-----BEGIN PRIVACY-ENHANCED MESSAGE----- Proc-Type: 2001,MIC-CLEAR Originator-Name: webmaster@www.sec.gov Originator-Key-Asymmetric: MFgwCgYEVQgBAQICAf8DSgAwRwJAW2sNKK9AVtBzYZmr6aGjlWyK3XmZv3dTINen TWSM7vrzLADbmYQaionwg5sDW3P6oaM5D3tdezXMm7z1T+B+twIDAQAB MIC-Info: RSA-MD5,RSA, AduUL2SuP+s3ZE4U/0eTjGWu8LzgzTp05B3dcg8AdVAPtMeA98vVsSlsIS6ZiJkS QFdbcNXYSWN4NHCHePiJuw== 0001145549-04-001228.txt : 20040920 0001145549-04-001228.hdr.sgml : 20040920 20040920081828 ACCESSION NUMBER: 0001145549-04-001228 CONFORMED SUBMISSION TYPE: 8-K PUBLIC DOCUMENT COUNT: 1 CONFORMED PERIOD OF REPORT: 20040920 ITEM INFORMATION: Other Events FILED AS OF DATE: 20040920 DATE AS OF CHANGE: 20040920 FILER: COMPANY DATA: COMPANY CONFORMED NAME: CHIPPAC INC CENTRAL INDEX KEY: 0001093779 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 770463048 STATE OF INCORPORATION: CA FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 8-K SEC ACT: 1934 Act SEC FILE NUMBER: 000-31173 FILM NUMBER: 041036703 BUSINESS ADDRESS: STREET 1: 47400 KATO ROAD CITY: FREMONT STATE: CA ZIP: 94538 BUSINESS PHONE: 5109798000 MAIL ADDRESS: STREET 1: 47400 KATO ROAD CITY: FREMONT STATE: CA ZIP: 94538 8-K 1 u92395e8vk.htm CHIPPAC, INC. ChipPAC, Inc
 



UNITED STATES
SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549


FORM 8-K

CURRENT REPORT
Pursuant to Section 13 or 15(d) of
The Securities Exchange Act of 1934

Date of Report (Date of earliest event reported)

September 20, 2004


ChipPAC, Inc.

(Exact name of registrant as specified in its charter)
         
Delaware
  000-31173
  77-0463048

 
 
 
 
 
(State or other
jurisdiction
of incorporation)
  (Commission File
Number)
  (IRS Employer
Identification No.)

47400 Kato Road, Fremont California 94538

(Address of principal executive offices, including zip code)

(510) 979-8000

(Registrant’s telephone number, including area code)

(Former name or former address, if changed since last report)

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions (see General Instruction A.2. below):

     
o
  Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
     
o
  Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
     
o
  Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
     
o
  Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))



 


 

SIGNATURES

     Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned thereunto duly authorized, as of September 20, 2004.
         
  CHIPPAC, INC.
(Registrant)

 
 
 
  By:   /s/ Tan Lay Koon    
    Tan Lay Koon   
    President & Chief Executive Officer   
 

 


 

CORPORATE RELEASE

STATS CHIPPAC LTD. ANNOUNCES DELIVERY OF
REQUISITE CONSENTS AND EXTENSION OF CONSENT
DATE FOR THE TENDER OFFER AND CONSENT
SOLICITATION BY CHIPPAC INTERNATIONAL COMPANY
LIMITED FOR ANY AND ALL OF CHIPPAC
INTERNATIONAL’S 12 3/4% SENIOR SUBORDINATED NOTES

Singapore and United States — September 20, 2004 — STATS ChipPAC Ltd. (“STATS ChipPAC” — NNM: STTS and SGX: ST Assembly) announced today the extension of the Consent Date in connection with the previously announced tender offer and consent solicitation in respect of any and all of the outstanding 12 3/4% Senior Subordinated Notes due 2009 (CUSIP Nos. 169659 AC3 and 169659 AB5) (the “Notes”) issued by its indirect wholly owned subsidiary ChipPAC International Company Limited (“ChipPAC International”). The Consent Date has been extended from 11:59 p.m., New York City time, on Friday, September 17, 2004 to 5:00 p.m., New York City time, on Friday, September 24, 2004, unless such date is further extended in ChipPAC International’s sole discretion (as amended, the “Consent Date”). The tender offer will expire at 5:00 p.m., New York City time, on Monday, October 4, 2004, unless extended by ChipPAC International (the “Expiration Date”).

As of September 17, 2004, ChipPAC International has received valid tenders of Notes and deliveries of related consents from holders of approximately 62%, or $102,540,000 aggregate principal amount, of Notes outstanding. Accordingly, the requisite consents have been obtained authorizing the adoption of the proposed amendments to the indenture governing the Notes that would eliminate substantially all of the restrictive covenants and certain events of default in the indenture. If ChipPAC International accepts Notes validly tendered on or prior to the Expiration Date and not withdrawn on or prior to the Consent Date, ChipPAC International will execute a second supplemental indenture containing the proposed amendments that will become operative on the acceptance date.

The total consideration for each $1,000 principal amount of the Notes validly tendered on or prior to the Consent Date and accepted for payment pursuant to the tender offer will be $1,063.75. The total consideration will be the sum of a purchase price of $1,053.75 for each $1,000 principal amount of Notes tendered and accepted for payment pursuant to the tender offer (the “Purchase Price”) and a consent payment (the “Consent Payment”) of $10.00 for each $1,000 principal amount of Notes validly tendered prior to the Consent Date and not withdrawn. Holders whose valid tenders are received after the Consent Date, but prior to the Expiration Date, will receive only the Purchase Price. All payments will include accrued and unpaid interest on the principal amount tendered to, but not including, the payment date.

The terms of the tender offer and consent solicitation, except for the new Consent Date, are described in the Offer to Purchase and Consent Solicitation, dated September 3, 2004. This

 


 

announcement amends and supplements the Offer to Purchase Consent Solicitation solely with respect to the Consent Date. All other terms and conditions of the Offer to Purchase and Consent Solicitation Statement remain in full force and effect.

ChipPAC International has retained Deutsche Bank Securities Inc. to serve as Dealer Manager and Solicitation Agent for the tender offer and consent solicitation and has retained Global Bondholder Services Corporation to serve as Information Agent in the tender offer, consent solicitation and change of control offer. Requests for documents may be directed to Global Bondholder Services Corporation, by telephone at (866) 873-6300 (toll free). Questions regarding the tender offer and consent solicitation should be directed to Deutsche Bank Securities Inc. at (800) 553-2826 (toll free) or (212) 250-4270 (collect).

This press release does not constitute an offer to purchase, a solicitation of an offer to purchase, or a solicitation of tenders or consents with respect to any of the Notes. The tender offer and consent solicitation are being made solely pursuant to the Offer to Purchase and Consent Solicitation Statement and related documents.

 


 

About STATS ChipPAC Ltd. (STATS ChipPAC)

STATS ChipPAC Ltd. (“STATS ChipPAC” — NNM: STTS and SGX: ST Assembly), is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC’s value proposition is total solutions of fully integrated, multi-site, end-to-end assembly and testing solutions that bring products to market and volume faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs), as well as fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, Korea, China, Malaysia, Taiwan and the United States, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company’s customer support offices are located in the Netherlands, China, Singapore, Japan, Taiwan, Korea, Malaysia and the United States (California’s Silicon Valley, Arizona, Texas, Massachusetts, Florida, Colorado and North Carolina). STATS ChipPAC’s facilities include those of its subsidiary, Winstek Semiconductor Corporation in Hsinchu Valley, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with the Company’s Test Development Center in Singapore, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both Nasdaq National Market and The Singapore Exchange. In addition, STATS ChipPAC is also listed on the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at www.statschippac.com

Singapore Contacts :

Elaine Ang
Manager, Investor Relations / Corporate
Communications
Tel : (65) 6824 7705, Fax : (65) 6720 7826
email : Elaine.Ang@STATSChipPAC.com

US Contacts :

     
Drew Davies
Director, Investor Relations
Tel : (408) 586 0608, Fax : (408) 586 0652
email : Drew.Davies@STATSChipPAC.com
  Lisa Lavin
Marcom Manager
Tel : (208) 939 3104, Fax : (208) 939 4817
email : Lisa.Lavin@STATSChipPAC.com
 
   
The Ruth Group
David Pasquale — Executive Vice President
Tel : (646) 536 7006
email : dpasquale@theruthgroup.com
  The Ruth Group
Andrew Rodriguez
Tel : (646) 536 7032
email : arodriguez@theruthgroup.com

 

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