6-K

UNITED STATES
SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

Form 6-K

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16
UNDER THE SECURITIES EXCHANGE ACT OF 1934

For the month of October 2007

Commission File Number: 000-29103

STATS CHIPPAC LTD.

(Translation of registrant’s name into English)

Republic of Singapore

(Jurisdiction of incorporation or organization)

10 Ang Mo Kio Street 65
#05-17/20 Techpoint
Singapore 569059
(65) 6824-7777

(Address of principal executive office)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:
þ Form 20-F     o Form 40-F

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1): o

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7): o

Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934: o Yes     þ No

If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b): Not applicable.

TABLE OF CONTENTS

EX-99.1 Corporate release of the Company dated October 5, 2007

TABLE OF CONTENTS

Other Events

On October 5, 2007, the Company issued a corporate release announcing the name change of its subsidiary, from Winstek Semiconductor Corporation to STATS ChipPAC Taiwan Semiconductor Corporation with effect from October 5, 2007. A copy of the corporate release dated October 5, 2007 is attached hereto as Exhibit 99.1.

Exhibit

99.1 Corporate release of the Company dated October 5, 2007

SIGNATURE

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Date: October 5, 2007

STATS CHIPPAC LTD.
By:	/s/ Tan Lay Koon
Name:	Tan Lay Koon
Title:	President & Chief Executive Officer

By:	/s/ Tham Kah Locke
Name:	Tham Kah Locke
Title:	Acting Chief Financial Officer

EXHIBIT INDEX

99.1 Corporate release of the Company dated October 5, 2007

EX-99.1

Exhibit 99.1

CORPORATE RELEASE

Winstek Semiconductor Changes Name to
STATS ChipPAC Taiwan Semiconductor Corporation

Common identity strengthens combined service offering

United States — 10/05/2007, Singapore — 10/05/2007 — STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” — NASDAQ: STTS and SGX-ST: STATSChP), a leading independent semiconductor test and advanced packaging service provider, today announced that Winstek Semiconductor Corporation, a subsidiary of STATS ChipPAC, has changed its name to STATS ChipPAC Taiwan Semiconductor Corporation effective October 5, 2007.

“The new name reflects our common corporate identity and reinforces the fact that we are seamlessly integrated with STATS ChipPAC’s assembly and test operations worldwide. We are excited to build on STATS ChipPAC’s name recognition in Taiwan and will continue to provide our customers with best-in-class full turnkey solutions,” said Richard Weng, Chairman, STATS ChipPAC Taiwan Semiconductor Corporation.

“Over the years, Winstek has played a very significant role in STATS ChipPAC’s continuing strategy to offer our customers a full turnkey solution in key geographic markets,” said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC. “We believe this new common identity strengthens our combined service offering to customers and reinforces our strong focus and commitment in the Taiwan market.”

As one of the leading test houses in Taiwan, STATS ChipPAC Semiconductor Corporation offers proven expertise in mixed-signal, digital, embedded memory, consumer optics and wireless applications. Its strategic relationships with the top semiconductor fabs and leading design houses in Taiwan provides customers with a one-stop solution and uninterrupted delivery of services for their products.

STATS ChipPAC Taiwan Semiconductor Corporation’s URL has changed from http://www.winstek.com.tw/ to http://www.statschippac.com.tw/.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” — NASDAQ: STTS and SGX-ST: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence

	STATS ChipPAC Ltd.
	Company Registration No.: 199407932D
	Headquarters: 10 Ang Mo Kio Street 65, #05-17/20 Techpoint,
	Singapore 569059
	www.statschippac.com

spanning Singapore, South Korea, China, Malaysia, Thailand and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company’s customer support offices are centered in the United States (California’s Silicon Valley, Arizona, Texas, Massachusetts, Colorado and North Carolina). Our offices outside the United States are located in South Korea, Singapore, China, Malaysia, Thailand, Taiwan, Japan, the Netherlands and United Kingdom. STATS ChipPAC’s facilities include those of its subsidiary, STATS ChipPAC Taiwan Semiconductor Corporation (formerly known as Winstek Semiconductor Corporation), in Hsinchu District, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in South Korea, Singapore, Malaysia, China, Taiwan and the United States as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq Stock Market (NASDAQ) and the Singapore Exchange Securities Trading Limited (SGX-ST). In addition, STATS ChipPAC is also included in the Morgan Stanley Capital International (MSCI) Index. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Certain statements in this release, including statements regarding expected future financial results and industry growth, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ from our expectations include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; level of competition; demand for end-use applications products such as communications equipment and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; reliance on a small group of principal customers; continued success in technological innovations; availability of financing; pricing pressures including declines in average selling prices; ability to meet specific conditions imposed for the continued trading or listing of the Company’s securities on the SGX-ST and the NASDAQ; our substantial level of indebtedness; potential impairment charges; adverse tax and other financial consequences if the South Korean taxing authorities do not agree with our interpretation of the applicable tax laws; ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in products mix; intellectual property rights disputes and litigation; capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; significant ownership by Temasek Holdings that may result in conflicting interests with Temasek Holdings and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; our ability to continue to successfully integrate the operations of the former separate STATS and ChipPAC companies and their employees; labor union problems in South Korea; uncertainties of conducting business in China; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company’s SEC filings, including its annual report on Form 20-F dated March 12, 2007. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

Investor Relations Contact:

Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788, Fax: (65) 6720 7826
email: kahlocke.tham@statschippac.com

Media Contact:

Lisa Lavin
Senior Marcom Manager
Tel: (208) 939 3104, Fax: (208) 939 4817
email: lisa.lavin@statschippac.com

	STATS ChipPAC Ltd.
	Company Registration No.: 199407932D
	Headquarters: 10 Ang Mo Kio Street 65, #05-17/20 Techpoint,
	Singapore 569059
	www.statschippac.com