-----BEGIN PRIVACY-ENHANCED MESSAGE----- Proc-Type: 2001,MIC-CLEAR Originator-Name: webmaster@www.sec.gov Originator-Key-Asymmetric: MFgwCgYEVQgBAQICAf8DSgAwRwJAW2sNKK9AVtBzYZmr6aGjlWyK3XmZv3dTINen TWSM7vrzLADbmYQaionwg5sDW3P6oaM5D3tdezXMm7z1T+B+twIDAQAB MIC-Info: RSA-MD5,RSA, UpqznimFRseAb6eyD4JNTd+xx7FpZq9Iu21Q6kx7sPymAkZYRB1fJy4b3HoW4Xul glXQggeqWgN66/84PeBpog== 0001193125-06-040096.txt : 20060227 0001193125-06-040096.hdr.sgml : 20060227 20060227170209 ACCESSION NUMBER: 0001193125-06-040096 CONFORMED SUBMISSION TYPE: FWP PUBLIC DOCUMENT COUNT: 1 FILED AS OF DATE: 20060227 DATE AS OF CHANGE: 20060227 SUBJECT COMPANY: COMPANY DATA: COMPANY CONFORMED NAME: COMMONWEALTH EDISON CO CENTRAL INDEX KEY: 0000022606 STANDARD INDUSTRIAL CLASSIFICATION: ELECTRIC SERVICES [4911] IRS NUMBER: 360938600 STATE OF INCORPORATION: IL FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: FWP SEC ACT: 1934 Act SEC FILE NUMBER: 333-99363 FILM NUMBER: 06647330 BUSINESS ADDRESS: STREET 1: ONE FIRST NATIONAL PLZ 37TH FL STREET 2: P O BOX 767 CITY: CHICAGO STATE: IL ZIP: 60690 BUSINESS PHONE: 3123944321 MAIL ADDRESS: STREET 1: 10 SOUTH DEARBORN STREET STREET 2: 37TH FLOOR CITY: CHICAGO STATE: IL ZIP: 606900767 FILED BY: COMPANY DATA: COMPANY CONFORMED NAME: COMMONWEALTH EDISON CO CENTRAL INDEX KEY: 0000022606 STANDARD INDUSTRIAL CLASSIFICATION: ELECTRIC SERVICES [4911] IRS NUMBER: 360938600 STATE OF INCORPORATION: IL FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: FWP BUSINESS ADDRESS: STREET 1: ONE FIRST NATIONAL PLZ 37TH FL STREET 2: P O BOX 767 CITY: CHICAGO STATE: IL ZIP: 60690 BUSINESS PHONE: 3123944321 MAIL ADDRESS: STREET 1: 10 SOUTH DEARBORN STREET STREET 2: 37TH FLOOR CITY: CHICAGO STATE: IL ZIP: 606900767 FWP 1 dfwp.htm FREE WRITING PROSPECTUS Free Writing Prospectus

Filed Pursuant to Rule 433

Registration Statement No. 333-99363

Dated February 27, 2006

 

Issuer:

    Commonwealth Edison Company

Ratings:

   

Baa1 (Moody’s); A- (S&P); A- (Fitch)

Principal Amount:

   

$325,000,000

Title of Securities:

   

First Mortgage 5.90% Bonds, Series 103, due 2036

Legal Format:

   

SEC Registered (Registration No. 333-99363)

Settlement Date:

   

March 6, 2006

Maturity Date:

   

March 15, 2036

Issue Price:

   

99.371% of principal amount, plus accrued interest, if any, from March 6, 2006

Proceeds (before expenses) to ComEd

   

98.496% per Bond; $320,112,000 total

Coupon:

   

5.90%

Benchmark Treasury:

   

5.375% due February 15, 2031

Spread to Benchmark:

   

130 basis points (1.30%)

Treasury Yield:

   

4.645%

Yield:

   

5.945%

Interest Payment Dates:

    Semi-annually on March 15 and September 15, commencing on September 15, 2006

Redemption Provisions:

   

Make-whole call:

    At any time at a discount rate of Treasury rate plus 25 basis points.

CUSIP:

   

202795 HK 9

Underwriters:

   

J.P. Morgan Securities Inc. (27%)

Lehman Brothers Inc. (27%)

Morgan Stanley & Co. Incorporated (27%)

Wachovia Capital Markets, LLC (15%)

Popular Securities, Inc. (4%)

 

The issuer has filed a registration statement (including a prospectus) with the U.S. Securities and Exchange Commission (SEC) for this offering. Before you invest, you should read the prospectus for this offering in that registration statement, and other documents the issuer has filed with the SEC for more complete information about the issuer and this offering. You may get these documents for free by searching the SEC online database (EDGAR®) at www.sec.gov. Alternatively, you may obtain a copy of the prospectus from Lehman Brothers Inc. by calling 1-888-603-5847, J.P. Morgan Securities Inc. by calling collect 1-212-834-4533, or Morgan Stanley & Co. Incorporated by calling 1-866-718-1649.

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