6-K

UNITED STATES
SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

Form 6-K

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 OF
THE SECURITIES EXCHANGE ACT OF 1934

For the month of July 2010

Commission File Number: 000-29103

STATS CHIPPAC LTD.

(Translation of registrant’s name into English)

10 Ang Mo Kio Street 65
#05-17/20 Techpoint
Singapore 569059
(65) 6824-7777

(Address of principal executive office)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:
þ Form 20-F     o Form 40-F

Note: The registrant deregistered and terminated its reporting obligations under the Securities Exchange Act of 1934 in August 2009 and is filing its annual report on Form 20-F as a voluntary filer.

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1): o

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7): o

TABLE OF CONTENTS

EX-99.1 Release of STATS ChipPAC Ltd. dated July 19, 2010

Other Events

On July 19, 2010, STATS ChipPAC Ltd. issued a release announcing that it had drawn down US$150.0 million under a US$360.0 million term loan credit facility that it had entered into on May 18, 2010 with, amongst others, certain of its wholly-owned subsidiaries as guarantors and Bank of America, N.A., Credit Suisse AG, Singapore Branch, DBS Bank Ltd., Deutsche Bank AG, Singapore Branch, Oversea-Chinese Banking Corporation Limited, Sumitomo Mitsui Banking Corporation and United Overseas Bank Limited, as mandated lead arrangers (the “Credit Facility”). STATS ChipPAC Ltd. applied the proceeds from its drawdown under the Credit Facility to redeem all US$150.0 million in outstanding principal amount of its 7.5% Senior Notes due 2010 at their maturity on July 19, 2010. A copy of the release dated July 19, 2010 is attached hereto as Exhibit 99.1.

Exhibit

99.1 Release of STATS ChipPAC Ltd. dated July 19, 2010

SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Date: July 19, 2010

STATS CHIPPAC LTD.
By:	/s/ Tan Lay Koon
Name:	Tan Lay Koon
Title:	President & Chief Executive Officer
By:	/s/ John Lau
Name:	John Lau
Title:	Chief Financial Officer

EXHIBIT INDEX

99.1 Release of STATS ChipPAC Ltd. dated July 19, 2010

EX-99.1

Exhibit 99.1

STATS ChipPAC — Drawdown under Credit Facility for
Redemption at Maturity of
US$150.0 million 7.5% Senior Notes due July 19, 2010

Singapore — 7/19/2010, United States — 7/19/2010 — STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” — SGX-ST: STATSChP) today announced that on July 19, 2010, the Company drew down US$150.0 million under the Credit Facility (as described below), and used the proceeds from this drawdown to redeem all US$150.0 million in outstanding principal amount of its 7.5% Senior Notes due 2010 (the “Notes”) at their maturity on July 19, 2010. The Notes were redeemed at their principal amount, together with accrued and unpaid interest, pursuant to the terms and conditions of the Notes. Upon their redemption at maturity, all the Notes have been cancelled.

The Company entered into a US$360.0 million term loan facility agreement (the “Credit Facility”) dated May 18, 2010 with, amongst others, certain of its wholly-owned subsidiaries as guarantors and Bank of America, N.A., Credit Suisse AG, Singapore Branch, DBS Bank Ltd., Deutsche Bank AG, Singapore Branch, Oversea-Chinese Banking Corporation Limited, Sumitomo Mitsui Banking Corporation and United Overseas Bank Limited, as mandated lead arrangers. The proceeds from the Credit Facility are intended to repay certain of the Company’s indebtedness and for general corporate purposes. The interest rate payable under the Credit Facility will be determined by reference to LIBOR plus an applicable margin based on the Company’s then-applicable leverage ratio. The Credit Facility will mature on May 18, 2013.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788, Fax: (65) 6720 7826
email: kahlocke.tham@statschippac.com

Media Contact:
Lisa Lavin
Deputy Director of Corporate Communications
Tel: (208) 867-9859
email: lisa.lavin@statschippac.com

STATS ChipPAC Ltd.
Company Registration No.: 199407932D
Headquarters: 10 Ang Mo Kio Street 65, #05-17/20 Techpoint,
Singapore 569059
www.statschippac.com