency (1kHz) 50%-60% 80%-90% Heatsink Required Optional Approximate # of components 10-15 35-45 for mono application IC average selling price $0.30 - $0.80 $1.50 - $2.00 Miscellaneous issues Needs larger power supply EMI radiation due to switching
Slide 11 Audio Market Potential . TAM for Audio Amplifiers at least 2.5 billion units . SAM (for Class D solutions) 100 million pcs/year - Battery powered (PDA/Laptop), Size (DVD), Heat (Auto) . Applications using or planning on using Class D - CY02 - 6-10% estimate - CY03 - 15-20% estimate - CY04 - 25-35% estimate . Microsemi Market Share Goal for Class D Audio: ---- - Low Power (in development, goal is 2%) -- TI , NSC, MXIM own this space - Medium Power (~30%) -- Tripath (switching freq problems), Zetex (mono only, more circuitry) - High Power (~15%) -- Tripath, Cirrus (relationship IRF helps) . Note: Analysis does not cover Hearing Aid market Slide 12 Applications: Efficiency is key
Applications Need for Existing or Potential Customers Class D - ------------------------------ -------- -------------------------------------------------------------- Multimedia, Powered PC Speakers, Altec Lansing, Boston Acoustics, Surround Sound Game Systems, High Creative, Cambridge Soundworks, Sound Cards Labtec, Weltronics Combo DVD, 5.1 Systems, Home High Japan, China, Bose, Harman, Sony Theatre Automotive (head unit, amp, Medium Alpine, Blaupunkt, Zandiant, Delco, Jensen, subwoofer) Panasonic, Rosen, Visteon, Zapco Portable Speaker, Wireless Speakers Ideal Advent, Harman (JBL), Recoton, Aqua Sound, Terion Niche Audio Systems Ideal Clarity Visual (large screen), M&S Systems (home music communication system),XL Synergy (Bose kiosk) Amp, Guitar, Keyboards Low Peavey, Fender TV Low/Medium Sony, Zenith, MOT set-top Portable Audio (PDA, MP3) Low/Medium Palm, Intel, HP, Compaq Notebook, Desktop Computer Medium Various [picture of stereo receiver] [picture of audio equipment] [picture of game machine]
Slide 13 Class D Competition
Digital Input Analog Input(low power) Analog Input (mid power) -------------------- --------------------------- -------------------------- Apogee, Cirrus Logic Maxim, National, Microsemi, Tripath, (Crystal), TI (Toccata) STMicro, TI Zetex Output Power Various Levels, Some 1W / 10W 25W / 50W+ Limited Cost $6/channel $1.50/channel $1.50/channel Circuit Complex, DSP based Simple, Integrated FET Simple Fidelity (THD) 0.08% (Mixed Reviews) 0.1% - 0.5% 0.04% - 0.1% Digital Input: Higher cost, more complex design, questionable fidelity Analog Input (low power): Integrated, but limited output power Slide 14 Medium Power - Competition Microsemi Tripath Zetex Competition ----------------- ---------------- ----------- --------------- Max Vdd 25V 13.5V 18V Limited Output Power Frequency 250kHz - 500kHz 1MHz 150kHz-250kHz AM band, EMI, reduced Programmable efficiency Efficiency 80%-85% Rated at 88% 80%-85% 70% from Lab evaluation of Tested to be 70% TA2020 -need heatsink FETs/Components External Integrated External plus No cost benefit with additional circuitry integrated FETs Channels Mono/Stereo Stereo Mono Need more IC's for multi-channel
Slide 15 Patented Class-D Controllers LX1710 / 1711 LX1721 / 1722 ---------------- ------------- Channels mono stereo Package 28-SSOP 44-QSOP Operating V 7-15 / 7-25 7-15 / 7-25 Audio Input differential differential Improvements ramp, references output drive
[schematic of controllers] Channel 1, IN+, IN-, LX1722 Stereo, Channel 2, IN+, IN-, Clock, LX1711 Mono, channel 3, IN+, IN-, FETs, Left, FETs, Right, 2ohm, 4ohm, 8ohm, FETs, Subwoofer Slide 16 Ease of using MSCC Audio Evaluation Boards [picture of LXE1710] [picture of LXE1711] [picture of LXE1711-100 Buffer] [picture of LXE1721] [picture of LXE1721-HV Driver] [picture of LXE1722] Slide 17 Medium/High Power Solutions
IC Evaluation Boards Typical Output Power Typical Output Power (4ohm, less than 1% THD+N) (2ohm, less than 1% THD+N) - ------- ------------------- -------------------------- -------------------------- LX1710 LXE1710 25W ~40W LX1711 LXE1711 50W ~50W LX1711-100 Buffer 60W 120W LX1721 LXE1721 25W x 2 ~40W x 2 LX1721-HV Driver 50W x 2, 250W x 1 400W LX1722 LXE1722 60W x 2 120W x 2 Typical Output Power, less than 1% THD+N
[picture of Altec Lansing Speakers] [picture of IBM FlatPanel Speakers] Slide 18 Audio Roadmap . Low Power Solutions - 5 new products in development . Medium Power Solutions - 2 new products in development . High Power Solutions - 1 new product in development . Roadmap established for all digital solutions Slide 19 Market Update . The Market is ready and designing in Class-D Amplifiers . North America - Manufacturers rapidly adopting Class D as preferred solutions - Over 5 Design wins in last 30 days . Asia - China -- All Manufacturers are designing surround sound "amplified" DVD/VCD/CD players that require a high efficiency amplifier -- Car audio will utilize class-d for specialized applications now and will consider class-d for higher power head units -- All digital for the future but cannot differentiate or justify now - Japan -- Sony's all digital input has forced the all digital solution - Estimate 3 new customers pending Slide 20 Audio Summary . Microsemi was first to market (2 years ahead of competition) - Case of waiting for market to catch up . Ideal for efficiency critical applications . AudioMAX power levels support major markets (10W to **50W) . Simple approach offers the best performance/cost available . Optimum cost solution for higher power requirements (power supply, heatsink) . Microsemi's "work with customer" approach and support . Roadmap for *1W portable, higher power, and all digital EX-99.6 6 dex996.txt MANAGING LIGHT- CCFL Exhibit 99.6 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day | 11/7/2001| http://www.microsemi.com Slide 1 Managing Light - CCFL Roger Holliday, VP of Marketing/Product Development Slide 2 LCD Backlight Inverter . A backlight inverter is a small power supply that converts a low voltage DC signal to a high voltage AC Signal capable of driving a CCFL . A NIT is a measurement of light typically used to define display brightness characteristics and often used in display comparisons (candella/meter2) . A CCFL inverter efficiency is defined as its ability to convert power into light. The term Nits/Watt is used for this comparison [picture of circuit board] [picture of AAA alkaline battery] [picture of circuit board] Slide 3 Managing Light (CCFL) . What sets us apart - Patented Fluorescent Lamp (CCFL) Driver Architecture -- 50% more efficient than competition -- 40%- 90% less components -- Full Range Dimming /Full Temp Range - Application engineering -- Products designed for specific end markets -- PDA, Automotive, LCD TV products . Applications -- PDAs (leader in CCFL lit color displays) [picture of PDA] [picture of PDA] [picture of PDA] [picture of PDA] [McDonald's Logo] -- Wireless Web, AutoPC, 3G Phones, Medical Displays, Voice Over IP Phones, Fish Finders, Pen Based computers . What's next? -- Ambient light tracking systems, auto-brite adjust [graphic of AutoPC] [graphic of AutoPC] [graphic of Parview Golf GPS] Application Major Design Wins - ------------------------ -------------------------------------------- Automotive BMW Automotive Clarion AutoPC Automotive Marelli (Italy) Automotive Mercedes* Automotive Rosen Avionics Kaiser F-22 E Book Go Reader E Book RCA Entertainment Boeing 777 Entertainment Sony InFlight Systems LCD Monitor Phillips LCD Monitor Samsung Notebook Compaq Armada PDA Compaq iPAQ PDA HP Jornada Series PDA Palm IIIC PDA Siemens PDA PDA Toshiba e570 Pen Computer Symbol Portable Pen Tester/Meter Agilent Optical Tester Web Tablet AirSpeak FLAIR Web Tablet Intel Web Tablet Nokia Web Tablet Sonic Blue/Number 9 Slide 4 CCFL Competition . Linear Tech - The encumbant (high priced, standard products) . Maxim/Micrel (niche) . TI/Unitrode (not a focus) . O2Micro (strong in Taiwan) . MPS (struggling, presence in Taiwan) Slide 5 Reducing Inverter Size Complete LXM1617 Inverter BOM - ----------------------------- 1 LX1689CPW 1 Transformer 1 Dual FET 5 Resistors 8 Capacitors 16 Parts - Total Count! Slide 6 What sets us apart . System engineering and integration, design, and process expertise for battery operated applications . Combination of IC, Systems and Module Technology . Historical and base expertise in PWM technology . Efficiency, Wide Range Dimming Capability and Compact Form Factor Slide 7 What's Unique About our Inverters? . Full feature performance including Wide Range Dimming. . Produces 20% to 35% more light for the same power than existing solutions. . Full temperature operation Light Out (NITS) 120 x o x o 90 x o x o 60 x o x 30 x x 0 x ---------------------------- 0.3 1.0 2.0 3.0 4.0 5.0 Power Used (WATTS) X = RangeMAX o = Other Inverters Slide 8 Digital Dimming [Figure 3 - 50% Burst Duty Cycle] [Figure 4 - 2% Burst Duty Cycle] [Figure 5 - 2% Burst Duy Cycle (Expanded Time Base) [graphic of computer icon] [picture of laptop computer] Slide 9 Efficiency Analysis Examples Program/Customer Efficiency Improvement - ------------------------------------------------------- . Palm (3Com) 3C PDA +28% . Intel Strongarm Web Tab >20% . Compaq "IPAQ" +60% . HP Jornada +24% Slide 10 Severe Systems Applications . Automotive Requirements - -40C +85 operation - High pressure Lamp Technology - Night Time Driving Conditions - Day Time Driving Conditions - Safety . Customer Base - Europe - Becker, Philips, VDO, Yazaki - Japan - Matsushita - USA - Visteon, Rosen . Vehicle Platforms - BMW, Audi, Porsche, Mercedes, Ford, Lincoln, Honda, Pontiac, Fiat . Applications - GPS, Auto PC, Rear Seat Entertainment Slide 11 High Pressure vs Standard CCFL Light Output Vs. Temperature Temperature in C Standard High Pressure (Light Output in Nits) - --------------------------------------------------- - -40 25 500 - -35 35 950 - -30 40 1200 - -25 50 1400 - -20 100 1667 - -15 200 1837 - -10 348 2030 -5 500 2200 0 700 2378 5 896 2519 10 1200 2650 15 1681 2770 20 2100 2896 25 2459 3000 30 2815 3100 35 3100 3150 40 3311 3150 45 3400 3100 50 3341 3000 55 3200 2900 60 3000 2800 65 2750 2750 70 2500 2700 75 2170 2650 80 1756 2625 85 1250 2600 Slide 12 Low Temp Features Light out vs. Time as function of Lamp Current Amplitude Nominal Lamp Current Rating is 9 MA RMS 300 x x x x LCD PANELAT -40C x x 250 Ligt Out (NITS) 200 o o o 150 x o * * * 100 o * * # # # 50 o # x # 0 xo*# ----------------------------------------- 0 20 40 60 80 100 120 Time(Seconds) X = 15 mArms o = 11 mArms * = 10 mArms #=9 mArms Slide 13 Insta-Brite [Linfinity Logo] [schematic] Current Amplitude Control Dimming, 9mA, 6mA, 3mA, +VDigital Duty Cycle Control Dimming, 6mA, LXM1614, 9mA, 6mA, 3mA, Backlight Inverter Combines Current Amplitude and digital Techniques Microsemi Combines These 2 Techniques Into One RangeMAX Module Slide 14 Markets/Positions . PDA - Dominant with 1st Tier Manufactures, estimate 60-70% share of color CCFL lit market - Efficiency, Parts Count - Compaq IPAQ, Toshiba, HP Jornada, Symbol, Olympus, Nokia, Ericsson . Automotive - Dominant with 1st Tier Manufacturers - System Expertise, Dim Range and Hi Press Technology - BMW, Mercedes, Audi, Ford, Lincoln,....... . Notebook - Niche Position transitioning To Mainstream - Efficiency, Parts Count - Compaq Armada Series, Taiwan Subcons . LCD Monitor/TV - Niche Position - Efficiency and Lamp Life - Pursuit with new IC Slide 15 RangeMAX Opportunity RangeMAX Projected Revenues Minimum Range Maximum Range - ------------------------------------------------------------ FY 99 ~1 FY 00 ~3.5 ~3.5 FY 01E ~8 ~12.5 $Millions FY 02E ~15 ~20 FY 03E ~22 ~32 Slide 16 RangeMax Family . Production - LX1686 - The Original Direct Drive CCFL Controller - LX1689 - PDA, Notebooks, and Monitors Markets -- High Efficiency -- Less External Components Vs LX1686 . Sampling - LX1688 - High Performance Monitor Market - Synchronize Lamp Current Frequency and Phase of up to 10 Controllers - Lamp Failure Reporting . Final Development - LX1687 - Automotive Market -- Wide Range Dimming (1000:1) -- Wide Temperature Operation - LX1690 - PDA and Notebooks -- Wide Input Voltage Range (6-28V) Slide 17 Why the Excitement . Explosive LCD Growth > 25% annual . Emergent Auto Market, CY2002, CY2003 . Dominance in PDA and Automotive . Patent Protection . Lowest Industry Part Count Solution . 1st Tier Partnerships . Complementary New Product Opportunities ($/System) -- "Human Eye" Ambient Light Detection -- DC/DC Conversion Products -- LED -- LED Drivers -- AudioMax -- Transient Protection solutions -- RF products -- Heaters/Coolers for Automotive Seats . ($ / System) EX-99.7 7 dex997.txt LED OPPORTUNITY Exhibit 99.7 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day | 11/7/2001 | http://www.microsemi.com Slide 1 Microsemi LED Opportunity Managing Light Steve Litchfield, Business Development, Director Paul Pickle, Product Marketing Manager, DC-DC Products Slide 2 MSCC LED Opportunity . Blue/White LED Market Opportunity - 24% CAGR for the InGaN market through 2005 - Emergence of Blue/White applications in mobile devices growing rapidly . Why Microsemi chose LED market? Market need! NEGLECTED end-users - No system solutions, lack of unique drive techniques, packaging/heat issues - Epoxy degradation, reliability problems, discoloration, inconsistency, etc.
Revenue ($ Millions) 2000 2001 2002 2003 2004 2005 CAGR - ----------------------------------------------------------------------------------------- Illumination 40 56 87 134 201 291 Automotive 282 338 385 440 485 558 Signs 392 597 784 990 1130 1185 Backlight 324 416 554 707 885 1041 Signals 34 42 55 74 82 95 Electronic Equip 148 179 218 247 280 293 Total 1220 1628 2083 2592 3063 3463 2000 2001 2002 2003 2004 2005 CAGR - ----------------------------------------------------------------------------------------- InGaN 739 974 1272 1599 1911 2192 24.30%
InGaN by Segment 2000 2001 2002 2003 2004 2005 CAGR - ----------------------------------------------------------------------------------------- Illumination 25 37 59 98 148 217 53.90% Automotive 110 123 131 138 143 159 7.70% Signs 193 287 383 481 529 550 23.30% Backlight 292 378 511 662 840 1001 27.90% Signals 28 34 44 56 60 66 19.10% Electronic Equip 92 115 143 165 190 199 16.80% Units 1327 1884 2657 3645 4820 6257 36.40% Total 740 974 1271 1600 1910 2192 24.30%
Illumination Units(M) 37 58 99 179 292 466 ASP($) 0.68 0.64 0.61 0.55 0.51 0.47 ASP decline rate -5.9% -4.7% -9.8 -7.3% -7.8% Revenue($M) 25 37 59 98 148 217 Revenue growth rate 48.0% 59.5% 66.1% 51.0% 46.6% Auto Interior Units(M) 269 331 387 447 515 639 ASP($) 0.48 0.43 0.38 0.34 0.29 0.26 ASP decline rate -10.4% -11.6% -10.5% -14.7% -10.3% Revenue($M) 110 123 131 138 143 159 Revenue growth rate 11.8% 6.5% 5.3% 3.6% 11.2% Full Color Signs Units(M) 322 532 806 1150 1490 1821 ASP($) 0.6 0.54 0.48 0.42 0.36 0.3 ASP decline rate -10.0% -11.1% -12.5% -14.3% -16.7% Revenue($M) 193 287 383 481 529 550 Revenue growth rate 48.7% 33.4% 25.6% 10.0% 4.0% Backlight Units(M) 470 647 920 1278 1752 2367 ASP($) 0.66 0.61 0.56 0.5 0.44 0.37 ASP decline rate -7.6% -8.2% 10.7% -12.0% -15.9% Revenue($M) 292 378 511 662 840 1001 Revenue growth rate 29.5% 35.2% 29.5% 26.9% 19.2% Traffic Signals Units(M) 46 62 86 119 140 167 ASP($) 0.6 0.55 0.51 0.47 0.43 0.4 ASP decline rate -8.3% -7.3% -7.8% -8.5% -7.0% Revenue($M) 28 34 44 56 60 66 Revenue growth rate 21.4% 29.4% 27.3% 7.1% 10.0% Electronic Equipment Units(M) 184 255 358 471 632 796 ASP($) 0.5 0.45 0.4 0.35 0.3 0.25 ASP decline rate -10.0% -11.1% -12.5% -14.3% -16.7% Revenue($M) 92 115 143 165 190 199 Revenue growth rate 25.0% 24.3% 15.4% 15.2% 4.7% Total Units 858 Total Revenue($M)
Slide 3 InGaN Market . TAM: $450mm `01 . Market Share . Growth 24% CAGR - Backlight 28% - Luminescence 54%
HB LED Lamp Revenue Share % Blue/ HB LED Die Mfg Total/mo Total blue/ Total blue/ Revenue by ($M) Green Volume (top4) (M) green/mo green/yr Supplier - ------------------- ------- ----- ------- -------------- -------- ----------- ----------- Nichia 269 22% 80% Nichia 70 80% 840 Toyoda Gosei 166 14% 70% Toyoda Gosei 60 70% 720 Citizen Electronics 106 9% 80% Cree 60 100% 720 Stanley Electric 75 6% 40% Osram 25 100% 300 Matsushita Electric 43 4% 50% Toshiba 34 3% 30% Sharp 12 1% 30% Agilent/Lumileds 177 15% 10% AXT 5 0% 80% Osram 179 15% 80% Taiwan(3Co.) 137 11% 30% Other 17 1% 30% [color graphic of LED Lamp Revenue by Region] Japan 705 59% Europe 179 15% US 182 15%
Slide 4 Microsemi's LED Market 1 Mobile applications (TAM: $500 mm `02) - PDAs, Cell phones, Internet appliances - Convergence in industry of PDA and phones 2 Automotive applications (TAM: $131 mm `02) - Auto PC, backlighting, displays, map lights, etc 3 Luminescence (TAM: $59 mm `02)
InGaN by Segment 2000 2001 2002 2003 2004 2005 CAGR - -------------------------------------------------------------------------------------------------- Backlight 292 378 511 662 840 1001 27.90% Automotive 110 123 131 138 143 159 7.70% Illumination 25 37 59 98 148 217 53.90% Signs 193 287 383 481 529 550 23.30% Signals 28 34 44 56 60 66 19.10% Electronic Equip 92 115 143 165 190 199 16.80% Units 1327 1884 2657 3645 4820 6257 36.40% Total 338 473 629 800 927 1032 24.30%
Slide 5 What sets us apart? . Experience Driving Light - History -- Patented digital dimming for CCFL solutions -- Solved temperature problems for automotive customers -- Solved power efficiency problems for mobile customers on battery life - Dominant products on CCFL -- 50% more efficient than comparable technologies -- Reduce component count by half - Total engineered system level solution -- No one in the market understands the system -- Maximized expertise is power management, packaging, and drive architecture . Packaging Expertise - Biggest problem today in LEDs is HEAT -- We have packaging technology to get heat out of the package -- Competition doesn't understand this, and disconnected- who's job is it? -- Discrete devices that we have decades of experience with dealing heat dissipation [picture of three Optomites for Large Area LEDs] [picture of discrete component] [picture of four electronic components] Slide 6 CCFL vs. LED System Cost Lamp - $2.00 LED- $8.00 - 70nits (3"screen) - 70nits (8 LEDs) - 550 mW - 8 LEDs (650mW) . Driver- $5.00 . Driver- $1.25 . Light pipe- $1.00 . Light pipe + diffuser- $1.25 . Display- . Display-Possible reduction Constraints Additional Gains- $ X Noise Form factor Fragile Ruggedness Power consumption Power consumption TOTAL- $7 + TOTAL- $10.50 + Slide 7 CCFL vs. LED CCFL LED . Pro . Pro - Good light distribution - Point source light - High brightness - Low Voltage - Long Life - Simple to drive - Mature technology - Rugged - Theoretically efficient . Cons . Cons - High Voltage - Power efficiency - Complex Drive - Point source light - Fragile - Lifetime - High drive cost - White @ 4.0V (Li-Ion=3.6V) - EMI - Temperature sensitive Conclusion: CCFLs and LEDs still serve different markets with different needs for different applications at different price points Slide 8 Advantages of Approach . Inexpensive Silicon Substrate: Silicon starting substrates are less expensive than SiC or sapphire. They allow larger wafer diameters. . Larger chips/Less defect densities: Our device technology is built on silicon, we can make larger chips with less defects . Eliminates Epoxy Issues: Eliminates epoxy packaging with a hermetic wafer scale LED . Improved Thermal Resistance: Thermal resistance in the MMSM is near zero (Handles 10 watts of RF incident power today) enabling the ability to drive LEDs at much higher power. . Better Parasitic resistance: Improved to under 0.2pF coupled together with Nitronex advanced EPI growth know-how can deliver LED VF 3.2Volts! Slide 9 MSCC Approach 1 Optomite . Current product- Time to market is fast . Superior thermal efficiency- Addresses current need - 100C/Watt vs. 380C/W and 700C/W . Improve epoxy degradation . Chip agnostic- Initially using Cree MB 2 MMSM . Ultimate device . GaN on Si - 4"wafers gives economies of scale . Eliminate epoxy degradation . Flip chip, hermetic, lower Vf, thermal dissipation high 3 Integrated, PM3, and High Power Slide 10 Highlight product, Optomite . Chip agnostic- initially Cree MB . Thermal efficiency 7x improvement over competition . Quick market entry . Blue product available 11/01 . White product available 1/02 - Working under NDA with key phosphor/epoxy suppliers . Performance/Cost competitive Anti UV performance Epoxy resin Transmittance 100 xo (%/1mmt/400nm) o o 90 x o o o o o x 80 x x 70 x 60 50 ---------------------------------- 0 1000 2000 3000 4000 time(hrs) [picture of three Optomites for Large Area LEDs] Slide 11 Current Concerns with LEDs
Problem Root Cause Solution - ----------------------- ----------------------- ---------------------- Epoxy discolor UV degradation Glass instead of epoxy Wire bond lift Power cycling Eliminate wire bond High thermal resist Device structure Flip chip Electrostatic Discharge Small junction Increase junction size Color consistency Poor Epi quality SIGANtic Cost Poor Yields Silicon Forward Voltage Device structure New device structure Color chromaticity Blue LED w/ YAG phosphor RGB phosphor
Slide 12 Highlight product, MMSM THE Ultimate Device! 1. GaN on Si - Economies of scale 2. Flip chip- Thermal dissipation 3. Hermetic package- reliable 4. Chip scale packaging 5. Eliminate epoxy degrade 6. Eliminate wire bond issue 7. Forward voltage reduction 8. UV with RGB produces high quality color capability [picture of discrete components] Slide 13 Future: Powermite 3, and... . Powermite 3 package potential to be the ideal for high power, thermal efficient package for luminescence . Integrated drivers on our GaN on Si LEDs . New packaging for new high power, large chips for lighting applications........ [graphic of die] Tab, Die, Lead Frame, Wire, Lead, Lead Notes: Die sizes Max = .110 Square Min = .035 Square [picture of discrete component] [picture of light bulb] [graphic of Traditional 5mm Package] Cathode, Reflector, LED, Gold Wire, Epoxy Dome, Anode [graphic of Luxeon Package] Aluminum or Copper Slug, Opto-coupling Silicon Gel, Plasti, LED Chip, Body, Cathode Slide 14 What Is An LED? . Voltage applied across device allows electrons to move across the junction between the n and p regions. . Once in the p region the electrons are immediately attracted to the positive charges due to the mutual Coulomb forces. . When an electron moves sufficiently close to a positive charge in the p region, the two charges "re-combine". . Recombination converts potential energy to Quantum electromagnetic energy (Photon) with a specific frequency. [graphic of LED Semiconductor Chip] Semiconductor, Lens, Leads [graphic of p and n regions] p, n, junction Slide 15 How To Drive An LED . Drive Voltage Must Exceed Or Equal LED V\\F\\ (Forward Voltage) . Drive Currents (IAVG) Must Not Exceed Rating . LEDs Require a Current Source (What does that mean?) . Blue/White LEDs Have A VF = 4.0V [schematic] Rc, V greater than or equal to VF, 1LED = V - VF Rc Slide 16 Parallel Drive . Fixed Output Voltage (Excess Power Dissipated in RLim) RLim - VOut - VF --------- 1F(MAX) [schematic] Lilon, Boost Converter, RLim, RLim, RLim, RLim . Adjustable Output Voltage RLim = VREF ------- 1F(MAX) [schematic] Lilon, Boost Converter, VREF, RLim, RLim, RLim, RLim * more than and equal to Slide 17 Series Drive . Adjustable Output Voltage RLim = VREF --------- 1F(MAX) [schematic] Lilon, Boost Converter, VREF, RLim Slide 18 Inductor Based Boost Converter . Uses Faraday Principle To Boost Output Voltage . Advantages - Capable of Large Output Voltages - Efficient Conversion . Disadvantages - Component Count - EMI/RFI - Cost [schematic] Battery, Inductor Based Boost, In, FB, GND Slide 19 Charge Pump/Voltage Doubler . Uses A Capacitor To Transfer Charge . Advantages - Simple Implementation - Cheap - Few Components . Disadvantages - Can Have Poor Efficiency [schematic] Battery, Charge Pump, VREF, RLoad Slide 20 Current Sink/Regulator . Adjusts Resistance To Maintain Set Current . Advantages - Simple Implementation - Cheap - Few Components . Disadvantages - Must have voltage supply already available. [schematic] VLed, Current Sink, 5V Slide 21 Parallel Drive Drawbacks . Current/Light Matching Variation - Currently white LEDs have a typical forward voltage (VF) of 3.6V and a maximum VF of 4.0V. Low temperature operation can further raise the maximum VF to 4.2V. Drive current variations also affect VF. - LEDs have a linear relationship of current vs. light intensity. Given VF variation, light intensity variations of over 40% may be experienced in a given application. . Efficiency Degradation - Since a current limiting resistor is required for LED drive circuits, then a power loss is experienced across this resistor on the order of 31mW for series drive and 125mW for parallel drive. Series configuration offers a 25% improvement in the efficiency calculation. Slide 22 Series Drive Drawbacks Inductor Boost . Cost . Switching Noise . More Complex Design . Output Voltage Clamp Recommended - If the load is disconnected for any reason, then the FB pin is rounded causing the output voltage to climb until components fail. Slide 23 Introducing LX1992 [schematic] On/Off, IN, SHDN, LX 1992, ADJ, GND, CS, RCS 4k Ohms, FB, SRC, DRV, L1, 47 uH 1206 Case Size, C1 4.7 uF, R Set 15 Ohms Vbat = 1.6V to 6.0 V Vf = 3.6V typ. 1Led = 20mA to OmA Slide 24 Introducing LX1990 [schematic] VIN = 5V, VDD, ENA, LX 1990, ISET, VSS, IS1, IS2, 10k Slide 25 Soon To Come... [schematic of White LED Driver] VIN = 1.8V TO 4.4V, 6, Charge Pump, 7, 5, 8, 550kHz OSC, thermal Shutdown, 1.25V REF,- LDO +, 1, 3, LEDn + 1, Vout = 3.6V [schematic of DM/DU Package (Top View)] Vout, 1, SHDN, 2, FB, 3, GND, 4, C+, 5, Vin, 6, C-, 7, CPO, 8 Slide 26 Soon To Come... [schematic of LX199x] VDD, IS6, IS5, IS4, IS3, IS2, IS1, VSS, ISET, 10k, ENA Vin = 5V Slide 27 Soon To Come... [schematic of LX199x] On/OFf, SHDN, IN, SW, OUT, FB, CS, GND, ADJ, 47mH 1206 Case Size, L1 C1 4.7uF, R3 15Ohms, Rcs 1kOhms V Bat = 1.6V to 6.0v Slide 28
Product Roadmap Oct Nov Dec Jan Feb Mar Apr May Jun Jul Aug Sep Oct 01 01 01 02 02 02 02 02 02 02 02 02 02 ------------------------------------------------------------------------------------ Optomite Color - ------------------------- ---- PBLED-470-HB, Blue **Development- Samples - Production - UB, MB /\Data Sheets UPWLED-470-HB, White - Development - Samples - Production - UB, MB /\Data Sheets UPWLED-405-MB White Development - Samples - Production - /\Data Sheets MMSM - -------------------------------- MBLED-470-1 Blue **Development- Samples - Production - /\Data Sheets MBLED-470-1 White - Development - Samples - Production - /\Data Sheets MMWLED-405-1 White ** Development - Samples - Production - /\Data Sheets Powermite3 - -------------------------------- UP3WLED-405-MB White - Development - Samples Production - /\Data Sheets MMWLED-405-1 White - Development - Samples Production - /\ Data Sheets Integrated/Packaged - -------------------------------- LX19xxxx Blue - Development - Samples Production - /\Data Sheets MMWLED-405-PM White - Development - Samples - /\ Data Sheets
EX-99.8 8 dex998.txt MEDICAL MARKETS MANAGING POWER & SOUND Exhibit 99.8 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day |11/7/01| http://www.microsemi.com Slide 1 Microsemi Medical Markets Managing Power & Sound Fernando Lynch Strategic Marketing - Medical and Audio Products Slide 2 Disclaimer . Some of the information in this presentation may contain projections or other forward-looking statements regarding future events or the future financial performance of Microsemi Corporation. . We wish to caution you that these statements are only predictions and that actual events or results may differ materially. We refer you to the documents the company files from time to time with the Securities and Exchange Commission, specifically, the Company's most recent Form 8-K, 10-K and Form 10-Q. . These documents contain and identify important factors that could cause the actual results to differ materially from those contained in our projections or forward -looking statements. . Amounts shown are estimates of projected revenue growth from new products. These estimates represent the average of the range of company estimates developed from external market research data, as well as internal company market and product forecasts. Amounts could change due to changes in market conditions, customer acceptance and other factors, whether known or unknown to the company at this time. Please refer to Microsemi Safe Harbor Statement. Slide 3 Medical Market Growth for MSCC
MRI Hearing Aid Implantable GE Medical Knowles, CODEC APTI Alliance, MED427, IC Design Center - ---------------------------------------------------------------------------------------------- FY99 0.1 0 10 FY00 0.25 0 12 FY01E 0.4 0.5 14 FY02 Goal 1.2 3.2 17 FY03 Goal 2 6 20
Slide 4 MSCC served medical markets . Re-positioning mil/space heritage products into medical devices - PIN diode for rugged Navy sonar = perfect for high performance MRI Coil switch - H.V. avalanche diode for satellite = perfect for implantable defib charging circuit . Medical and mil/space systems have similar requirements - Fail-safe performance, high reliability, advanced packaging, flip-chip and modules - Trend from discrete only - to IC - to total system level solutions
End Product Implantable Implantable Implantable Hearing Diagnostic MRI, Magnetic Cardioverter Pacemaker Neurostimulator Aid "Point of Resonance Semiconductor Defibrillator, ICD Care" Imaging Coil ------------------- ------------- ------------------ --------- ------------ --------------- Manufacturer - -------------- Captive (in-house) 50% 70% 25% 50% 0% 0% Microsemi 25% 25% 70% 30% 5% 70% Zarlink/Mitel 10% 5% 5% 5% 20% IXYS 12% International Rectifier 3% Medtronic/ MicroRel 5% 25% Resistance Technology 5% Gennum 5% Alpha 15% MA/COM 15% Various ASIC/Foundry 50% TOTAL 100% 100% 100% 100% 100% 100%
Slide 5 Market dynamics: MRI coils . All MRI Coils use PIN diodes for transmit/receive . Market share - G.E. 70% - Siemens 10% - Philips 10% - Toshiba 5% - Hitachi 5% . MSCC outpacing market growth - Increasing market share, higher dollar content -- MSCC sole source at G.E., penetrating Europe and Asia -- New machines with higher tesla rating require higher voltage semiconductors with higher ASP's - M/A Com and Alpha can't compete at these power levels Slide 6 Market dynamics: implant defibs . 100,000 implantable defibs manufactured 2001 - Worldwide potential > 500,000 people (defib + pacer) - CAGR was 25%, now 15% -- Availability of qualified surgeons and over-stocking . Market share - Medtronic 45% - Guidant 40% - Biotronik 10% - St. Jude Medical 5% . MSCC outpacing market growth - Increased market share, higher dollar content -- Trend towards combo units (pacer + defib) -- From Single to Biphasic, trend is to Triphasic Slide 7 Market dynamics: hearing aids . 6,000,000 hearing aids manufactured 2001 - Worldwide potential greater than 70 million people (one ear) - CAGR 6% (10% for DSP) -- High cost of $1500 -$3000 each hearing aid inhibiting growth - - Non-programmable 40%, analog programmable 35%, DSP 25% - Microsemi SAM $32 million by FY04 . Market share - OEM -- Siemens 21%, GN 17%, Starkey 15%, Oticon 14%, Phonak 14%, Widex 9% - Components (receivers and transducers) -- Knowles 80%, Microtronic 10%, Star Micronics 10% . MSCC outpacing market growth - Increased market share, higher dollar content -- MSCC sole source for Knowles Class-D - Knowles supplies 80% of world speakers, 50% use Class D - Microsemi will supply 100% of Knowles Class D Solution by mid FY02 -- Expected by mid FY02 - 50% of hearing aids will use MSCC solution -- MSCC "one chip" hearing aid opens low cost market in developing countries Slide 8 What sets us apart? . MRI Coils - MSCC greater than 10 year high reliability track-record at G.E. -- HUM2010 series best in class product, PIN diode -- Competition can't adjust rapidly to new product needs . Implantable defibs - MSCC greater than 20 year high reliability track-record -- Market entry for new player is nearly impossible - Product diversity limits competition -- MSCC is top 5 supplier to Guidant -- Diodes, TVS, Schottkys, TSPD, MOSFETs, Thyristors - Total engineered system level solution -- MED427 high voltage IC controlled 1/2 bridge . Hearing aids - Highest fidelity, lowest standby current (longer battery life) -- LX1790 best in class product, Class-D amplifier -- InSonus one chip hearing aid, 6 months on single battery - MSCC greater than 15 years design experience in hearing aids [picture] [picture] [picture] [picture] [picture] [picture] [picture] [picture of discrete component] [graphic of circuit board] [insonus Logo] [picture of various components] Slide 9 Dollar content: MRI coils [schematic of MRI coils] Shield, Magnet, Gradient Coils, RF Coil, Patient Table, RF Coil, Gradient Coils, Magnet, Film, Display, Gradient Amp, Gradient Pulse Prog, Computer, RF Detector, Digitizer, Pulse Prog, RF Source, RF Amp Transmit High Power PIN Diode $50.00 Receive Low Power PIN Diode $10.00 [picture of various components] Slide 10 Dollar content: implant defibs $350 per defib Battery Charge regulation Schottky $10.00 Isolation Level shifter Controller IC $10.00 Switching 1/2 bridge x2 or x 3 MED427 $80.00 Thyristor $30.00 HV Diodes $20.00 DC diode bridge Diodes $ 2.00 Protection Pulse/sense/shock leads TVS/TSPD Array $15.00 Defib shock blank circuit MOSFET Array $25.00 Shok Charge Centertap diodes SiC HV Diodes $20.00 AVG Total Conent FY02E = $100.00 FY03E = $200.00 FY04E = $350.00 Slide 11 Dollar content: hearing aids $32 Mil Sam Typial Digital Programmable Hearing Aid CODEC $1.50 CODEC w/Class-D $3.00 [schematic] (Integrated) Transducer/Microphone, Buffer Amp $0.80, 16 bit A/D $0.50, DSP, 16 bit D/A $0.50, Class-D Amp $1.00, Speaker/Receiver (Integrated Option) LX1793 One Chip Analog Programmable Hearing Aid [schematic] Transducer/Microphone, $7.00, Speaker/Receiver AVG Total Conent FY02E = $1.00 FY03E = $2.00 FY04E = $4.00 Slide 12 Highlight product: MRI coils HUM2010 Series Transmit / UM7201 Series Receive . Features - High power transmit PIN diode in stud mount packages - RF control up to 5KW - Low power receive PIN diode in axial and strip packages - Highest voltage and lowest leakage in class - Highest isolation, lowest loss, lowest signal distortion . Competition - M/A Com and Alpha . Primary Customers - GE Medical, Toshiba . Revenues - ~$1.2 in FY02 - ~$2.0 in FY03 [picture of various components] Slide 13 Highlight product: implant defib MED427 . Features - Integrated IC charge pump replaces bulky, difficult to mount transformers - MCM/BGA package reduces footprint, part count - Enhances reliability and reduces cost . Competition - Virtually none - Combined IRF, IXYS and Mitel Chips into one module . Primary Customers - Biotronik, St. Jude . Potential Revenues - $0.25 mil in FY02 - $3 mil in FY03 [graphic of circuit board design] [schematic] 800V cpump, High voltage, Defib control block Slide 14 Highlight product: hearing aids LX1790 . Features - 50mW Class-D amplifier with highest fidelity and lowest power consumption - Flip-chip and wafer-thinned die reduces footprint - Enhances reliability and reduces cost . Competition - Mitel/Zarlink . Primary Customers - Knowles, Microtronic, Star Micronics . Potential LX1790 Revenues - ~$3.2 mil in FY02E - ~$4.0 mil in FY03E - ~$15 mil in related or derivative products by FY04E [graphic of circuit board] Slide 15 Future product roadmap . MRI coils: expanding focus to other major diagnostic fields such as diabetes. Portable glucose meters worldwide market 10 million units - Developing standard potentiostatic (blood glucose level reading) interface IC with ASP around $2.00 . Implantable defibs: SiC (silicon carbide) substrates have 10x thermal conductivity and faster speed compared to silicon - Released SiC Schottky up to 600V to replace HV silicon diodes -- ASP doubles, further separates us from competition -- Potentially doubles defibrillator battery life . Hearing aids: 8 new IC's in development including buffer amps, A/D, D/A, CODEC, various Class-D amps, and "one chip" hearing aid - Re-positioning core hearing aid audio technology into other consumer products such as mobile phones, MP3 players, PDA, and....... EX-99.9 9 dex999.txt MMSM EXHIBIT 99.9 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day | 11/7/2001 | http://www.microsemi.com Slide 1 MMSM - the RF and LED Patented Architecture Ken Philpot, Director of Applications, Microsemi Microwave Manuel Lynch, VP of Business Development Slide 2 What sets us apart in Microwave? . Product & Process diversity: More tools in our toolbox! - Products - PIN Diodes for Switching, Attenuating and Limiting - Varactor Diodes for VCOs - Schottky Diodes for Detection and Up/Down Conversion - Packaging - Ceramic for Military and Space (up to 40GHz) - Innovative Flip Chip for High Speed commercial applications (WLAN 802.11a) - Processes - Automated Microwave Fab - Package-less technology - Diversity ranges from Silicon to InGaN . Rich experience in military microwave - Over 30 years experience - Our heritage is engineering performance . We understand microwave - we speak the language - We solve problems Slide 3 What is Microwave? - -------------------------------------------------------------------------------- 100% | | | MMSM | | DO-7 | EPSM | | DO-14 | | Microwave | | | SOT23 Microsemi Monolithic | | | SOD323 Enhanced Surface Mount| Package | | Performance | Functionality Glass Axial | Surface Mount Wafer Scale | 50% Leaded | | Substrate | | 5 thru hole | (circa 1995) | | (circa 1960) | | (circa 2000 | | | | | | | LP= 5nH | LP= 0.5nH LP= 0.2nH | | | | | | | | Plastic | | 0% | Injection | | | molded | | | S.M. | | | (circa 1980) | | | | | | | LP= 2nH | | | | | | - -------------------------------------------------------------------------------- DC 0.5 1 2 3 4 5 6 7 8 9 10 Frequency (GHz) Slide 4 What exactly is MMSM? . MMSM stands for Monolithic Microwave Surface Mount packaging . MMSM is a wafer scale surface mount packaging concept that offers greatly reduced parasitics: - low package inductance - low series resistance - low package capacitance . Properties which limit bandwidth and microwave frequency functionality . It is a Microsemi patented technology [picture of a dime with component on top of it] Slide 5 Why did we decide to make MMSM? . It's all about bandwidth! Customers needed a solution. - 10% bandwidth at 2.4 gHz = 240 mHz - 10% bandwidth at 5.6 gHz = 560 mHz . Surface mount packaging has always limited the performance of microwave devices . Higher frequency functionality means more available bandwidth which means higher speed telecommunications data rates Slide 6 MMSM: Design Criteria Must Have Why What Did We Do - ----------------------- ----------------------- -------------------- Must be monolithic performance and price Must be small reduces parasitics Developed MMSM Must perform like unpackaged reduces parasitics Smaller is Better chip but without wirebonds Must have superior thermals power handling/cost to Gallium Arsenide to performance ratio [schematic] Top, Cathode Indicator, 0.040", Side, 0.015", 0.020", Bottom, 0.019". 2 PLCS, 0.011", 0.016", 0.012", Gold Pads, 2 PLCS, All Dimension Tolerances are +- .002" [graphic of component] Slide 7 MMSM: Additional Design Criteria . Must have superior consistency to function > 4 gHz . Must be hermetic - for military communication applications . Must be deliverable on wafer or tape & reel for high volume / low cost applications - Direct pick and place from wafer to tape and reel . Must be completely compatible with conventional surface mount assembly - Standardized first versions on 0204 ceramic chip capacitors . Must offer a platform process which can be expanded to house other products - Transistors (gain blocks, LNAs, etc) - LEDs Slide 8 The Recipe: Creating MMSM . Patented process . Importance of Know How . Key Processes - Build diode from top side - Proprietary high temperature glass isolation step - separate contacts - Protect junction - Develop interconnects that replace wire bonds - Seal in Glass - Backlap to predetermined depth to make backside - "flip chip" contacts - Electrical Probe - Pick and place to tape and reel . What you see is what you get [graphic of component] [picture of component] Slide 9 MMSM vs. Competing Packages Package Comparisons
Package Style Outline Size Package Parasitic Maximum Frequency Construction - ------------- ------------ ----------------- ----------------- ------------ SOD-323 50x70 mils 1500 pH 2.5 gHz Injection molded plastic / lead frame SC-79 30x60 mils 700 pH 4 gHz Injection molded plastic / lead frame MMSM 20x40 mils 200 pH 10 gHz Monolithic Silicon/ Glass
Slide 10 MMSM Specs vs. The Competition Device Comparisons Device Capacitance Functional To - --------- ----------- ------------- SMP 1320 300 fF 2.5 gHz BAR63-02L 300 fF 2.5 gHz MPP 4203 100 fF 8 gHz Slide 11 Ahead of the Game - NanoMOUNT . Most customers are building antenna switches with our MSMM technology . We simplified the design cycle and accelerated the utilization of our packaging by offering complete switches - Take 4 MMSM PIN devices / Combine on EPSM substrate in ring [picture of a dime with antenna switches next to it] A complete 5 gHz WLAN spatial diversity switching solution on a single 100mil square surface mountable platform! Slide 12 NanoMount vs GaAs MESFET
GaAs MESFET SPDT switch Microsemi Silicon Nanomount switch -------------------------- ---------------------------------- Bandwidth DC to 2500 MHz 100 to 6000 MHz Isolation: 900 MHz (LMDS) 23 dB typical 40 dB typical 2400 MHz (PCS) Not Specified 30 dB typical 5600 MHz (WLAN) Not Useable 20 dB typical Insertion loss 900 MHz (LMDS) 1 dB typical 0.25 dB typical 2400 MHz (PCS) Not Specified 0.5 dB typical 5600 MHz (WLAN) Not Useable 1 dB typical Power Handling 1 Watt 10 Watts Third order IP + 39 dBm Typical + 39 dBm Typical Switching Speed Not Specified 10 nS typical Package Construction SOT-23-5 Plastic injection MMSM hermetic- molded lead frame; on-microstrip EPSM ceramic; Overall Footprint 118 X 122 mils maximum 75 X 100 mils maximum Bias supply 0 to +8 V +/- 20 mA Control supply -1 to +6 V Reverse bias polarity
Slide 13 Typical NanoMOUNT Application [schematic] Antenna 1, Antenna Diversity Switch, Antenna 2, Band Pass Filter, TX/RX Switch, LNA, RF/IF Conversion Chip(s), PA, Low Pass Filter, Baseband Chip Set [picture of Band Pass Filter] [picture of Switches] Slide 14 Ahead of the Curve . We develop solutions that meet next generation standards - 802.11a WLAN & HiperLAN/2 (developed switches in CY99) - 802.16 high power point to multi point (developed in CY99) - Multi mode 2.4 gHz & 5.6 gHz access - not yet offered in the market (we developed a solution in CY99) - WCDMA & point to point backbone infrastructure - need solution that can handle power and heat (we were well ahead of the market) - Supporting test equipment applications (we help test companies develop the products that keep telecommunication systems up and running and evolving) . Markets catch up to our technological advances Slide 15 MMSM as an LED Manuel Lynch Slide 16 Using MMSM for LED . Eliminates EPOXY - Optical parasitic . Eliminates Wirebond - Reduces VF - Increases reliability . Increases Active Area of Light Emitting Structure . Reduces ESD - Some competitors integrate TVS devices on their LEDs . On chip probing - Self packaged . Integrated Reflector cup . Low Thermal Resistance - Can handle more power and produce more light [graphic of Typical CREE LED Installation] [graphic of Typical Nichia LED] [graphic of Microsemi MMSM Blue LED] (Components in the above graphics: Epoxy, Glass, InGaN Junction, Contact Pads, Wire Bond, and Metallized Trace) EX-99.10 10 dex9910.txt OPTICAL COMMUNICATIONS Exhibit 99.10 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Investor Day| 11/8/2001 | http://www.microsemi.com Slide 1 Managing Light and Temperature, Optical Communications Andrew Popp, Strategic Business Development Slide 2 Opto-Electronic Products Managing Light and Temperature in Optical Networking Applications [graphic of Networking] City, Submarine Repeaters, City, Point-to-Pont Terminal, Double Route Protection Path, Regenerator, Survivable Ring Nodes, Ring, Optical Amplifiers and Wavelength Division Multiplexing Support, Radio tower, Add/Drop Multiplexer, Tributaries, Optical Hub, Spur Routes Slide 3 Market Overview Total Available Market (semiconductors for fiber optic modules) Data taken from Gartner "Fiber-Optic Food Chain" 03/12/01 $1,363M for 2002 $1,877M for 2003 $2,894M for 2004 Microsemi - Served Available Market (over the next three years) . Photo Diodes - Short Reach $240K $316K $344K - Long Haul $2,348K $4,102K $7,550K . Transimpedance Amplifiers $1,137K $2,104K $4,590K . Laser Drivers $1,231K $2,144K $4,503K . Thermoelectric Cooler Controllers (not included in Gartner report) $500K $1,080K $2,338K based on 5% Slide 4 What Sets Us Apart? . Photo Diodes (GaAs and InGaAs) - High-Speed - High Responsivity - Low Dark Current - Flip Chip and Arrays . Thermoelectric Cooler Controllers - Pulse Width Modulator technology used to reduce power consumption - Bi-Polar (heat/cool) for precision temperature stability - Reduced component count . Transient Voltage Suppression (TVS) - Electro-Static Discharge suppression - High-Speed Applications - Low junction capacitance . Transimpedance Amplifier (TIA) Development - InGaP/GaAs HBT technology for OC-192 TIA [graphic of Microsemi MXP7A01] [graphic of Microsemi MXP400SC] [picture of components] [picture of circuit board] Slide 5 What Sets Us Apart Typical Optical Network
Transmitter Optical Amplifier Receiver ------------------------------ ----------------------------- --------------------------- ESD Monitor Monitor Photo Protection Photo Photo Diode TIA Diode Diode ESD TEC --> TEC --> Receiver Protection Laser Controller Laser Controller ->Electronics--> Driver--> Driver Light Light Source Source ------------------------------ ----------------------------- --------------------------- Electrical Signal Optical Signal Electrical Signal
InGaAs GaAs TVS TEC Laser TIA Controller Drivers -------------------------- ------------------------ ------- ----------- ---------- ------- 10 Gbps Monitor 10 Gbps Flip Chip ESD Bi- 10 Gbps 10 Gbps Photo Diode Photo Diode Photo Diode 1x4 Array Polymer Directional Microsemi x x x x x x o o Anadigics (Telcom) x x Finisar (Sensors Unlimited) x Agere (Ortel) x x x x JDSU (EPITAXX) x x x x Fermionics x x TrueLight x EMCORE x x Vitesse x x AMCC x Maxim x x Conexant (Mindspeed) x Linear Tech x Texas Instruments x Hytek x ThermOptics x - ------------------------------------------------------------------------------------------------------------------------------
o = In Development Slide 6 Dollars per Widget ($/W) Typical Optical Transponder -------------------------------------------------------------------------- Tx - Transmit TEC Monitor Controller Laser Photo ESD ---------------- ---Driver Diode Protection Light Optical Source Electrical Signal --------------------------------------------------------------------------- Signal Photo TIA Receiver ESD Diode---- --- Electronics Protection Rx - Receive --------- ---------------------------------------------------------------------------
[picture of typical optical transponder]
Product Type Division Comments ASP - ------------------- -------------- ---------------------- ------ PowerMite Schottky PowerMite Group Standard power supply Schottky (4 per) $ 1.00 TEC Controller Power Management +/- 0.1C stability with A/D converter $ 15.00 InGaAs Photo Diode Power Management OC-192 10 Gbps Receiver $ 30.00 InGaAs Photo Diode Power Management Monitor photo diode (Tx and FOA) $ 5.00 Transimpedance Amp WaveSys OC-192 10 Gbps Receiver $ 60.00 Laser Driver Power Management OC-192 10 Gbps Receiver $ 75.00 ESD Protection Protection Products High-Speed Polymer TVSF $ 2.00 $188.00
Slide 7 Highlight Products MXP4003 InGaAs Photo Diode - Designed for OC-192 Receivers - Large Active Area allows easy fiber alignment (40um dia) -- Reduces cost of capital for manufacturers - Excellent Responsivity (above 1.0 Amp/Watt - typ) -- BER is 100% better than competition -- Fewer Optical Amplifiers - Very Low Dark Current (below 0.1 nAmps - typ) - Great Sensitivity due to combination of high Responsivity and low Dark Current - Available in chip form for Module manufacturers Typical Spectral Responsivity Wavelength (nm) Amp/Watt 800 0.104 0.645161 900 0.262 0.725806 1000 0.54 0.806452 1100 0.673 0.887097 1200 0.807 0.967742 1300 0.854 1.048387 1400 0.992 1.129032 1500 1.069 1.209677 1600 1.016 1.290323 1700 0.099 1.370968 End Applications . 1310nm Cable TV, Gigabit, Ethernet, Fiber Channel . 1550nm SONET/SDH, ATM . Optical Transponders [graphic of Microsemi MXP4003] [schematic of Microsemi MXP4003] MXP4003, Anode, 45, MICROSEMI, 355.6um +/- 25um, (center line)40um +/- 2um, Bond Pad, 355.6um +/- 25um, (center line)40um +/- 2um, Active Area, 150um +/- 20um, 355.6um +/- 25um Slide 8 Highlight Products MXP7A01 GaAs PD 1x4 Array - 10Gbps - 850nm Wavelength Sensitivity - Wide Bandwidth - Low Dark Current - GaAs semi-insulating construction - Datasheet Available Online - Samples Available [graphic of Microsemi MXP7A02] [graphic of Microsemi MXP7A01] [schematic of Microsemi MXP7A01] Microsemi MXP7A01, 406.4um +/- 25um, 250um Center to Center, 1168.4um +/- 25um, 183um, 75um Sq +/- 2um, 50um +/- 2um , 50um+/- 2um, Anode, Anode, Anode, Anode, (center line) 75um Active Area, 1168.4um +/-25um, 100um End Applications . Gigabit Ethernet, Fiber Channel . SFF Transceiver Modules . Optical Transponders Slide 9 Highlight Products LX1810 TEC Controller - Thermoelectric Cooler Controller simplifies design and lowers component count - Pulse Width Modulation (PWM) technology increases efficiency and does not require heat sink - Temperature stability to +/- 1.0 (degrees C) - Variable Input Voltage - Heat and Cool control - On-Chip MOSFET drivers - Output Current Limiter [picture of controller] [picture of circuit board] [schematic of LX1810 TEC Controller] Wavelength Lock, Monitor PD, TEC, LASER Diode, Thermistor, LX1810 TEC Controller, Vin, DAC sets temp reference, RThermister End Applications . Laser Modules . RF Power Amplifiers . Temp. Sensitive Components Slide 10 Highlight Products LX1811 - Next Generation Controller - Low Voltage Vcc (3.3VDC and +5VDC) - Reduced quiescent currents for improved efficiency at low Vcc - Integrated precision error amp for precise temperature control (+/- 0.1/degrees C) - Larger MOSFET gate drive capability (up to 20 nC) - Voltage reference for DAC - Wave shaping for EMI reduction - Current sense input - Over-current limit - Over-voltage clamp - Small form micro leadframe package MLP package - Commercial and Industrial temperature ranges (-20 degrees C to + 85 degrees C) [graphic of component] Slide 11 New TVS Concept- Polymer What is a Polymer TVS product? The Polymer holds metallic spheres randomly dispersed throughout the compound. A transient occurrence causes "tunneling effect" quickly shunting the transient away from the device being protected. . Polymer TVS product is a joint developmental product . Key Features - Ultra Low Capacitance (less than 0.2pF) - RF performance to 12GHz with little to no oscillation - Inherently Bi-Directional - Small size - Low cost . What does it not do? - Protect low voltage circuits (only for applications where device can handle 150 Volts or more) - Does not provide lightning protection, only ESD . Designed for ultra high speed applications - RF and Optoelectronics - Mobile phone applications Voltage Voltage Transient TVSF | | x | | x x x | | xx xxxx xx | | xx xxxxxx xxx | | xxxxxxxxxxxx x | x | xxxxxxxxxxxxxxxxx | x xxx | xxxxxxxxxxxxxxxxxxx | x xxxxxxxxxxxxxxxxx | xxxxxxxxxxxxxxxxxxxx | xxxxxxxxxxxxxxxxxxxxx - ------------------------ ----------------------------------- time time Slide 12 Highlight Products TVSF0805 / TVSF1206 Series - Designed for Electrostatic Discharge (ESD) protection - Ultra Low Capacitance for High-Speed applications - Will not cause signal distortion at high frequencies - Ultra Low Leakage over temperature - High-Tech Polymer material - Compliant with IEC6000 standard for the human body model of ESD - 300 Watts max (ESD only) [picture of components] [graph of TVSF0805 Single Line Bi-Directional] [graph of TVSF1206 Single Line Bi-Directional] End Applications . Photo Diodes . RF Amplifiers . Mobile Phone Antennas Slide 13 Leveraging Intellectual Property . From Audio - to Opto - to Car Seat Coolers - Luxury Car Seats with integrated Heat / Cool features using thermoelectric cooler technology - LX1810 TEC controller can drive car seat module . From Satellite SunSensors - to Fiber Optic - to Visible Light Detectors for PDAs/Auto - Silicon photo diodes with special comparative detection filtering and to sample and detect specific light wavelengths - Ideal for visible ambient light detection systems for PDAs and automotive displays . Planar waveguide circuits for DWDM - Wave guides and Bragg filters will polarize and lose data bits with temperature shifts EX-99.11 11 dex9911.txt RFIC PRODUCTS Exhibit 99.11 Header of all slides [Logo] Microsemi Slide 1 Managing Power - RFIC Products Erich Volk - Product Development / Marketing RFICs Dr. Michael Kim - RF Design and System Engineering Slide 2 Disclaimer . Some of the information in this presentation may contain projections or other forward-looking statements regarding future events or the future financial performance of Microsemi Corporation. . We wish to caution you that these statements are only predictions and that actual events or results may differ materially. We refer you to the documents the company files from time to time with the Securities and Exchange Commission, specifically, the Company's most recent Form 8-K, 10-K and Form 10-Q. . These documents contain and identify important factors that could cause the actual results to differ materially from those contained in our projections or forward -looking statements. . Amounts shown are estimates of projected revenue growth from new products. These estimates represent the average of the range of company estimates developed from external market research data, as well as internal company market and product forecasts. Amounts could change due to changes in market conditions, customer acceptance and other factors, whether known or unknown to the company at this time. Please refer to Microsemi Safe Harbor Statement. Slide 3 Market Strategy and Players
Power Amp - $ M 2001 2002 2003 2004 2005 - -------------------------------------- ----------- ------------ ----------- ---------------- ----------------- TAM $654 $ 959 $1,178 $1,431 $1,492 WCDMA $ 9 $ 29 $ 64 $ 102 CDMA2000 1x 1 $ 12 $ 68 $ 191 $ 327 5GHz WLAN $ 3 $ 7 $ 13 $ 21 SAM $ 1 $ 24 $ 104 $ 268 $ 450
Source: Aug 2001 Cahners Instat Group
RFIC PA Microsemi Alpha Anadigics RFMD Conexant - -------------------------------------- ------------ ------------ -------------- ------------ ------------ WCDMA InGaP/HBT InGaP/HBT AIGaAs/HBT AIGaAs/HBT CDMA/CDMA2000 InGaP/HBT AIGaAs/HBT InGaP/HBT AIGaAs/HBT AIGaAs/HBT WLAN 5GHz low power InGaP/HBT WLAN 5GHz high power InGaP/HBT GSM AIGaAs/HBT InGaP/HBT AIGaAs/HBT AIGaAs/HBT TDMA AIGaAs/HBT AIGaAs/HBT RFIC PA Agilent/HP Maxim Triquint Celeritek Raytheon - ------------------------------------ -------------- ---------- ------------ ---------------- ---------- WCDMA InGaP/HBT x CDMA/CCDMA2000 x SiGe InGaP/HBT InGaP/HBT x WLAN 5GHz low power x x WLAN 5GHz high power GSM x TDMA SiGe InGaP/HBT InGaP/HBT
Slide 4 Microsemi Wireless RF/Fiber-Optic Engineered Solutions: Networked Corporate Resources & Advanced Technologies Semicon & Device Technology Leverage InGaP/GaAs - - HBT PAs - - HBT TIAs InGaAs/GaAs - - E-Mode PHEMT LNAs Silicon - - CMOS DC-DC Converter InGaAs/InP - - PA, LNA, TIA Product Design/Development [picture of Building] [picture of design engineers] [picture of engineer with test equipment] [picture of equipment] [picture of equipment] Power-Managed Multi-Function Integration Flip-Chip Packaging - - Au-Stud - - LTCC Variable Vc Bias PAs - - DC-DC - - Si CMOS RFIC/Opto Products [graphic of 2.5G-3G Power Amp, Chips & Modules] [graphic of 5-6GHz WLAN PA, LNA, Antenna, Antenna Switch] [graphic of 10-40Gb/s Ethernet/Sonet, Photodiode/TIA, Chips & Modules] Wireless/Fiber-Optic Applications [graphic of 2.5G-3G Portable] [graphic of 5-6GHz LAN] [graphic of Gb Ether/Sonet] Slide 5 Microsemi Wireless RF/Fiber-Optic Engineered Solutions: Optimum Power Amp RFIC Component Technology Path - - Lower Noise Figure - - Higher Gain/Bandwidth -- LNA, PA, PHEMT (E-Mode), HBT, - - No Drain Switch - - Smaller Die Size -- SiGe/Si[crossed out], AIGaAs/GaAs, InGaP/GaAs - - Better Temp Stability - - Greater Reliability -- Chip-&-Wire, PA Module, Flip-chip, PA Module - - Greater RF Performance - - Smaller Size - - Better RF Yield/Cost -- Solder-Reflow Bump, Thermosonic Au-Stud Bump - - Better Thermals - - Smaller Size - - Simpler Manufacturing -- PA Chips & Modules 2G-3G Portable 5-6GHz W-LAN Slide 6 W-CDMA/CDMA2000 HBT Power Amp Products: Worldwide 3G Mobile Communication Service 3G Mobile Communications W-CDMA/CDMA2000 HBT Power Amp Products Sept 2001 2002-03 2003-04 [picture of 3 mobile telephones] Korea/Europe USA [picture of PDA] (DCMA2000-1x, W-CDMA) (CDMA2000-1xEV) [picture of FOMA Card] NTTDoCoMo FOMA (Freedom Of Mobile Access) - - - - Introductory Phones [graphic of PA Chips, Modules (6x6mm2=>3x3mm2) Slide 7 Overall Power Amplifier Efficiency: Power-Added Efficiency (PAE) Vs Quiescent Current (Icq) Probability Distribution of CDMA Handset (IS-95) P 3 x r x x o x b 2.5 x a x b i x l 2 i t x x y 1.5 x x x % 1 x x x x 0.5 x x x x x x x x 0 ---------------------------------------------------- -25 1.5 -5 5 15 25 . High Transmitter Power: Edge of cell, deep fading . Low Transmitter Power: Near base station, low shadow & Rayleigh fading Pout (dBm) T 0.45 ox o 0.4 ox t 0.35 ox a 0.3 ox l 0.25 ox 0.2 ox C 0.15 xo u 0.1 xo r x x x x x x x x x x x x x x x x x x x x x x x x x r 0.05 o e o n o o o o o o o o o o o o o o o o o o t 0 (A) -------------------------------------------------------------------------- -25 -20 -15 -10 -5 0 5 10 15 20 25 30 Pout (dBm)
x = High Icq (80mA) o = Low Icq (38mA) (MWS) [graphic of energy compliance logo] *30% Battery Power Saving! Fact #1: PA with highest PAE may not be the overall most efficient PA. Fact #2 Icq has a major impact on battery life of CDMA phones. * more than Slide 8 Advanced Performance-Managed Multi-Function PA Modules: Optimizing for Combined Efficiency, Linearity, Size and Cost Optimum "Intelligent" Performance-Managed Multi-Function, Multi-Chip Power Amp Module [schematic] 2-Bit Bias Control, Input Voltage (Battery), Buck DC-DC Converter, Variable Vcc (&/or Vref) Biasing, Vcc, HBT Power Amp, RF Input, RF Output "Intelligent" Power Amp Module [graphic of InGaP/GaAs] [graphic of HBT PA RFICs] [graphic of (2G-3G) Intelligent Power Mangement - - Discrete Variable Bias Region? - - Dynamic Input Envelope Tracking? - - PA Output Stage Switching? [schematic] Bias Control, Input Voltage (Battery), Boost DC-DC Converter, RF Input, Dynamic Envelope Tracking, Variable Bias, Vcc, Vref [schematic] PA Output Stage Switching, Switch Control Bias/Control Support Circuitry Multi-Layer Input Matching Circuitry Transient Voltage Suppression Multi-Layer Output Matching Circuitry [graphic of InGaP/GaAs] [graphic of HBT PA RFICs] [graphic of (2G-3G)] Multi-Layer Low-Temp Co-Fired Ceramic (LTCC) for Chip Module Packaging Flip-Chip Au-Stud/Au-Pad Die Attached and I/O Interconnect [graphic of magnified au stud bump] Slide 9 Active Bias Power Management of InGaP HBT Power Amp: DC-DC Converter with 2-Bit (4) Bias Level (In Development) [schematic] Input Voltage (Battery), Bias control (2-Bit+), Si Buck DC-DC Converter (greater than 1MHz), External FET Switch, Inductor & Filter Capacitor, Variable Vcc, Vref, HBT Power Amp, RF Input, RF Output Active Bias Power Amp Block Diagram 50 o 45 PAE (%) x 40 35 o 30 Vcc 1- 2V X 25 20 o 15 o 10 Vcc 0.5-1V x 5 o x o o 0 o o o ------------------------------------------------------------------- -10 -5 0 5 10 15 20 25 30 x = Converter o = No Converter InGap HBT W-CDMA Power Amp 4 Level Bias PAE Performance Slide 10 Dynamic Power Management of InGaP HBT Power Amp: Variable 2-Bit Vcc Bias with Si DC-DC Buck Converter W-CDMA/CDMA2000 PA with Buch Converter 4-Level Vcc Control [schematic] RF/IF Converter and Baseband Chip Set, Bias Control (2-Bit+), DC-DC Buck Converter (greater than 1MHz) 2-Bit+ Controlled Vcc, Vref Bias States: Bias 1 = V Battery, Bias 2 1-2V, Bias 3 0.5-1V, Bias 4 = 0ff, LDO, Battery Voltage (3.2-4.2V), Variable Vcc, Variable Vref, HBT Power Amp, RF Input, RF Output Slide 11 Flip-Chip Interconnect Via Gold Stud Bump/Gold Pad Bonding: Thermosonic Au Stud/Au Pad Process With Wire Bond Studs - - Gold-stud bumping and thermal vias on ceramic substrate (alumina, LTCC) - - GaAs IC die with Au pads flip-chip aligned to Au-stud bumps - - GaAs IC pads and substrate studs thermo-sonic welded [schematic] GaAs Flip-Chip Die (7mils Thick) with Au Pads, Au-Stud Bump, Ceramic Substrate (15mils Thick), Thermal Via (Silver-Filled), Printed Circuit Board (FR4) Schematic of Flip-Chip Assembly (75 um Diameter x 20 um Thick Studs) [picture of GaAs IC Flip-Chip Die, Ceramic Substrate and Magnified Au Stud Bump (75um D) Magnified Au-Stud Flip-chip Assembly (75um diameter x 20um Thick Studs) Slide 12 Au-Stud Flip-Chip PA Module Assembly: Performance, Size & Cost Advantages Over Conventional Chip-&-Wire Approach [schematic of Heat Flow] PA Module, PA RFIC + Backside Via, GaAs Substrate, Epoxy Die Attach, Module Substrate (LTCC), + Silver- Filled Thermal Vias, Solder Reflow, RF System PCB
Performance, Size, Cost Chip-and-Wire Au Stud-Au Pad Flip-Chip - --------------------------- -------------------------- -------------------------------------- Module Performance - RF performance/yield limited - Optimum performance/yield - - RF (Gain, PAE, ACPR) -- Die attach epoxy RF ground -- Thermosonic Au-Au -- Wire bond inductance -- Repeatable low inductance -- Limited RF isolation (vias) -- Flexible RF isolation - - Thermal - Acceptable (4mil GaAs/Via) - 1-2X better (20um thick Au stud) - - Mechanical - Fragile (4mil thick) - 2x thicker die Size - - Chip Size - Ground via limited - Same size or smaller - - Module Size - Wire bond pad limited - 25%-30% smaller (no bond pad) Cost - - Chip Fab Process - Backside thinning+via+plating - 10% lower cost (no via/plating) - - Module Fab Process - Epoxy die attach+12 bonds - Same cost (flip-chip+30studs) - - Overall Module Cost - Chip & RF yield limited - >10% lower (chip+better RF yield)
Slide 13 InGaP/GaAs HBT PA RFIC Thermal Analysis: Conventional Chip-&-Wire Versus Au-Stud Flip-Chip [graphic of circuit layout] 2-D Thermal Distribution Simulation - - 3-D software (finite-element analysis) Tochnog (public domain ANSI-C code) - - Thermal structure -- Thermal conductivity ratio Au:GaAs= 6:1 -- Heat flow thickness: -- GaAs substrate =100um; Au stud=20um -- Heat flow area wire-bond:flip-chip ratio=20:1 - - Heat flow into infinite heat sink Temperature (C) Distribution without Studs 1400 90 85 1200 xxxxxxx 80 xxxxxxx 75 1000 xxxxxxxx xxxxxxxxx 800 xxxxxxxxx 70 xxxxxxxxxx 65 600 xxxxxxxxxx 60 xxxxxxxxxxx 400 xxxxxxxxxxxx 55 xxxxxxxxxx 50 200 xxxxxxxxxx 45 0 xxxxxxx 40 - ------------------------------------------ - -1500 -1000 -500 0 Chip-&-Wire [graph of thermal distribution without Studs] Temperature (C) Distribution with Au Studs 1400 90 85 1200 xxxxxxx 80 xxxxxxx 75 1000 xxxxxxx xxxxxxx 800 70 xxxxxxx 65 600 xxxxxxx 60 xxxxxxx 400 55 xxxxxxx 50 200 xxxxxxx 45 0 xxxxxxx 40 - ------------------------------------------ - -1500 -1000 -500 0 Au-Stud Flip-Chip [graph of thermal distribution with Au Studs] Slide 14 InGaP/GaAs HBT PA RFIC Au-Stud Flip-Chip Thermal Analysis: 3-D Thermal Distribution Simulation 3-D Thermal Distribution Simulation - - 3-D software (finite-element analysis) Tochnog (public domain ANSI-C code) - - Thermal structure -- Thermal conductivity ratio Au:GaAs = 6:1 -- Heat flow thickness: GaAs substrate =100um; Au stud =20um -- Heat flow area wire-bond: Flip-chip ratio = 20:1 - - Heat flow into infinite heat sink Surface Temperature - Au-Stud Side [graphic of 3-D thermal map] [X Y Z axes] [graphic of circuit layout] [chart of color coded temperature] Slide 15 W-CDMA InGaP HBT PA Matched Module Evolution: 6x6mm2 Chip-&-Wire to 3x3mm2 Au-Stud Flip-Chip [graphic of 6x6mm2 Chip-&-Wire Single-Layer Alumina (PA Module Prototype)] [graphic of 3x3mm2 Au-Stud Flip-Chip Multi-Layer LTCC (PA Module in Development)] Slide 16 Amplifiier and Antenna Products: 5-6GHz Wireless Portable, Access Point, Bridge Applications
2002 2002-03 [picture of Current 2.4GHz Wireless LAN Modem 5-6GHz Wireless Modem Europe (HiperLAN) PCMCIA Card Format] - Portable Japan - Base Access - Bridge USA (802.11a)
[graphic of Power Amp, LNA Printed Antenna] 5-6 GHz Wireless HBT Power Amp, PHEMT LNA and Antenna Products Slide 17 5-6GHz Wireless LAN Block Diagram: Microsemi RF Front-End Product Family Solution [schematic] Antenna Diversity Switch, Antenna 1, Antenna 2, Band Pass Filter, TX/RX Switch, LNA, PA, RF/IF Conversion Chip(s), Low Pass Filter, Baseband Chip Set [picture of band pass filter] [picture of Antenna Diversity Switch & TX/RX Switch] [picture of LNA] [picture of PA] Slide 18 InGaP HBT 5.15-5.35 GHz Hybrid 3-Stage PA Evolution: 3-Chip Discrete to 2-Chip RFIC Solution [schematic] Input 50 Ohm, Drive Amp Gain Block, Chip, SOT-23 or 1x2mm2 MLP, P1dB=12dBm G=11dB, Inter-Stage Match, 2nd-Stage, 1-Stage PA, Chip, SOT89 or 2x2mm2 MLP, P1dB greater than 24dBm G greater than 12dB, Inter-Stage Match, Output Stage, 1-Stage PA, Chip, SOT89 or 2x3mm2 MLP, P1dB~29-30dBm, G~5-6dB, Output Match, PCB: Rogers 4350, Output, P1dB greater than 29dBm, G greater than 28dB 2nd + 3rd Stage RFIC Integration - - Vcc=3.3V - - Total Quiescent Current: Icq 200mA - - P1dB 29-30dBm - - Gain*15dB [graphic of circuit board] EX-99.12 12 dex9912.txt CORPORATE PRESENTATION Exhibit 99.12 Header of all slides [Logo] Microsemi more than solutions - enabling possibilities Analyst Day | 11/8/2001 | http://www.microsemi.com Slide 1 Analyst Day Overview Presentation Slide 2 Disclaimer . Some of the information in this presentation may contain projections or other forward-looking statements regarding future events or the future financial performance of Microsemi Corporation. . We wish to caution you that these statements are only predictions and that actual events or results may differ materially. We refer you to the documents the company files from time to time with the Securities and Exchange Commission, specifically, the Company's most recent Form 8-K, 10-K and Form 10-Q. . These documents contain and identify important factors that could cause the actual results to differ materially from those contained in our projections or forward -looking statements. Slide 3 Company Overview . Semiconductor manufacturer - Founded in 1960, core strengths developed in military/aerospace and medical markets . Executing on 3 Point Strategy - System engineered solutions, increasing gross margins, leveraging intellectual property . Operational improvements - New management team improving bottom line . Diverse market strategy provides stability - Broad customer base, none greater than 4% of revenues . Increasing R&D - Developing our Future - Focus on 5 key Circuit Solutions that are fueling company growth . Strong Financial Results - Stability in rough markets, long term earnings history, improving margins, strong balance sheet Product Mix FY02E Power Management 29% Transient Protection 16% Power Conditioning/Discretes 38% RF and Optoelectronics 17% Top 20 OEM Customers (FY01) Rank Customer Market/Application - ---- -------- ------------------- 1 Boeing Satellites/Military 2 Guidant Medical Implantables 3 Seagate Disk Drives 4 Motorola Mobile Phones 5 Alcatel Fiber Optics/Satellites 6 BAE Systems Military/Aerospace 7 Rockwell Military/Aerospace 8 Lockheed Martin Satellites/Military 9 Robert Bosch GMBH Satellite Communications 10 Agilent Telecommunications 11 Dell PC/Peripherals 12 Mitsubishi Mobile Phones 13 Loral Space Satellites 14 Siemens AG PC/Peripherals 15 Honeywell Military/Aerospace 16 Tecnologica Satellites 17 Delco Automotive 18 St. Jude Medical Medical Implantables 19 Raytheon Military/Aerospace 20 Solectron Various Slide 4 Company Strategy . Develop and Market System Engineered Solutions - Work with customers to develop "must have" products - Develop alliances/reference design wins . CREE, Nitronex, APTI, Intel, Intersil, Atheros - Re-utilize packaging IP to enhance performance . Powermite as Power Diode or LED package . MMSM as WLAN switch or LED package - Combining application specific semiconductor processes . Low voltage silicon (0.7V chips), InGaP (HBT Amps), InP (OC192/768 detectors), InGaN (Blue, Green, and UV LEDs), SiC (Schottkys) . Mix and match depending on end application . Increase Gross Margins (Goal of 50% or better) - Consolidation of business units, focus on utilization - Introduce higher value added/higher gross margin products . Experts at reapplying Intellectual Property - Repositioning Core Competencies and Circuit "know how" into multiple market segments and applications [Graphics of four PDA's] [Picture of discrete component] [Picture of discrete component] [Picture of lab technician] [Sharp Logo] [intersil Logo] [Atheros Communications Logo] [Intel Logo] [Harison Logo] Slide 5 Operational Improvements . New Management Reshaping company - Chief Operating Officer appointed - VP of Human Resources appointed - VP of Quality/Business Process Development appointed . Improved Incentive programs - Now focused on operating income improvements - Broader employee stock option program . Utilization Improvements and Consolidations in progress - Florida and Hong Kong operations closed in FY01 - Operational consolidations planned . Easy to execute, have significant positive financial impact, under our control - not market or application dependent Slide 6 Diverse OEM Customer Base 14.8% Mobile connectivity [graphic of mobile telephone] Qualcomm, Samsung, Motorola, Compaq, Palm, Mitsubishi 12.0% telecom [graphic of pbx operator] Alcatel, Ericsson, Nokia, Nortel 13.6% industrial [graphic of welder] Coleman, PowerOne, Recoton, Magnatek 2.2% automotive [graphic of computer inside a vehicle] Visteon, Becker, VDO, Clarion 11.5% computers/peripherals [graphic of laptop computer] Dell, Seagate, Gigabyte, Compaq, IBM, Fujitsu 10.1% medical [graphic of Chest X-ray] GE Medical, Guidant, St. Jude, Biotronik, Medtronic, InSonus 35.8% mil/aerospace [graphic of Astronaut in space] Matra, Raytheon, General Electric, Bosch, Lockheed Martin, Boeing . Top 100 customers 70% Sales, none greater than 4% . North America 70% . Europe 20% . Asia 9% . ROW 1% . OEM 60% . Distributors 36% . CMs 4% Slide 7 Extensive product portfolio Product Group RF/Opto(17%)
Breakdown 0% 48% 50% 2% I R T P D C F r h e s a o t (P A D n t e o m i s o c w p o i t e s) d s o r e t r s o s Markets Applications r ------------- --------------------------- s Mobile Mobile Phones, 2-Way Radios 50% x x x x Connectivity PDAs, Web Tablets 50% x x Base station/POTs 28% x x Wireless LAN 2% x x Telecom Set-top box 30% x x Fiber Optics 40% x x AutoPC/Navigation 98% x x Automotive Audio 2% Commercial Aircraft 10% Military Communications 10% Military/ Military Aircraft 10% x x Aerospace Missiles 10% x x Communication Satellites 40% x x x Military Satellites 10% Other 10% Medical Heart Defibrillators/Pacers 80% x x MRI/Ultrasound/Diagnostic 13% x x x Hearing aids 5% Computer/ PCs/Laptops/Servers 50% x Peripheral Disc drives 30% Audio equip 5% Monitors 5% Industrial/ Semi-cap/RF Generators 15% x x Commercial Power Supplies 40% x Pet Electric Fence Sys. 5% x x
Power Management (29%)
Breakdown 20% 2% 40% 15% 15% 2% 5% 1% L P A P L D S M P M M T i r u r i C C e r i o E g o d o n : S d o l/ d C h d I d e D I i d A u t u o u a C c u e l I i c c r a c r e C n t t l t o s s g s s P s W M Markets Applications s - -------------- -------------------------------------- Mobile Mobile Phones, 2-Way Radios 50% x x x x Connectivity PDAs, Web Tablets 50% x x x x Base station/POTs 28% x x x Wireless LAN 2% Telecom Set-top box 30% x x x x Fiber Optics 40% x x x AutoPC/Navigation 98% x x x Automotive Audio 2% x x x x Commercial Aircraft 10% x x Military Communications 10% x x Military/ Military Aircraft 10% Aerospace Missiles 10% x x Communication Satellites 40% x Military Satellites 10% Other 10% x Medical Heart Defibrillators/Pacers 80% x x MRI/Ultrasound/Diagnostic 13% x x x Hearing aids 5% x x Computer/ PCs/Laptops/Servers 50% x x x x Peripheral Disc drives 30% x x x Audio equip 5% x x Monitors 5% x Industrial/ Semi-cap/RF Generators 15% x x Commercial Power Supplies 40% Pet Electric Fence Sys. 5% x
TVS(16%) Breakdown 50% 20% 0% 30% E L E Z S i M e D g I n h e t r i s n Markets Applications g - -------------- ----------------------------- Mobile Mobile Phones, 2-Way Radios 50% x x x Connectivity PDAs, Web Tablets 50% x x Base station/POTs 28% x x Wireless LAN 2% x Telecom Set-top box 30% x x x x Fiber Optics 40% x x AutoPC/Navigation 98% x x x Automotive Audio 2% x x Commercial Aircraft 10% x x Military Communications 10% x x Military/ Military Aircraft 10% x x Aerospace Missiles 10% x x x Communication Satellites 40% x x Military Satellites 10% Other 10% x x Medical Heart Defibrillators/Pacers 80% x x x MRI/Ultrasound/Diagnostic 13% x x Hearing aids 5% x Computer/ PCs/Laptops/Servers 50% x x x Peripheral Disc drives 30% x Audio equip 5% x Monitors 5% Industrial/ Semi-cap/RF Generators 15% x x Commercial Power Supplies 40% x Pet Electric Fence Sys. 5% x Discrete(38%) Breakdown 30% 2% 0% 25% 35% 8% P M S D S T o o i i c r w s c o h a e f d o n r e e t s m t s t i i k s t y t e s o Markets Applications r - ------------- -------------------------- s Mobile Mobile Phones, 2-Way Radios 50% x x Connectivity PDAs, Web Tablets 50% x x Base station/POTs 28% x x x x x Wireless LAN 2% Telecom Set-top box 30% x Fiber Optics 40% x x AutoPC/Navigation 98% x x Automotive Audio 2% Commercial Aircraft 10% x x x x x Military Communications 10% x x x x Military/ Military Aircraft 10% x x Aerospace Missiles 10% x x x x x Communication Satellites 40% x x Military Satellites 10% Other 10% x x x x Medical Heart Defibrillators/Pacers 80% x x x x MRI/Ultrasound/Diagnostic 13% x x Hearing aids 5% x Computer/ PCs/Laptops/Servers 50% x Peripheral Disc drives 30% x Audio equip 5% Monitors 5% Industrial/ Semi-cap/RF Generators 15% x x x Commercial Power Supplies 40% x x x Pet Electric Fence Sys. 5% x x Slide 8 How Do we Manage this Diversity? . Teamwork (Marketing, Systems Engineering, Design) . Systems in place to support live collaborative cross divisional communication - Customer/Resource Management tool . On going training programs - what are our products, and who uses them . Dollars per Widget Awareness - - Incentive programs to drive cross divisional selling . Teaching business units that working together we can leverage our breadth of product and application expertise - Teamwork delivers results . The value of an increased stock option program Slide 9 MicroNET(TM) - our InfoSys tool . Used for tracking activities in collaborative live environment - globally - Leads - Opportunities - Product Availability - Product Design Status - Quote/Turns Activity - Collaborative Forecasting - Order Status - POS info - Market Data - Competitor Info . Demo Slide 10 Developing Microsemi's Future . Focus on high growth, high margin product opportunities - 8X min Return on R&D over life of product . R&D increasing - 2.2% in FY99 - 6.4% in FY01 - Estimated 8% in FY02 . New part roll out increasing - 4 Parts introduced in FY01Q3 - 8 Parts introduced in FY01Q4 - Estimate 40-50 products in FY02 . Optimizing Margin Mix of Product Portfolio . 5 Key Circuit Solutions to Fuel MSCC Growth - Upside estimate of new products developed/introduced in FY00/FY01 Base Business + new Products MSCC Fiscal Year FY01E FY02E FY03E FY04E Protection 0 1 4 8 Temperature 0 1 3 8 Power 5 to 6 13 46 83 Sound 1 7 15 29 Light 14 to 15 22 48 93 Base Business 223 to 226 237 277 304 Total 243.2 to 248.2 281 393 525 NOTE: Amounts shown are estimates of projected revenue growth from new products. These estimates represent the average of the range of company estimates developed from external market research data, as well as internal company market and product forecasts. Amounts could change due to changes in market conditions, customer acceptance and other factors, whether known or unknown to the company at this time. Please refer to Microsemi Safe Harbor Statement. Slide 11 Products (Tactical/Strategic)
Field FAEs Strategic Product System Design Sales Marketing Development Engineering Engineering ----------- ------------- ----------------------------- ----------------------------- Products/Mgmt Jim Gentile Gentile/Lynch Manuel Lynch Kelly Jones Manageing Light CCFL TFSE R Holiday G Henry E Campos LED D TFSE S Litchfield P Pickle G Henry S Kelly/Campos Lasers i TFSE G Hartman P Okada P Okada Photodetector r TFSE G Hartman T Vu Dr Shin e Managing Sound c J Jiang F Lynch Low Power (AudioMITE) t J Weiland O Anderssen High Power (Audio Max) M Tanaka J Jiang G Batelman Managing Power M Lynch RF Ics + R Desai (UK) E Volk Dr Kim Dr Qian RF Discretes B Doherty (US) K Philpot K Philpot R Preston DCDC R PK Lee (Asia) P Pickle S Brooks (various) Military e ------ (various) (various) (various) p Managing Temp s A Popp Passive TFSE (various) S Kelly S Kelly Active TFSE G Hartman S Brooks (various) Protecting Circuits K Walters A Popp ESD M Clark M Clark C Poliakoff EMI A Popp V Barkadorian V Barkadorian Lightning M Clark C Poliakoff C Poliakoff
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