8-K 1 u92407e8vk.htm CHIPPAC INC CHIPPAC INC
 



UNITED STATES
SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549


FORM 8-K

CURRENT REPORT
Pursuant to Section 13 or 15(d) of
The Securities Exchange Act of 1934

Date of Report (Date of earliest event reported)

October 18, 2004


ChipPAC, Inc.

(Exact name of registrant as specified in its charter)
         
Delaware
  000-31173   77-0463048

 
 
 
 
 
(State or other
jurisdiction
of incorporation)
  (Commission File
Number)
  (IRS Employer
Identification No.)

47400 Kato Road, Fremont California 94538

(Address of principal executive offices, including zip code)

(510) 979-8000

(Registrant’s telephone number, including area code)

(Former name or former address, if changed since last report)

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions (see General Instruction A.2. below):

o   Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
 
o   Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
 
o   Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
 
o   Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))



 


 

SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned thereunto duly authorized, as of October 18, 2004.
         
  CHIPPAC, INC.
(Registrant)
 
 
  By:   /s/ Tan Lay Koon    
    Tan Lay Koon   
    President & Chief Executive Officer   
 

 


 

         

CORPORATE RELEASE

STATS CHIPPAC LTD. ANNOUNCES CONSENT
SOLICITATION BY CHIPPAC, INC. IN RESPECT OF
CHIPPAC’S 2.5% CONVERTIBLE SUBORDINATED NOTES DUE 2008

Singapore and United States — October 18, 2004 — STATS ChipPAC Ltd. (“STATS ChipPAC” — NNM: STTS and SGX: ST Assembly) announced today that its wholly owned subsidiary ChipPAC, Inc. (“ChipPAC”) is soliciting consents from holders of ChipPAC’s 2.5% Convertible Subordinated Notes due 2008 (the “Notes”) to amend certain provisions of the indenture pursuant to which the Notes were issued. The consent solicitation will expire at 5:00 p.m., New York City time, on Monday, November 1, 2004, unless extended by ChipPAC (as extended, the “Expiration Time”).

The purpose of the consent solicitation is to obtain the requisite consents of the holders of Notes to amend the indenture to replace ChipPAC’s obligation to file with the Securities and Exchange Commission (“SEC”) annual reports and such other information, documents and reports specified in Sections 13 and 15(d) of the Exchange Act of 1934 with an obligation of STATS ChipPAC to file all such reports, with the SEC as are applicable to a foreign corporation.

If consents from at least a majority of the outstanding principal amount of the Notes are received and the supplemental indenture effecting the amendment is executed, ChipPAC will pay to holders of record as of the record date who delivered consents on or prior to the Expiration Time a fee of $2.50 for each $1,000 principal amount of Notes to which such consents relate. The record date of the consent solicitation is 5:00 p.m., New York City time, on Friday, October 15, 2004. ChipPAC will pay this fee as soon as practicable following the Expiration Time. ChipPAC may terminate or amend the consent solicitation at any time prior to the Expiration Time.

On October 11, 2004, STATS ChipPAC agreed to guarantee the Notes on a subordinated basis. Standard & Poor’s announced today that it had raised its ratings on the Notes to “BB-” from “B-.”

Deutsche Bank Securities Inc. is acting as Solicitation Agent in connection with the consent solicitation. Questions regarding details of the solicitation should be directed to Deutsche Bank Securities Inc., attention: Jenny Lie, at (866) 627-0391 (US toll-free) or (212) 250-2955 (collect).

The detailed terms and conditions of the consent solicitation are contained in the Consent Solicitation Statement dated October 18, 2004. Holders of Notes can obtain copies of the Consent Solicitation Statement and related materials from the information agent for the consent solicitation, Global Bondholder Services Corp. at (866) 470-4300 (toll free) or (212) 430-3774 (collect for banks and brokers).

This press release does not constitute a solicitation of consents with respect to any of the Notes. The consent solicitation is being made solely pursuant to the Consent Solicitation Statement and related materials.

 


 

About STATS ChipPAC Ltd. (STATS ChipPAC)

STATS ChipPAC Ltd (“STATS ChipPAC” — NNM: STTS and SGX: ST Assembly), is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC’s value proposition is total solutions of fully integrated, multi-site, end-to-end assembly and testing solutions that bring products to market and volume faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs), as well as fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, Korea, China, Malaysia, Taiwan and the United States, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company’s customer support offices are located in the Netherlands, China, Singapore, Japan, Taiwan, Korea, Malaysia and the United States (California’s Silicon Valley, Arizona, Texas, Massachusetts, Florida, Colorado and North Carolina). STATS ChipPAC’s facilities include those of its subsidiary, Winstek Semiconductor Corporation in Hsinchu Valley, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with the Company’s Test Development Center in Singapore, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both Nasdaq National Market and The Singapore Exchange. In addition, STATS ChipPAC is also listed on the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at www.statschippac.com

Certain statements in this press release are forward-looking statements that involve a number of risks and uncertainties. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise. Unless otherwise specified, references to “$” are to the lawful currency of the United States of America.

     
Singapore Contacts :
   
 
   
Elaine Ang
   
Manager, Investor Relations / Corporate
   
Communications
   
Tel : (65) 6824 7705, Fax : (65) 6720 7826
   
email : Elaine.Ang@STATSChipPAC.com
   
 
   
US Contacts :
   
 
   
Drew Davies
  Lisa Lavin
Director, Investor Relations
  Marcom Manager
Tel : (408) 586 0608, Fax : (408) 586 0652
  Tel : (208) 939 3104, Fax : (208) 939 4817
email : Drew.Davies@STATSChipPAC.com
  email : Lisa.Lavin@STATSChipPAC.com
 
   
The Ruth Group
  The Ruth Group
David Pasquale – Executive Vice President
  Andrew Rodriguez
Tel : (646) 536 7006
  Tel : (646) 536 7032
email : dpasquale@theruthgroup.com
  email : arodriguez@theruthgroup.com