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Subsequent Event - Additional Information - (Details) - Diodes Hong Kong Limited (the “Borrower”) - Facility Agreement
Jan. 22, 2021
USD ($)
Subsequent Event [Line Items]  
Debt instrument agreement entered date Jan. 22, 2021
Revolving Loan Facility  
Subsequent Event [Line Items]  
Line of Credit Facility, Maximum Borrowing Capacity $ 100,000,000.0