UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 8-K
CURRENT REPORT
PURSUANT TO SECTIONS 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT OF 1934
Date of report (Date of earliest event reported) June 19, 2014
ENTEGRIS, INC.
(Exact name of registrant as Specified in its Charter)
Delaware
(State or Other Jurisdiction of Incorporation or Organization)
001-32598 | 41-1941551 | |
(Commission File Number) | (I.R.S. Employer Identification No.) | |
129 Concord Road, Billerica, MA | 01821 | |
(Address of principal executive offices) | (Zip Code) |
(978) 436-6500
(Registrants telephone number, including area code)
N/A
(Former Name or Former Address, if Changed Since Last Report)
Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions:
¨ | Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) |
¨ | Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) |
¨ | Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) |
¨ | Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c)) |
Item 7.01. Regulation FD Disclosure
On June 19, 2014, the registrant issued a press release regarding an update to forward looking statements relating to the second quarter of 2014, as presented in a press release issued June 19, 2014 and attached hereto as Exhibit 99.1.
On June 19, 2014, Entegris, Inc. (the Company) hosted an Analysts Day at The Companys new i2M Center for Advanced Materials Science in Bedford, Massachusetts. Pursuant to Item 7.01, Regulation FD Disclosure, of Form 8-K, the Company is furnishing a series of slides referenced in the Companys remarks during this presentation. Presentation slides are attached hereto as Exhibit 99.2. Presentation slides and an audio replay of the remarks are also posted on the Companys website.
In accordance with General Instructions B.2 of Form 8-K, the information in this Item 7.01 shall not be deemed filed for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the Exchange Act), or otherwise subject to the liabilities of that section, nor shall such information be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, except as shall be expressly set forth by specific reference in such a filing. The information set forth herein will not be deemed an admission as to the materiality of any information required to be disclosed solely to satisfy the requirements of Regulation FD.
Item 9.01. Financial Statements and Exhibits.
(d) Exhibits
Exhibit 99.1 | Press Release, dated June 19, 2014 | |
Exhibit 99.2 | 2014 Analysts Day Presentation Slides |
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned thereunto duly authorized.
ENTEGRIS, INC. | ||||||
Dated: June 19, 2014 | By | /s/ Peter W. Walcott | ||||
Peter W. Walcott, | ||||||
Senior Vice President & General Counsel |
Exhibit 99.1
Entegris Raises Outlook for Second Quarter
| Quarterly revenue of $235 million to $245 million |
| GAAP quarterly net loss of $25 million to $30 million, or $0.18 to $0.22 loss per share |
| Non-GAAP income of $24 million to $28 million and non-GAAP EPS of $0.17 to $0.20 |
BILLERICA, MA June 19, 2014 Entegris Inc. (NasdaqGS: ENTG), a leading provider of yield-enhancing materials and solutions for advanced manufacturing processes, today updated its sales and earnings outlook for the second quarter ending June 28, 2014.
The Company expects second-quarter sales of $235 million to $245 million, which includes two months of results of ATMI, Inc. which Entegris acquired on April 30, 2014. The Company expects to report a net loss of approximately $25 million to $30 million, or a loss per share of $0.18 to $0.22, which includes purchase accounting adjustments, transaction-related costs from the ATMI transaction, acquisition integration expenses and other one-time costs. Excluding these items and expected amortization expense, which in aggregate total approximately $53 million, subject to final purchase accounting adjustments, non-GAAP net income is expected to be $24 million to $28 million, and non-GAAP EPS to be $0.17 to $0.20 per share.
The Companys previous guidance for the second quarter was for sales of $165 million to $175 million, which excluded any results from ATMI. On a comparable basis excluding ATMI results, the Companys updated guidance reflects expected sales of $175 million to $185 million. In the first quarter of 2014, Entegris reported sales of $165.8 million. In terms of net income, the Company previously expected second-quarter net income of $13 million to $18 million, and EPS between $0.09 to $0.13 per share. On a non-GAAP basis, the Company previously expected EPS to range from $0.10 to $0.14 per share, adjusted for expected amortization expense of $2.3 million or $0.01 per share.
Entegris expects to report its results for the second quarter on Tuesday, July 29, 2014.
The Company is holding an investor meeting today, June 19, 2014, in Bedford, Massachusetts. The formal presentations of the meeting, which are scheduled to begin at 12:30 p.m., are being webcast, and can be accessed on the Companys website: http://investor.entegris.com.
ABOUT ENTEGRIS
Entegris is a leading provider of yield-enhancing materials and solutions for advanced manufacturing processes in the semiconductor and other high-technology industries. On April 30, 2014, Entegris acquired Danbury, CT-based ATMI, Inc. Entegris is ISO 9001 certified and has manufacturing, customer service and/or research facilities in the United States, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea and Taiwan. Additional information can be found at www.entegris.com.
Forward-Looking Statements
Certain information contained in this press release may constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current management expectations only as of the date of this press release, and involve substantial risks and uncertainties that could cause actual results to differ materially from the results expressed in, or implied by, these forward-looking statements. Statements that include such words as anticipate, believe, estimate, expect, forecast, may, will, should or the negative thereof and similar expressions as they relate to Entegris or our management are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve risks, uncertainties and assumptions that are difficult to predict. These risks include, but are not limited to, fluctuations in the market price of Entegris stock, Entegris future operating results, Entegris ability to successfully integrate the ATMI business and achieve anticipated synergies, other acquisition and investment opportunities available to Entegris, general business and market conditions and other factors. Additional information concerning these and other risk factors may be found in previous financial press releases issued by Entegris and Entegris periodic public filings with the Securities and Exchange Commission, including discussions appearing under the headings Risks Relating to our Business and Industry, Manufacturing Risks, International Risks, Risks Related to Owning Our Securities, and Risks Related to the Pending Merger with ATMI, Inc. in Item 1A of our Annual Report on Form 10K for the fiscal year ended December 31, 2013, as well as other matters and important factors disclosed previously and from time to time in the filings of Entegris with the U.S. Securities and Exchange Commission. Except as required under the federal securities laws and the rules and regulations of the Securities and Exchange Commission, we undertake no obligation to update publicly any forward-looking statements contained herein.
### END ###
![]() Bertrand
Loy President and CEO
Bertrand Loy
President and CEO
Entegris:
A Premier Materials and Solutions Provider
Entegris:
A Premier Materials and Solutions Provider
Exhibit 99.2 |
![]() Analyst Day
2014 | 2 The New Entegris
The New Entegris
Entegris provides yield-enhancing materials and solutions
for the most advanced manufacturing environments |
![]() Analyst Day
2014 | 3 A Compelling Platform
A Compelling Platform
Track record of financial discipline
and execution
Higher cash flow and earnings
leverage
Customer focused
uniquely
positioned in the ecosystem
Unit-driven model levered to
growing demand in semiconductor
and adjacent markets
Market leadership with breadth
and depth of technology
Delivering
Enhanced Value
for All Stakeholders |
![]() Analyst Day
2014 | 4 The New Entegris: A More Powerful Operating Platform
The New Entegris: A More Powerful Operating Platform
Note:
Financial
metrics
exclude
ATMIs
discontinued
operations.
1
Excludes
$3.2M
of
Entegris
sales
to
ATMI,
2
Includes
$30M
run-rate
cost
synergies,
3
U.S.
and
foreign,
issued
and
pending.
$693 million
$132 million
Approx. 2/3
2,800
1,547
Net Sales
EBITDA
% Unit
Driven
Employees
Patents
2013
Stronger financial profile to drive growth, deliver
attractive returns for shareholders
Today
ATMI
ACQUISITION
$1.05
billion
$248
million
Approx. 4/5
3,400
2,981
+45%
+88%
Greater
Stability
Stronger
Talent
Technical
Depth
1
2
3 |
![]() Analyst Day
2014 | 5 Consistency of cash flows
Allows for sustained investment in R&D and in
new markets
In the sweet spot
of industry growth
More attractive to key talent
Benefits of a unit-driven, recurring revenue model
A Unit-Driven Model + Sticky Solutions = Greater Stability
A Unit-Driven Model + Sticky Solutions = Greater Stability
78%
Unit Driven
22%
Capex
Driven
Large market for materials
supporting legacy nodes
Semiconductor Industry Year-End Capacity by Linewidth
(MSI/Quarter)
Source: Gartner, April 2014.
ProForma Sales
0
500
1,000
1,500
2,000
2,500
3,000
3,500
97
98
99
00
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
Year
0.5 micron to 130 nm
90
nm
-
45
nm
32 and below |
![]() Analyst Day
2014 | 6 Growing Position Among Other Semiconductor Suppliers
Growing Position Among Other Semiconductor Suppliers
Entegris ranks as one of the largest materials solutions providers among
publically held companies focused on the semiconductor industry
Note: Reflects 2013 reported revenue for companies with US equity; Entegris revenue pro forma
for ATMI. OEM Equipment
Components
Materials
CCMP
UCTT
BRKS
PLAB
FORM
ACLS
NANO
MTSN
AEIS
Less than $1B
$1B to $2B
More than $2B
Applied/TEL
ASML
KLA
LAM
Entegris
MKSI |
![]() Analyst Day
2014 | 7 Broad Presence in Unit-Driven, High Value Applications
Broad Presence in Unit-Driven, High Value Applications
Leveraging current Entegris technologies into adjacent markets
where process control and purity requirements are critical
Semi
Flat
Panel
PV Solar
Data
Storage
Compound
Semi/LED
Resource
Efficiency
Life
Sciences
Adjacent markets moving closer in
process control and purity requirements
Leveraging current Entegris
technologies into adjacent markets |
![]() Analyst Day
2014 | 8 Key IC Growth Drivers
Wearable electronics
New generations of mobile phones
and tablets with longer battery life
Stabilization of PC sales
The internet of things
Positive Underlying Market Dynamics
Wafer Starts to Resume Growth
Positive Underlying Market Dynamics
Wafer Starts to Resume Growth
Source: Gartner forecast: Semiconductor silicon wafers, worldwide, 1Q14 update.
Advances in semiconductors enable new electronics, drive demand
-1.0% CAGR
Worldwide Wafer Starts
(Bn Square Inches)
+10.3% CAGR
+3.8% CAGR
4.0
4.8
5.3
6.4
6.9
8.3
8.9
8.4
7.0
9.7
9.4
9.4
9.4
9.8
10.2
10.5
10.9 |
![]() Analyst Day
2014 | 9 Industry and technology demands of customers continue to evolve
putting Entegris solutions at sweet spot of demand
Cost of technology and increased
complexity of the process
Increased number of materials
Shorter technology nodes
Increasing the value of yield-
enabling solutions
Positive Underlying Market Dynamics
The Industrys Technology Challenges Require New Solutions
Positive Underlying Market Dynamics
The Industrys Technology Challenges Require New Solutions
Source: Entegris estimates.
More Steps due to Multi-Patterning,
Compounded by Lower Yield
Technology Node in Nanometers
0
500
1,000
1,500
2,000
2,500
0%
20%
40%
60%
80%
100%
90
65
45
32
28
20
14
10
Mature Yield
No. Steps |
![]() Analyst Day
2014 | 10 Uniquely Positioned Across the Semiconductor Ecosystem
Uniquely Positioned Across the Semiconductor Ecosystem
Equipment
Makers
Device
Makers
Materials Suppliers
Combined Customers as
% of Pro Forma Sales
Customer 1
Customer 2
Customer 3
Customer 4
Customer 5
Customers
6-10
10.5%
7.0%
6.8%
5.0%
2.3%
9.2% |
![]() Analyst Day
2014 | 11 Capabilities to Support the Customer
Capabilities to Support the Customer
The scale and infrastructure to capitalize on global demand trends
Pro Forma FY13 Sales by Region
North America 25%
Europe 11%
Asia Pacific 64%
Employees
North America 51%
5%
Asia Pacific 44%
Europe and Israel
Asia Pacific
North America
Germany
Israel
France
Singapore
Malaysia
China
Korea
Japan
California
Colorado
Minnesota
Texas
Massachusetts
Taiwan
Arizona
Connecticut |
![]() Analyst Day
2014 | 12 Breadth of Entegris Portfolio
Breadth of Entegris Portfolio
Market leadership positions across the entire IC wafer fabrication process
ATMI
Lithography
Advanced
Photoresist
Packaging
Filtration
Gas/Liquid
Purification
Etch
Gas Filters
and
Diffusers
Gas
Purification
Specialty
Materials
Deposition
Copper
Plating
Deposition
Materials
Gas Filtration
and
Purification
Clean
Formulated
Cleans
Filtration
Fluid
Handling
Containers
CMP
Formulated
Cleans
Filtration
Brushes
and Pad
Conditioners
Implant
Safe Gas
Delivery
Systems
Electrostatic
Chucks
Fab Facility
Advanced
FOUPs
AMC
Filtration
Bulk
Chemical
Delivery
Wafer
Shippers
A leader in yield-enabling materials and solutions for advanced manufacturing
Entegris
Gas
Purification
Specialty
Materials
Specialty
Materials
Specialty
Materials
Formulated
Cleans |
![]() Analyst Day
2014 | 13 CTO
Our New Business Organization
Merging technology platforms to maximize value creation for customers
Global Sales
and Marketing
Electronic
Materials
Operations
Advance Deposition
Materials
Gas
Microcontamination
Control
Specialty Gases
Surface Prep and
Integration
Business
Development
Liquid
Microcontamination
Control
Fluid Management
and Control
Liquid Packaging
Microenvironments
Specialty Materials
eVOLV
BrightBlack®
Critical Materials
Handling
ATMI
Entegris
Blend
Pro Forma 2013 Sales
$ in millions
CMH
$660
EM
$392
$1,051
Analyst Day 2014 | 13 |
![]() Analyst Day
2014 | 14 Foundation for the New Entegris
Foundation for the New Entegris
Financial
Objective
Investment
priorities
Now
R&D
Internal capabilities
New market
development
Pay down debt
Cash flow
Growth in excess
of market
Best in class among
specialty materials
companies
Then
Growth in excess
of market
R&D
Infrastructure
Acquisitions
Buy back
Best in class among
components and
subsystems companies
Target
model
Analyst Day 2014 | 14 |
![]() Analyst Day
2014 | 15 Focus on our customers
Integrate ATMI platform successfully
Achieve our target model
Pay down our debt
Build a high-performance organization
Priorities for the next 12-18 months
Focused on Execution
Focused on Execution |
![]() Analyst Day
2014 | 16 A Compelling Platform
A Compelling Platform
Track record of financial discipline
and execution
Higher cash flow and earnings
leverage
Customer focused
uniquely
positioned in the ecosystem
Unit-driven model levered to
growing demand in semiconductor
and adjacent markets
Market leadership with breadth
and depth of technology
Delivering
Enhanced Value
for All Stakeholders |
![]() Entegris®,
the
Entegris
Rings
Design®
and
Creating
a
Material
Advantage®
are
trademarks
of
Entegris,
Inc.
©2014 Entegris, Inc. All rights reserved. |
![]() James A.
ONeill, Ph.D. Chief Technology Officer
James A. ONeill, Ph.D.
Chief Technology Officer
Differentiation in a Disruptive Environment
Differentiation in a Disruptive Environment |
![]() Analyst Day
2013 | 2 Key Takeaways: In the Right Place at the Right Time
Key Takeaways: In the Right Place at the Right Time
Entegris is uniquely positioned to enable new
paradigms within the materials
ecosystem Our contamination control capabilities are critical to device
yield in an increasingly complex manufacturing environment
Our global capabilities facilitate customer engagements
that foster improved responsiveness and trust
Wins at the leading edge drive revenues for today and
years to come |
![]() Analyst Day
2013 | 3 The Industrys Endless Search for More
The Industrys Endless Search for More
Advances in semiconductors enable new electronics
which drive demand for new semiconductors
Moores Law
New technology nodes
Disruptive technologies
(patterning, device, materials)
More process steps
(greater process complexity)
More difficult
contamination issues
(more challenging yield ramp)
Demand for
electronics
Improved
performance
Lower cost
Less power |
![]() Analyst Day
2013 | 4 Litho 1
Center image: Intel High-k Penryn microchip 2009
Disruptive Technologies Required to Achieve Moores Law
Disruptive Technologies Required to Achieve Moores Law
Multi Patterning
Metal
gate
Ge/Si S/D
PMOS
New Materials
New Structures
FinFET Device
High-k metal gate transistor
With advanced materials and critical handling technologies,
Entegris is now the leading enabler for advanced nodes
Fin Height
Fin Width
Gate Length
Litho 2
Post Develop.
Bake
Etch for
Line Control |
![]() Analyst Day
2013 | 5 Increasing Interdependency within Semiconductor Ecosystem
Increasing Interdependency within Semiconductor Ecosystem
Entegris delivers yield-enhancing solutions across the entire
semiconductor ecosystem
Lithography, Etch, Deposition, Clean, CMP, Implant, Fab Facility
Customer
collaborations
are
key
to
advanced
node
challenges
Device
Materials
Customers Care About:
Technology Performance
Process Yield
Device Cost
Equipment |
![]() Analyst Day
2013 | 6 Leveraging technology and infrastructure to address customer
needs Leader in Materials and Materials Handling for Defect-Free Processing
Leader in Materials and Materials Handling for Defect-Free Processing
Developmental capability
close to all customers
Process and applications
support skillset
Comprehensive supply
chain excellence
Customer value
proposition: higher yields,
improved performance,
reduced costs
Global Infrastructure
Filtration, purification
and handling solutions
for gases, liquids, solids
and critical substrates
Advanced electronic
materials for defect-free
processing
Enabling solutions to
most challenging
customer problems
Portfolio Breadth
Molecular science
creation and formulation
Film fabrication and
integrity management
Collaborative development
agreements with leading
IDMs and OEMs
Comprehensive patent
portfolio across product
lines and geographies
Technical Depth |
![]() Analyst Day
2013 | 7 Interfacial science and analytics
Materials synthesis and formulation
Material application engineering
Membrane science and engineering
Sub-10 nm liquid filtration
Fluid handling, sensing, control
and dispense
Gas purification
Environment control for critical substrates
Specialty coating engineering
Culture of innovation
Depth of Core Capabilities
Depth of Core Capabilities
i2M Center for Advanced Materials Science
Application of
fundamental
science to
robust product
development |
![]() Analyst Day
2013 | 8 Broad IP portfolio with global protection
in U.S. and key Asian regions
2,981 patents and patent applications
Significant portion (~81%) of portfolio
covers North America and Asia (South
Korea, Taiwan and China)
IP covers products and key innovations
related to manufacturing, design and use
Long history of innovation provides a
framework for even more powerful
combined Entegris
Source: Entegris, May 2014
Broad Patent Portfolio
Broad Patent Portfolio
North
America
34%
Global IP Coverage
Asia
47%
Europe
13%
Global
2%
ROW
4%
2,981 Patents and Applications |
![]() Analyst Day
2013 | 9 Industry Leading Capabilities Close to Customers
Industry Leading Capabilities Close to Customers
Strategically located technology centers to facilitate customer
engagements
Work locally on many pressing technology problems
Hands-on approach to all development and customer application challenges
Joint development agreements with top IDMs, OEMs and consortia
Supports engagement model of local interactions and increased responsiveness and trust
Europe and Israel
Asia Pacific
North America
Germany
Israel
France
Singapore
Malaysia
China
Korea
Japan
California
Colorado
Minnesota
Texas
Massachusetts
Taiwan
Arizona
Connecticut |
![]() Analyst Day
2013 | 10 Direct engagement by
engineering teams
Pilot capability at most sites
Growing our share
*NDAs
and
JDAs
Entegris
only,
does
not
include
ATMI.
Deepening Our Collaboration with Strategic Customers
Deepening Our Collaboration with Strategic Customers
Relevant,
Trusted
Technology
Partner
Application
and Process
Knowledge
We Develop
Relevant Final
Solution
We Listen
We Respond
Quickly with
Prototypes
Expanded applications excellence
Faster new product development
New Development Agreements*
with Top IDMs and OEMs
6
3
7
12
25
47
2008
2009
2010
2011
2012
2013 |
![]() Breadth of
Entegris Portfolio Breadth of Entegris Portfolio
Market leadership positions across the entire IC wafer fabrication process
ATMI
Lithography
Advanced
Photoresist
Packaging
Filtration
Gas/Liquid
Purification
Etch
Gas Filters
and
Diffusers
Gas
Purification
Specialty
Materials
Deposition
Copper
Plating
Deposition
Materials
Gas Filtration
and
Purification
Clean
Formulated
Cleans
Filtration
Fluid
Handling
Containers
CMP
Formulated
Cleans
Filtration
Brushes
and Pad
Conditioners
Implant
Safe Gas
Delivery
Systems
Electrostatic
Chucks
Fab Facility
Advanced
FOUPs
AMC
Filtration
Bulk
Chemical
Delivery
Wafer
Shippers
A leader in yield-enabling materials and solutions for advanced manufacturing
Entegris
Gas
Purification
Specialty
Materials
Specialty
Materials
Specialty
Materials
Formulated
Cleans
Analyst Day 2013 | 11 |
![]() Analyst Day
2013 | 12 Combination Enables New Paradigms
Combination Enables New Paradigms
Gases and Gas-
wetted Surfaces
Solids and Solid
Materials Delivery
Application-based clean
gas delivery solutions
Gas manufacturing and
packaging excellence
Improved gas purifier
capacity and efficiency
Broader gas purification
offerings
Selective ALD precursors
Gas effluent monitoring
and delivery control
In-situ and ex-situ particle
control for critical
substrates
Wet Chemistries and
Wetted Surfaces
Benefits to Customer
Improved chemical
formulations and
chemical manufacturing
excellence
Optimized wet chemical
handling solutions
Material sensing and
control
Packaging and container
expertise
Improved material performance
Defect/impurity reduction and improved yield
Reduced ecosystem complexity and lower cost of ownership |
![]() Analyst Day
2013 | 13 Integration of Planarcore®
PVA brushes and
PlanarClean®
Technology could significantly
reduce copper post polish defects (particles,
organic residues and scratches)
Improved formulations for enhanced particle
and organics removal
Improved manufacturing for lower product
defectivity
Optimized brush design with polymer innovation
and surface treatment
Optimized pretreatment for reduced break-in times
pCMP Clean Formulations and Brush Technology
pCMP Clean Formulations and Brush Technology
Copper interconnect yield and reliability is a key
concern for advanced node technologies (<20 nm) |
![]() Analyst Day
2013 | 14 Purifier
Applications:
Toxic
gas
packaging
and
filtration expertise enables tighter impurity
control
Purifier
Media:
Carbon
adsorbent
capabilities
and purifier design drives improvements in
purifier capacity and efficiency
Gas
Delivery
Systems:
Gas
delivery
systems
and purification technology enables optimized
applications-based solutions
Implant Gas Handling and Purification Technology
Implant Gas Handling and Purification Technology
Gas impurity control to increasingly stringent
contamination standards is a key concern for
advanced node technologies |
![]() Analyst Day
2013 | 15 Integrating concentration sensing, fluidic control
and dispense expertise with formulation know-
how could improve mixing and managing of
volatile and complex chemistries for cleaning
and plating applications
Enables blend-on-the-fly
capability for
formulations prone to in-situ defect formation
Enables access to new wet chemical applications
Improved monitoring and control
Accelerated yield learning
Formulated Wet Chemistries and Point-of-Use Blending
Formulated Wet Chemistries and Point-of-Use Blending
Concentration control and in-situ defect formation
are increasing issues in formulated chemistries for
advanced node applications |
![]() Analyst Day
2013 | 16 Unique
Capability
Leverage
strengths
of combined Entegris to unlock new value
Technical capability for rapid innovation
Breadth of technologies
Global reach, local support
Unique
Position
Enable
new
paradigms
within the semiconductor ecosystem
Wet chemistries and wetted surfaces
Gases and gas-wetted surfaces
Solids and solid material delivery
Unique
Opportunity
Create
differentiated solutions to accelerate
customer yield ramps
Winning Strategy
Winning Strategy |
![]() Entegris®,
the
Entegris
Rings
Design®
and
Creating
a
Material
Advantage®
are
trademarks
of
Entegris,
Inc.
©2014 Entegris, Inc. All rights reserved. |
![]() Todd
Edlund SVP, General Manager
Critical Materials Handling Business
A Platform for Growth and Stability
A Platform for Growth and Stability |
![]() Analyst Day
2014 | 2 Unique breadth of technology
in the industry
Market leading positions in key
segments
Critical to customers
roadmaps,
but not dependent on the adoption
of a single technology
Focus on targeted growth areas
supported by strong portfolio of
defensible legacy positions
Unit-driven model
A Platform for Growth and Stability
A Platform for Growth and Stability
To be the first company
customers call for solutions
to improve their yields,
throughput and cost-
effectiveness when facing
contamination or materials
handling challenges.
Critical Materials Handling Mission
CMH Pro Forma 2013 Sales
$660 million
LMC
FMC
LP
ME
SM |
![]() Analyst Day
2014 | 3 Comprehensive Portfolio of Solutions
Comprehensive Portfolio of Solutions
Purify, deliver, handle and protect critical materials
Wet Etch and Clean
Lithography
Chemical Distribution
CMP
Life Sciences
Wafer Handling
Implant
Finished Wafer
and Devices
Data Storage
Dry Etch
Deposition
Flat Panel Display
Industrial
Aerospace
Life Sciences
Liquid
Microcontamination
Control (LMC)
Fluid Management
and Control (FMC)
Liquid Packaging
(LP)
Microenvironments
(ME)
Specialty Materials
(SM) |
![]() Analyst Day
2014 | 4 Liquid Microcontamination Control
Liquid Microcontamination Control
Filters and purifiers that remove
sub-micron sized particles, ions and
microbubbles from process liquids
Market Dynamics
Contamination-caused yield loss as line width shrinks
Increasing process steps and complexity
Improved metrology highlighting more impurities
Competitive Position
Market leader, one primary competitor in most
applications
Strategy
Leverage investments in R&D and manufacturing
capabilities
Migrate technology into adjacent markets
Filtration is the largest, most rapidly
growing product area
LMC
Proportion of Advanced Filtration
to Total Entegris Filter Sales
2009
2013
Legacy
nodes
65 nm
and below
35%
28%
3x nm
and below |
![]() Analyst Day
2014 | 5 Fluid Management and Control
Fluid Management and Control
Source: Entegris estimates
Market Dynamics
More precise blending for advanced chemistries
Trend towards single-wafer tools
Increasing requirements for process control,
flow capacity and purity
Increasing number of wet
tools due to multi-
patterning
Fewer but larger fab facility projects
Competitive Position
Fragmented, Entegris leads at high-end
Strategy
Leverage new sensing technologies
Ultrapure fluid handling,
measurement and control
solutions
The move to process automation is increasing
the available market for Entegris solutions
Key Entegris
Opportunities per System
FMC
11
24
28
63
26
40
72
138
Liquid
Filter
Gas Filter
Flow
Controller
Total Key
Parts
Batch
Single Wafer |
![]() Analyst Day
2014 | 6 Liquid Packaging
Liquid Packaging
Source: SEMI and Entegris analysis
Ultrapure container and
dispense solutions for highest
performance lithography and
WEC chemicals
Semi Wafer Processing Chemicals Market
$ in millions
Market Dynamics
Contamination of high-value chemistries during
transport and storage a growing concern
Efficient use of high-value chemicals
Need for safe handling
Competitive Position
Leading position for advanced solutions;
competition is alternate form factors
Strategy
Leverage combined technology capabilities
More usage of high-value chemistries is driving new
packaging needs and increasing market size
LP
$0
$200
$400
$600
$800
$1,000
$1,200
$1,400 |
![]() Analyst Day
2014 | 7 Microenvironments
Microenvironments
Products that protect and transport
wafers, reticles and other critical
substrates from damage and
contamination
Market Dynamics
Increased impact of wafer contamination at
advanced nodes
particles, moisture, metals, etc.
Next wafer size transition pushed out
Competitive Position
#1 position for advanced 300 mm FOUPs;
leading share for shippers at legacy wafer sizes
Strategy
Provide differentiated solution for 300 mm FOUPs
Be ready for 450 mm when it comes
ME
Winning virtually all opportunities
for new 300 mm FOUPs
In-Fab Test Results Show
Benefits of Entegris EBM FOUP
Technology Node
65 nm and
above
40 nm
28 nm
Standard Material
Entegris Barrier
Material (EBM)
1000
723
75
50
4
2 |
![]() Analyst Day
2014 | 8 Specialty Materials
Specialty Materials
Advanced graphite, silicon carbide,
and specialty coatings for industrial
and semiconductor manufacturing
processes
Market Dynamics
Use of higher temperatures in processes
Need for extended life and reduced process
variation solutions for consumables
Drive for fewer and smaller particles generated
Competitive Position
Serves multiple markets, with fragmented
competition of large diversified players
#1 position in e-chucks for ion implant
applications
Strategy
Leverage carbon and organic chemistry
knowledge to develop differentiated solutions
SM
Platform for growth in diversified markets
Wafer Holding
(Hot Chucks)
Implant
Beam-Line
Materials
(Carbon)
Dry Etch
Consumables
(SiC/PVD)
Next-Gen
Solutions
(Ceramics)
6
8
10
12
14
16
18
20
2013
2014
2015
2016
2017
2018
2019
2020
2021
Year
Critical Particle Size for Advanced
Semiconductor Processes |
![]() Analyst Day
2014 | 9 Entegris is Uniquely Positioned
Entegris is Uniquely Positioned
Breadth of solutions from production to consumption
Our technologies protect, transport, filter, control and dispense liquids
Our microenviroments protect and transport the wafer from grower to chip
|
![]() Analyst Day
2014 | 10 Competitive Landscape is Fragmented
Competitive Landscape is Fragmented
Customers favor more capable supplier partners for their increasing demands
Size of circles reflects approximate relative semiconductor sales, based on company
estimates Global Footprint
(# of
employees
logarithmic
scale)
Large
GEMU
Miraial
Pall
St. Gobain
Toyo Tanso
Parker
Shin Etsu
Gudeng
Small |
![]() Analyst Day
2014 | 11 Increased need for purity
Challenges We are Solving
Challenges We are Solving
Tighter filters that are cleaner
More robust microenvironments
Precise fluid management and sensing
Cleaner, more secure packaging
Higher performing dispense solutions
New materials and coatings solutions
New fluid handling solutions
Entegris Solutions
Increased need for process
control
New, expensive materials that
are susceptible to contamination
More demanding process
requirements (e.g., temperatures) |
![]() Analyst Day
2014 | 12 Example #1:
Increased Need for Purity
Example #1:
Increased Need for Purity
4X nm
ArF-I
High
Concentration
3X nm
2X nm
ArF-i DP/NTD
Weaker
Concentration
<2X nm
ArF-i QP
EUV/DSA
Specialized
Ultra-
Cleaning
20-10 nm filtration/
purification: DIW
50-30 nm filtration
<10 nm filtration/purification:
chemicals/solvents
QuickChange®
NX
Symmetric
media
Asymmetric
PTFE media
New polymer,
morphology
Solaris®
NMB
NanoFiber
PP media
Protego®
Plus
IPA purifier
Impact 8G UC
Torrento ®
X
Intercept®
Asymmetric
UPE Media
Selective
separation |
![]() Analyst Day
2014 | 13 For advanced nodes, lithography-caused defects have the largest
impact on yields, and microbubbles are the leading cause
Example #2
New, Expensive Materials that are Susceptible to Contamination
Example #2
New, Expensive Materials that are Susceptible to Contamination
No headspace,
indirect pressure
With headspace,
indirect pressure
Direct pressure
Threshold for significant
bubble generation
0
20
40
60
80
100
Dispense Time (in hours)
Threshold
for slight
bubble generation
1500
1750
2000
2250
2500
2750
3000
3250 |
![]() Analyst Day
2014 | 14 Example #2
New, Expensive Materials that are Susceptible to Contamination
Example #2
New, Expensive Materials that are Susceptible to Contamination
Up to 99.9% utilization of expensive photo resist
vs. 95% for rigid bottles |
![]() Analyst Day
2014 | 15 Platform for Continued Expansion into Adjacent Markets
Platform for Continued Expansion into Adjacent Markets
30% of CMH sales are to markets outside of semiconductors
Flat
Panel
Semi
Solar
Industrial
Data
Storage
LED
Aerospace
Life
Sciences
Critical
Materials
Handling |
![]() Analyst Day
2014 | 16 Large, stable legacy business with clear pathways for growth
Need for more process purity and control driving market
growth and new product opportunities
Growing share in key areas
Platform for diversification
Summary
A Platform for Growth and Stability
Summary
A Platform for Growth and Stability |
![]() Entegris®,
the
Entegris
Rings
Design®
and
Creating
a
Material
Advantage®
are
trademarks
of
Entegris,
Inc.
©2014 Entegris, Inc. All rights reserved. |
![]() Chris
Kramer SVP, General Manager
Electronic Materials Business
Chris Kramer
SVP, General Manager
Electronic Materials Business
A Process Innovator
A Process Innovator |
![]() Analyst Day
2014 | 2 Growing importance of specialty
materials
Unique breadth of technology
in the industry
Track record of innovation
Market-leading positions in key
segments
Unit-driven model
Focus on customer engagement
to win at leading nodes
Formulated performance materials for advanced electronic devices
A Process Innovator
A Process Innovator
Leading global provider
of critical performance
materials that enable high
yield, cost-effective
manufacturing within the
semiconductor industry.
Electronic Materials Mission
SG
GMC
SPI
ADM
EM Pro Forma 2013 Sales
$392 million |
![]() Analyst Day
2014 | 3 SDS®
gas delivery systems
Chambergard
gas diffusers
ViaForm®
copper plating
chemistry
Copper post-etch cleans
(ESC-784, ST-250)
PlanarClean®
advanced
copper post-CMP cleans
ProE-VAP®
emerging node
CVD, ALD precursors and
vaporization technologies
Planarcore®
PVA brushes
A History of Innovation
A History of Innovation
Resulting in market-leading solutions |
![]() Analyst Day
2014 | 4 Electronic Materials Enable
You Use Entegris Materials Every Day
You Use Entegris Materials Every Day
Entegris materials reside in your advanced electronic devices
Safe and efficient delivery of
highly toxic implant gases
Low-contamination
environments to manufacture
advanced chips
Complex circuitry through
proprietary metal interconnect
materials
Selective residue removal from
chips with formulated cleans |
![]() Analyst Day
2014 | 5 Why Materials Matter:
Advanced Electronics Require Advanced Materials
Why Materials Matter:
Advanced Electronics Require Advanced Materials
Increasing impact of materials innovation on chip performance
Source: Left
Entegris; right
Semico Research
Node in nm
Positioned to benefit from growing complexity
and increased reliance on formulated materials
Node in nm
0
400
800
1,200
1,600
2,000
65
45/40
32/28
22/20
14
Chips Becoming More Complex
Process Steps to Manufacture Chip
65
45/40
32/28
22/20
14
and More Reliant on Materials
Relevant Impact on Performance
Scaling
Design
Materials |
![]() Analyst Day
2014 | 6 Integrated
product
portfolio
offerings
address
critical
customer
needs
Products that Span the Entire Integrated Stack
Products that Span the Entire Integrated Stack
Copper Conductor
Precursors for adv. barrier materials
PVD seed
Post-etch wet cleans
Copper plating materials
Post-copper CMP cleans
Wire
Via
Passivation
CVD dielectrics
Low-k dielectrics
Etch materials
Post-etch wet cleans
Photochemistry packaging
Contacts
CVD Tungsten (Fluorine free)
Liner/Barrier (TDMAT)
Post-etch wet cleans
Pre-Metal Dielectric
PMD film and dopants
Etch materials
Post-etch wet cleans
Photochemistry packaging
Materials Entegris provides to
the semiconductor industry
Intermetal Dielectric and Caps
Low-k dielectrics
Etch materials
Post-etch wet cleans
Post-CMP cleans
Photochemistry packaging
Gate/Junction Region
CVD dielectrics
SDS implant materials
ALD dielectric and metal precursors
Etch materials
Post-etch wet cleans
Post-CMP cleans
Photochemistry packaging
Memory Applications
High-k dielectrics and dopants
Metal electrode materials
Emerging memory-specific materials
IC Cross Section |
![]() Analyst Day
2014 | 7 Positioning of Specialty Gases (ATMI) with Gas Microcontamination
Control (Entegris)
Better serve delivery of toxic gases
Leverage carbon technology
Adding CMP products (Entegris) to Surface Prep and Integration
(ATMI) to optimize product development activities related to plating,
polish and clean
Advanced Deposition Materials (ATMI) adds depth of product
knowledge throughout entire semiconductor stack
Businesses aligned to better deliver product solutions to our customers
Electronic Materials Key Product Areas
Electronic Materials Key Product Areas
Specialty Gases
(SG)
Gas
Microcontamination
Control (GMC)
Surface Prep
and Integration
(SPI)
Advanced Deposition
Materials (ADM) |
![]() Analyst Day
2014 | 8 The Broadest Array of Specialty Chemical Solutions
for Advanced Semiconductor Manufacturing
The Broadest Array of Specialty Chemical Solutions
for Advanced Semiconductor Manufacturing
No competitor has similar breadth of product offerings
Entegris
Competitor A
(Chem. Co.)
Competitor B
(Chem. Co.)
Competitor C
(Chem. Co.)
Competitor D
(Chem. Co.)
Competitor E
(Filtrat. Co.)
Ion Implant
Gas
Plating
Materials
Wet Cleans
CMP
Components
Deposition
Materials
Gas
Filtration/
Purification |
![]() Analyst Day
2014 | 9 Market Dynamics
Need for safe and efficient delivery of toxic gases
Growing need for dopants and precision
mixtures at advanced nodes
Competitive Position
Strong market share (~85%)
Competitive technology less capable
Strategy
Address new molecules and applications
for leading nodes
Grow into adjacent markets
Source: VLSI Research
Specialty Gases
Specialty Gases
Industry-standard, sub-atmospheric
pressure delivery solution for highly
toxic gases
Implant Materials
6% CAGR 2012-2017
SG
Advanced nodes create additional opportunities for specialty gases
-20%
-10%
0%
10%
20%
30%
0
50
100
150
200
250
Implant Materials
Y/Y Growth |
![]() Analyst Day
2014 | 10 Gas Microcontamination Control
Gas Microcontamination Control
Source: Entegris
Leader for process critical
gas and ambient
contamination control
GMC
Smaller Concentration and
More Critical Contaminants
Leader in the measurement and control of gas phase contamination
1 ppm
100 ppb
10 ppb
100 ppt
10 ppt
100 ppq
1
NH
Concentrations of most
critical contaminants
Types of contaminants
3
10
Acids, Bases
NH SO HCl
50
100+
?
1990
1995
2000
2005
2010
2015
3
3
2
3
2
NH SO HCl
Market Dynamics
More contaminants and need for
increased control
Proliferation of purification needs across
all processes
Applications in semi and other markets,
e.g., LED
Competitive Position
Technology leadership;
market leader in fragmented market
Strategy
Leverage strong analytical capabilities
with contamination control products |
![]() Analyst Day
2014 | 11 Surface Prep and Integration
Surface Prep and Integration
Industry-leading provider of
solutions that enable advanced
copper metallization
SPI
Well positioned to leverage integrated Entegris portfolio
IC Cross Section
Passivation
Dielectric
Etch Stop Layer
Dielectric Capping
Layer
Copper Conductor with
Barrier/Nucleation Layer
Pre Metal Dielectric
Tungsten Contact Plug
Metal 1 Pitch
Wire
Via
Market Dynamics
Device complexity and scaling is driving:
Introduction of new films/materials
Reduced tolerance for material loss and defects
Becoming more fragmented at each node transition
Competitive Position
Market leader in plating, post-etch cleans and Post
CMP clean solutions for Cu metallization
Strategy
Leverage integrated portfolio to increase value
Form strategic partnerships to identify solutions
for disruptive technologies
Metal 1
Global
(= M1X1.5~2 µm)
Intermediate
(= M1X1) |
![]() Analyst Day
2014 | 12 Advanced Deposition Materials
Advanced Deposition Materials
CVD and ALD materials used in front-
and back-end of line applications;
and packaging and delivery solutions
optimized for gases, liquids and solids
New Deposition Opportunities
on 3D Devices
FinFET Device
ADM
Logic and memory applications lead to future product line growth
Market Dynamics
Device complexity including 3D devices and dimensional
scaling is driving:
Increasing number of films including sacrificial layers
Introduction of new films/materials
Competitive Position
Leader in fragmented market
Identify and demonstrate new materials
Enable delivery and use of materials in high-volume
manufacturing
Strategy |
![]() Analyst Day
2014 | 13 Invested in infrastructure to serve global customer base
Customer Engagement Key to Winning Advanced Nodes
Customer Engagement Key to Winning Advanced Nodes
Deep technical expertise and
application knowledge
Unique capabilities to enhance
speed, effectiveness and efficiency
of material development process
Differentiating Product
Development Capabilities
Dedicated customer support organization
focused on specific customer needs
Collaborative customer engagements
which leverage global state-of-the-art
infrastructure/tech centers
Intense Customer Relationships
Korea Tech
Taiwan Tech Center
Danbury Tech Center
i2M Center
Analytical Services Lab
San Diego Tech Center
Tokyo Applications Lab
Electronic Materials Labs and Tech Centers
Center |
![]() Analyst Day
2014 | 14 Ongoing interconnect scaling
proves challenging for Cu
electroplating process
Large via arrays (10
6
contacts)
require extremely low defect levels
ViaForm Excel
chemistry is
industry-leading solution for
20 nm technology
Extendibility to 16 nm/14 nm
node demonstrated as well
Reliability of advanced interconnects requires void-free Cu fill
ViaForm®
Excel
is a trademark of Enthone Inc., SEM images used with permission
of Enthone Inc.
Example #1
Advancement in Cu Electroplating
Example #1
Advancement in Cu Electroplating
M1
M2
Cross Section SEM
Top View SEM |
![]() Analyst Day
2014 | 15 New interconnect materials drives
stringent clean performance
requirements:
Highly efficient clean performance
Compatibility with dielectric, hard mask
and barrier metals
TitanKlean
family of formulations is
industry-leading solution for post-etch
clean at 28 nm and beyond
Increasingly complex interconnect process integration requires
more sophisticated cleans
Example #2
Advancement in Interconnect Cleans
Example #2
Advancement in Interconnect Cleans
Dielectric HM
TK9 Family
Compatible with
Copper and Cobalt
Copper and Ruthenium
(Mx
Vx Solution)
TK10 Family
Compatible with
Copper and Tungsten
(V0
M1 Solution)
Low
-k
TiN HM
Damaged Low-k
Barrier
EM barrier
Residues
Cu |
![]() Analyst Day
2014 | 16 Unique breadth of technology in the industry
Track record of innovation
Market-leading positions in key segments
Unit-driven model
Focus on customer engagement to win at leading nodes
Formulated, performance materials for advanced electronic devices
Summary
A Process Innovator
Summary
A Process Innovator |
![]() Entegris®, the Entegris Rings Design® and Creating a Material
Advantage® are trademarks of Entegris, Inc.
©2014 Entegris, Inc. All rights reserved.
|
![]() Corey
Rucci VP, Business Development
Corey Rucci
VP, Business Development
ATMI Integration and
New Business Development
ATMI Integration and
New Business Development |
![]() Analyst Day
2014 | 2 Began integration planning early in process (November 2013)
Focus on customers, productivity and profitability during
integration
Emphasis on speed of integration
Focus on retaining key talent from both organizations during
integration
Retain and leverage ATMIs strengths
Adequately resource integration team with a proper charter
and governance
Our integration follows a formal methodology with a clear strategy
Integration Strategy
Delivering on the Value
Integration Strategy
Delivering on the Value
Preparation
People
Execution |
![]() Analyst Day
2014 | 3 Integration Strategy and Planning
Integration Strategy and Planning
Integration Strategy
and Pre-Planning
Detailed Integration
Planning
Cultural Integration
Merger
Implementation
Process
Optimization
Feb 4, 2014
Announcement
April 30, 2014
Acquisition Closing
Provide
Training
Create
Charter
Develop
Risk
Mitigation
Strategies
Develop
Comm.
Plans
Develop
Project
Integration
Plans
Develop
Staffing and
Retention
Plans
Review
Cultural
Due
Diligence
Develop
Cultural
Integration
Plan
Execute
Plans
Capture
Lessons
Learned
Analyze
and
Optimize
Processes
Complete
In Process
Not Started
Define
Integration
Strategy &
Governance
Step 2
Step 3
Step 4
Step 5
Step 6
Step 7
Step 8
Step 9
Step 10
Step 11
Step 12
Step 13
Step 14
Note: Based on the Pritchett model.
Develop
Process
Optimization
Plans
Step 1
Establish
Guiding
Principles |
![]() Analyst Day
2014 | 4 Accomplished to Date
Completed detailed integration
planning phase
Broad functional integration teams
comprised of Entegris and ATMI
Integration project plans and risk
mitigation strategies established
Completed staffing and retention
plans
Completed an effective Day One
All employee notifications completed
within 24 hours of closing
Next
Milestones
Q214
Q115
ERP Conversion
Product training
Employee compensation and
benefits harmonization
Office consolidation
Shifting focus to
product/revenue synergies
Integration Actions
Integration Actions |
![]() Analyst Day
2014 | 5 Cost Synergies
Cost Synergies
Tracking to $30M annualized synergy savings
Corporate
Back Office
Field Ops
$9 million
$13 million
$8 million
IT resources
Finance
resources
IT
Infrastructure
Legal/HR
Supply chain
Executive
SEC
Board of
Directors
Audit fees
Account
teams
Sales support
Office
consolidation |
![]() Analyst Day
2014 | 6 Timing of Projected Synergies
Timing of Projected Synergies
Annualized synergies ($ in millions)
2014
2015
$0
$10
$20
$30
$40
Q3
Q4
Q1
Q2
Q3
Q4 |
![]() Analyst Day
2014 | 7 Fostering New Business Initiatives
Fostering New Business Initiatives |
![]() Analyst Day
2014 | 8 Leveraging Technology in Innovative Ways
Leveraging Technology in Innovative Ways
Product Description
eVOLV
e-waste
recycling
system
Zero-waste
cost-effective and
scalable process for recovering
valuable metals and components
from end-of-life electronic waste
BrightBlack®
precision
carbon
Precision-engineered carbon
materials for clean and sustainable
technology solutions
Proprietary technology
Nearly 100% extraction efficiency
Significant cost advantage over
less green
alternatives such
as smelting
License and royalty model
Based on core SDS technology
Biogas upgrading
CO
2
capture
Energy storage
Adsorbed natural gas storage
Beads
Monoliths
Pellets
Powder
Key Features |
![]() Entegris®, the Entegris Rings Design® and Creating a Material
Advantage® are trademarks of Entegris, Inc.
©2014 Entegris, Inc. All rights reserved.
|
![]() Greg
Graves Executive Vice President and CFO
Greg Graves
Executive Vice President and CFO
Financial Perspective
Financial Perspective
ENTEGRIS PROPRIETARY AND CONFIDENTIAL |
![]() CONFIDENTIAL | 2
Entegris: The Next Chapter
Entegris: The Next Chapter
Historical Perspective
Bringing Together Two Strong Performers
The New Paradigm
A Significant Shift in Earnings Power
Balance Sheet Management
Leveraged but Prudent
Q2 Outlook
Positive Trends Near-Term |
![]() CONFIDENTIAL | 3
Sales
$693 Million
Operating Margin*
15%
Cash from Operations
$109 Million
Earnings Per Share**
$0.57
Strong performance
*Adjusted operating margin,**Non-GAAP earnings.
We Delivered in 2013
We Delivered in 2013
Declined 3% overall; contraction
consistent with our markets
and peers
Margin consistent with our target model
Cash balance of $384 million
Executed on our defined capital
allocation strategy |
![]() CONFIDENTIAL | 4
Bringing Together Two Strong Performers
Bringing Together Two Strong Performers
$183
16.9%
$169
16.0%
$193
17.6%
$1,082
$1,055
$1,101
$1,025
$629
Revenue
$ in millions
Operating Margin
$ in millions and % sales
Entegris
ATMI
$70
19.1%
$66
18.2%
$57
16.2%
$113
15.8%
$103
14.8%
$136
18.2%
$399
$688
$749
$716
$693
$231
$337
$352
$366
$361
2009
2010
2011
2012
2013
2011
2012
2013 |
![]() CONFIDENTIAL | 5
Growth rate vs. industry (4 year CAGR)
Revenue Growth
Historical Performance vs. the Industry
Revenue Growth
Historical Performance vs. the Industry
Outgrowing the industry benchmark through the cycle
Note: All industry data per Gartner. Entegris industry benchmark
is 65% millions of square inches (MSI)
produced and 35% wafer front-end equipment (WFE). ATMI industry benchmark is 100% MSI
produced. Combined benchmark is 78% MSI produced and 22% WFE.
Entegris
ATMI
Combined
12.3%
14.8%
7.8%
11.8%
10.6%
13.8%
Industry
ENTG
Industry
ATMI
Industry
ENTG+ATMI
Combined |
![]() CONFIDENTIAL | 6
Entegris: The Next Chapter
Entegris: The Next Chapter
Historical Perspective
Bringing Together Two Strong Performers
The New Paradigm
A Significant Shift in Earnings Power
Balance Sheet Management
Leveraged but Prudent
Q2 Outlook
Positive Trends Near-Term |
![]() CONFIDENTIAL | 7
The New Entegris
Target Model
The New Entegris
Target Model
Major Assumptions:
No change to Entegris base target model
ATMI Stand-alone
target model
Synergies of $30 million consistent with current expectations;
no revenue synergies
Interest expense of $38 million based on current interest
rates and all debt outstanding
Tax rate of 28%
Shares outstanding 139 million
Existing
ENTG Target
Model
ATMI Stand-
Alone Target
Model
Synergies
New
Entegris
Target Model
Interest
Expense
+
+
+
= |
![]() CONFIDENTIAL | 8
Quarterly
Revenue
Level
1
Revenue ($M)
$250
$280
$310
Adjusted
Operating
Margin
2
14% -
16%
17% -
19%
20%+
Earnings
Per
Share
3
$0.14 -
$0.16
$0.20 -
$0.22
$0.26+
New Entegris
Target Model
New Entegris
Target Model
1
Represents range of adjusted operating margin based on respective quarterly revenue
levels. 2
Adjusted for amortization of intangible assets and one-time charges and expenses.
3
Includes interest expense of $38 million i.e., all debt outstanding; implied tax rate of 28%;
assumes shares outstanding equal 139 million.
$0.40 flow through on each $ of revenue |
![]() CONFIDENTIAL | 9
Illustrative model
2013 revenue at new target model
1
Adjusted operating income per new target model.
2
Combined EPS assumes no other income/expense, all existing debt remains
outstanding, 28% combined tax rate and 139 million shares
outstanding. EPS Baseline Formula
EPS Baseline Formula
2013
Illustrative
Result
Entegris
ATMI
Combined
Revenue ($M)
$693
$361
$1,051
$1,051
Operating Income
1
$173
% of Revenue
16.5%
Earnings Per Share
2
$0.57
$0.72
Apply
new target
model
26% Accretion |
![]() CONFIDENTIAL | 10
Illustrative model
modest industry growth and market outperformance,
operating leverage and debt reduction
1
Operating margin per revised target model including $30 million of synergies.
2
EPS assumes no other income/expense, 28% combined tax rate and 139 million shares
outstanding. 3
Reflects three-year industry growth assumption which conservatively compares to
Gartner three-year CAGR
estimates: MSI +3.8% and WFE +6.1%.
4
Assumes term loan is reduced by $300 million. Each $100 million reduction in term loan is
$0.016 per share annually. EPS Growth Formula
EPS Growth Formula
2013
Pro Forma
Combined
Three-Year
Industry
3.0%
Growth >
Industry
1.5%
Operating
Leverage
Interest
Expense
Reduction
4
Revenue
$1,051
$1,149
$1,200
$1,200
$1,200
Operating Income
$173
$240
$240
% of revenue
17%
20%
20%
Interest expense
($38)
($38)
($28)
EPS
$0.72
$1.05
$1.10
1
2
3
Growth |
![]() CONFIDENTIAL | 11
$ in millions
Projected Synergies
Projected Synergies
2015
2014
Anticipate 2015 actual synergies of $25M,
Exit 2015 with $30 million run rate
$0
$10
$20
$30
$40
$0.0
$2.5
$5.0
$7.5
$10.0
Q3
Q4
Q1
Q2
Q3
Q4 |
![]() CONFIDENTIAL | 12
$ in millions
Source: Company filings, Entegris management.
Combined Historical Capital Expenditures
Combined Historical Capital Expenditures
$32
$48
Maintenance level of capital expenditures is
approximately $50-55 million annually
$78
$102
$57
$53
$50
$32
$45
$53
$45
$48
$53
$50
$3
$25
$53
$9
2010
2011
2012
2013
2014E
2015E
2016E
Strategic Capacity Investments
Ongoing Capital Expenditures |
![]() CONFIDENTIAL | 13
Free
Cash Flow
Capability
1
ATMI and ENTG combined
generated more than $500
million of free cash flow
since the 2009 trough
With major capital projects
largely complete, free cash
flow should re-accelerate
Annual free cash flow
generation going forward
of $100+ million
Strong Cash Flow Generator
Strong Cash Flow Generator
1
Free cash flow capability assumes no M&A activity, change in capital structure, or
acquisition-related costs. Cumulative Free Cash Flow
$ in millions
Illustrative
Actual Free
Cash Flow
$0
$100
$200
$300
$400
$500
$600
$700
$800
$900 |
![]() CONFIDENTIAL | 14
Entegris: The Next Chapter
Entegris: The Next Chapter
Historical Perspective
Bringing Together Two Strong Performers
The New Paradigm
A Significant Shift in Earnings Power
Balance Sheet Management
Leveraged but Prudent
Q2 Outlook
Positive Trends Near-Term |
![]() CONFIDENTIAL | 15
Balance Sheet
Leveraged, but Also Very Liquid
Balance Sheet
Leveraged, but Also Very Liquid
$ and share data in millions
Following the transaction closing,
Entegris still has $2.60 in cash per share
May 31, 2014
Total Cash
$362
U.S. Cash
$95
Foreign Cash
$267
Total Assets
$1,755
Total Debt
$820
ABL Revolver
$0
Term Loan B
$460
Notes
$360
Shareholders' Equity
$757
Common Shares Outstanding
139 |
![]() CONFIDENTIAL | 16
Asset based loan/revolver (undrawn)
$75
Available based on dollar value of domestic
Accounts Receivable and Inventory
Term loan B
$460
1% annual principal payments during seven-year term of loan
Minimum interest rate of 3.50% (2.75% + Libor/0.75% Floor)
Required principal payments of 50% of excess cash
flow Senior unsecured notes
$360
6.00% fixed interest rate for the term of loan
No principal payment during eight-year term of loan
Debt Structure
Debt Structure
No maintenance covenants (i.e. financial performance test)
Stress tested using a cyclical downside case
Significant
pro
forma
liquidity;
maintain
at
least
$125
million
between domestic cash and ABL
Balance Sheet Structured for Safety and Soundness |
![]() CONFIDENTIAL | 17
Reducing leverage increases financial flexibility
Improves ability to complete additional strategic transactions
Makes share repurchases a viable option
Reducing leverage drives EPS growth
Current interest costs of $38 million equate to $.18 drag on annual EPS
At current rates each $100 million reduction in term loan is $.016
of annual EPS
Each $100 million of reduction in notes is $.03 of annual EPS
Intent is to repay debt through the following sources:
Current excess domestic cash of approximately $45 million
Domestic free cash flow
Tax
efficient
repatriation
of
international
cash
approximately
$150 million
Improving working capital management
Balance Sheet Management
Focus on Debt Reduction
Balance Sheet Management
Focus on Debt Reduction |
![]() CONFIDENTIAL | 18
Entegris: The Next Chapter
Entegris: The Next Chapter
Historical Perspective
Bringing Together Two Strong Performers
The New Paradigm
A Significant Shift in Earnings Power
Balance Sheet Management
Leveraged
but Prudent
Q2 Outlook
Positive Trends Near-Term |
![]() CONFIDENTIAL | 19
$ in millions, except per share data
1
Includes two months of ATMI results.
2
Includes estimated impact of purchase accounting, transaction costs and integration
expenses. Q2 Update Guidance
Comparison to Initial View
Q2 Update Guidance
Comparison to Initial View
Entegris
April 2014
Entegris
Revised
Entegris + ATMI
Revenue guidance
$165 -
$175
$175 -
$185
$235 -
$245
Net income
GAAP
$13 -
$18
($25 -
$30)
Non-GAAP
$14 -
$19
$24 -
$28
Earnings per share
GAAP
$0.09 -
$0.13
($0.18 -
$0.22)
Non-GAAP
$0.10 -
$0.14
$0.17 -
$0.20
Positive industry trends
Revenue strength across the business
1
2
2
|
![]() CONFIDENTIAL | 20
Key Takeaways
Key Takeaways
Our solutions are critical to yield improvement in advanced
manufacturing processes
We are combining two companies with track records of
outperforming the market and delivering superior profitability
The new
Entegris has significant earnings power and is poised
to deliver EPS in excess of $1.00 per share
We have a sound balance sheet structure with a clear plan to
reduce debt
Our Q2 outlook reflects positive near-term industry trends |
![]() Entegris®, the Entegris Rings Design® and Creating a Material
Advantage® are trademarks of Entegris, Inc.
©2014 Entegris, Inc. All rights reserved.
|
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