0001193125-19-235723.txt : 20190903 0001193125-19-235723.hdr.sgml : 20190903 20190903060703 ACCESSION NUMBER: 0001193125-19-235723 CONFORMED SUBMISSION TYPE: 6-K PUBLIC DOCUMENT COUNT: 1 CONFORMED PERIOD OF REPORT: 20190903 FILED AS OF DATE: 20190903 DATE AS OF CHANGE: 20190903 FILER: COMPANY DATA: COMPANY CONFORMED NAME: CHIPMOS TECHNOLOGIES INC CENTRAL INDEX KEY: 0001123134 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 000000000 STATE OF INCORPORATION: F5 FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 6-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-37928 FILM NUMBER: 191070759 BUSINESS ADDRESS: STREET 1: NO. 1, R & D ROAD 1 STREET 2: HSINCHU SCIENCE PARK, HSINCHU CITY: TAIWAN STATE: F5 ZIP: 00000 BUSINESS PHONE: 866-3-5770055 MAIL ADDRESS: STREET 1: NO. 1, R & D ROAD 1 STREET 2: HSINCHU SCIENCE PARK, HSINCHU CITY: TAIWAN STATE: F5 ZIP: 00000 6-K 1 d798283d6k.htm FORM 6-K Form 6-K

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549

 

 

FORM 6-K

 

 

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16

UNDER THE SECURITIES EXCHANGE ACT OF 1934

For the month of September, 2019

Commission File Number 001-37928

 

 

ChipMOS TECHNOLOGIES INC.

(Translation of Registrant’s Name Into English)

 

 

No. 1, R&D Rd. 1, Hsinchu Science Park

Hsinchu, Taiwan

Republic of China

(Address of Principal Executive Offices)

 

 

(Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.)

Form 20-F  ☒            Form 40-F  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1):  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7):  ☐

 

 

 

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

Dated: September 3, 2019    

ChipMOS TECHNOLOGIES INC.

                (Registrant)

    By:  

/S/ S. J. Cheng

    Name:   S. J. Cheng
    Title:   Chairman & President

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

jesse_huang@chipmos.com

   

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

DIVIDEND ALERT: ChipMOS US$0.764 PER ADS CASH DIVIDEND TO BE DISTRIBUTED ON SEPTEMBER 9, 2019; ADS HOLDERS TO RECEIVE APPROXIMATELY US$0.583 AFTER TAIWAN WITHHOLDING TAX AND DEPOSITARY FEES

Hsinchu, Taiwan, September 3, 2019 – ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), announced today that a US$0.764 cash dividend per ADS will be distributed on September 9, 2019. ADS holders will receive approximately US$0.583 per ADS, after the Taiwan withholding tax and Citibank, N.A.’s depositary fees. The Company’s latest dividend was approved by shareholders at its AGM this past June.

S.J. Cheng, Chairman and President of ChipMOS, said, “The latest distribution reflects our Board of Directors and management’s confidence in ChipMOS’s business, prospects for growth and the strength of our balance sheet. This is an important part of our overall strategy to increase value for shareholders, as we continue to successfully execute on our business.”

Holders of ADSs in brokerage accounts are encouraged to check with their securities brokers for receipt of dividend payments. Questions regarding dividend payments to ADS holders may be directed to Keith Balwan at Citibank, N.A. (Tel: +1-973-461-7038; email: keith.balwan@citi.com).

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as “believes,” “expects,” “anticipates,” “projects,” “intends,” “should,” “seeks,” “estimates,” “future” or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the “SEC”) and in the Company’s other filings with the SEC.