Subsequent Event - Additional Information - (Details) - USD ($)		12 Months Ended
	Jan. 22, 2021	Dec. 31, 2020	May 29, 2020	May 28, 2020
Subsequent Event [Line Items]
Aggregate amount			$ 670,000,000	$ 500,000,000
Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement | Revolving Loan Facility
Subsequent Event [Line Items]
Debt instrument, interest rate description		The interest rate on Loans made under the Facility will be the sum of the Margin and LIBOR.
Debt instrument description of variable rate basis		The Margin is equal to 1.25%, in the event the Consolidated Leverage Ratio is less than 1.50:1.  The Margin increases, on a sliding scale, as the Consolidated Leverage Ratio increases up to a maximum of 2.25% if the Consolidated Leverage Ratio is greater than 3.00:1.  The Non-utilisation Fee payable on the undrawn and uncancelled amount of each Lender’s Commitment under the Facility is also dependent upon the Consolidated Leverage Ratio.  The Non-utilisation Fee is 0.15% if the Consolidated Leverage Ratio is less than 1.50:1.  The Non-utilisation Fee increases, on a sliding scale, as the Consolidated Leverage Ratio increases up to a maximum of 0.35% if the Consolidated Leverage Ratio is greater than or equal to 3.00:1.
Debt instrument extended maturity period		The Availability Period extends from January 22, 2021 through December 22, 2022.
Facility description		The Facility matures on January 22, 2023 (the “Final Repayment Date”).  The Availability Period extends from January 22, 2021 through December 22, 2022.  Unutilized Commitments will be cancelled at 5 p.m. on the last day of the Availability Period.  The Borrower will be able to borrow funds under the Facility on a revolving basis during the Availability Period, however, all borrowed amounts must be repaid on or prior to the Final Repayment Date unless the Facility is extended or refinanced.  Neither Diodes Incorporated nor the Borrower can provide any assurances regarding whether the Facility will be extended or refinanced or the terms of any such hypothetical future extension or refinancing.  The Borrower plans to use a portion of the proceeds available under the Facility (i) to refinance certain existing indebtedness of the Borrower and (ii) to finance its working capital requirements and its general corporate purposes.
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement
Subsequent Event [Line Items]
Debt instrument agreement entered date	Jan. 22, 2021
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement | Revolving Loan Facility
Subsequent Event [Line Items]
Aggregate amount	$ 100,000,000
Consolidated leverage ratio	3.00%
Non-utilisation fee percentage	0.15%
Non-utilisation fee percentage consolidated leverage ratio is less	1.50%
Non-utilisation fee percentage consolidated leverage ratio increases up to maximum	0.35%
Non-utilisation fee percentage consolidated leverage ratio is greater than or equal	3.00%
Maturity date	Jan. 22, 2023
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement | Minimum | Revolving Loan Facility
Subsequent Event [Line Items]
Consolidated leverage ratio	1.50%
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement | Maximum | Revolving Loan Facility
Subsequent Event [Line Items]
Consolidated leverage ratio	2.25%
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Facility Agreement | LIBOR | Revolving Loan Facility
Subsequent Event [Line Items]
Margin percentage	1.25%
Subsequent Event | Diodes Hong Kong Limited (the “Borrower”) | Hong Kong Debenture (the “Debenture”)
Subsequent Event [Line Items]
Debt instrument agreement entered date	Jan. 22, 2021