10-K

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 10-K

(Mark One)

x ANNUAL REPORT PURSUANT TO SECTIONS 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934

For the fiscal year ended December 31, 2002

¨ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934

For the transition period from                      to                     .

Commission file number 000-31173

ChipPAC, Inc.

(Exact Name of Registrant as Specified in Its Charter)

Delaware (State or Other Jurisdiction of Incorporation or Organization) 77-0463048 (I.R.S. Employer Identification No.)

47400 Kato Road, Fremont, California 94538

(Address of Principal Executive Offices, Zip Code)

Registrant’s telephone number, including area code (510) 979-8000

Securities registered pursuant to Section 12(b) of the Act:

Title of Each Class Name of Each Exchange on Which Registered

None

Securities registered pursuant to Section 12(g) of the Act:

Class A common stock, $.01 par value

Indicate by check mark whether the registrant: (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.  Yes  x  No  ¨

Indicate by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S-K is not contained herein, and will not be contained, to the best of registrant’s knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10-K or any amendment to this Form 10-K.  ¨

Indicate by check mark whether the registrant is an accelerated filer (as defined in Rule 12b.2 of the Act).  Yes  x  No  ¨

Aggregate market value of voting stock held by non-affiliates of the registrant as of March 20, 2003: $190,022,769,             94,983,299 shares of the Registrant’s Class A common stock were outstanding on March 20, 2003. No shares of the Registrant’s Class B common stock were outstanding on that date.

DOCUMENTS INCORPORATED BY REFERENCE

Portions of the Registrant’s Proxy Statement related to the 2003 Annual Meeting of Stockholders, to be filed subsequent to the date hereof—Part III.

TABLE OF CONTENTS

		PAGE
PART I		3
Item 1.	BUSINESS	3
Item 2.	PROPERTIES	11
Item 3.	LEGAL PROCEEDINGS	12
Item 4.	SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS	12
PART II		13
Item 5.	MARKET FOR REGISTRANT’S COMMON EQUITY AND RELATED STOCKHOLDER MATTERS	13
Item 6.	SELECTED FINANCIAL DATA	14
Item 7.	MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS	15
Item 7A.	QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET RISK	25
Item 8.	FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA	27
Item 9.	CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE	64
PART III		64
Item 10.	DIRECTORS AND EXECUTIVE OFFICERS OF THE REGISTRANT	64
Item 11.	EXECUTIVE COMPENSATION	64
Item 12.	SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT	64
Item 13.	CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS	64
Item 14.	CONTROLS AND PROCEDURES	64
Item 15.	EXHIBITS, FINANCIAL STATEMENT SCHEDULES, AND REPORTS ON FORM 8-K	64

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Part I

ITEM 1. BUSINESS

DISCLOSURE REGARDING FORWARD-LOOKING STATEMENTS

This annual report on Form 10-K contains forward-looking statements. In some cases, you can identify forward-looking statements by terminology such as “may,” “will,” “should,” “expects,” “plans,” “target,” “anticipates,” “believes,” “estimates,” “predicts,” “potential,” “continue” or the negative of these terms or other comparable terminology. These statements are only predictions and speak only as of their dates. These forward-looking statements are based largely on our current expectations and are subject to a number of risks and uncertainties, including those identified under Exhibit 99.1 of this annual report and other risks and uncertainties indicated from time to time in our filings with the SEC. Actual results could differ materially from these forward-looking statements. In addition, important factors to consider in evaluating these forward-looking statements include possible international conflicts, changes in general economic and external market factors, changes in our business or growth strategy or an inability to execute our strategy due to changes in our industry or the economy generally, the emergence of new or growing competitors and various other competitive factors. In light of these risks and uncertainties, there can be no assurance that the matters referred to in the forward-looking statements contained in this annual report will in fact occur.

Industry

ChipPAC is one of the world’s largest independent providers of semiconductor packaging, test, and distribution services. We offer one of the broadest portfolios of packages and test services for integrated circuits. We supply packaging solutions to some of the leading semiconductor companies servicing the computing, communications, consumer, automotive and industrial end markets. We are a leader in providing high end packaging solutions, including ball grid array packages, or BGA packages, and chip scale packages, or CSP packages, the most advanced types of mass produced packages. In addition to providing assembly and test services on a global basis, we are the largest independent semiconductor packaging and test service provider in mainland China. As consumers demand smaller electronic devices with more functionality, there is a greater requirement for power regulation and generation, which we expect to drive demand for our power packages. We are a leader in high-volume assembly, test and distribution of discrete and analog power packages. We are also one of the leading providers of advanced packaging products that address the needs of semiconductors used in wireless LAN and handset applications, including chip-scale, stacked die and flip-chip technologies.

Our online design and characterization process, referred to as SmartDESIGN^™, is a proprietary web-based design collaboration system that we believe provides a higher rate of product qualification, improved technical performance and shorter time-to-market service for our customers. This system enables us to link to our customers via the Internet to aid with the performance of package design, electrical, thermal and mechanical analysis and to model end system performance.

Outsourcing of packaging and test services to independent packagers like ChipPAC continues to expand due to several factors, including time-to-market pressures, cost reduction, resource allocation, equipment utilization, the increased technological complexity of packaging and the growth of fabless semiconductor manufacturers. Historically, outsourced semiconductor manufacturing services have grown faster than the semiconductor market as a whole. Management believes that the lack of investments in assembly and test capacity by semiconductor manufacturers over the past two years will position outsource providers well to capture enhanced volume levels. The packaging and test industry is highly fragmented as we compete against a number of established independent packaging houses as well as the internal capabilities of many of our largest customers.

The semiconductor industry has historically experienced volatility with sharp periodic downturns and slowdowns. These downturns have been characterized by, among other things, diminished product demand, excess production capacity and accelerated erosion of selling prices. The semiconductor industry is presently recovering from a downturn, and we expect conditions to continue to improve in 2003.

Our headquarters are located in Fremont, California, and our manufacturing facilities are strategically located in China, Malaysia and South Korea, to address the global needs of our customers. We have design personnel co-located at customer sites, as well as design centers located in Arizona, Malaysia and South Korea to provide 24-hour design support to our customers.

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We believe that we differentiate ourselves from our competitors by the following factors:

• High End Technology Expertise—We are one of the world’s largest providers of outsourced substrate based packages, which accounted for approximately 60.3% and 53.4% of our packaging revenue for the year ended December 31, 2002 and 2001, respectively. Our substrate based packages are used for most high-end applications such as computing, wireline and wireless communications devices, gaming, and stacked die packages for portal applications. Our advanced package portfolio also includes next generation flip-chip technology for system on a chip, or SOC, which is used in network servers and telecom switching devices, as well as single and multi-die CSP packaging for digital signal processors, or DSPs, and other chipsets for wireless handset, wireless LAN, and other portable handheld equipment such as PDAs. In addition, we have critical expertise for testing radio frequency, or RF, devices. We believe that our advanced technology expertise and our commitment to research and development will enable us to continue to drive the development of solutions for next generation semiconductor packages.

• Leader in Growing Power Discrete, Power Management and Analog Segment—We are a leader in high-volume semiconductor assembly and test services for discrete, analog, RF and mixed-signal technologies, for small signal and power applications. Power products manage the electricity requirements for multiple components, ensuring an accurate and efficient flow of voltage so electronic devices run longer and more efficiently. These products are used to switch or manage the electrical current requirements within electronic systems, ensuring an accurate and efficient flow of electricity. As electronics become increasingly more complex, portable and performance-driven, the demand for power regulation and management increases significantly. A broad and fast-growing range of end markets, including portable devices, household appliances, computers, automotive systems and telecommunications, will continue to drive power semiconductor usage and the demand for our power products.

• Strategic Geographic Diversification—We are strategically located to take advantage of industry outsourcing trends. In-Stat predicts that within the next nine years, China will be the second largest market in the world for semiconductors. Our Shanghai, China facility, which was established in 1994, is the largest packaging and test provider in China, and we are the first independent provider of chip-scale BGA packages in that country. We provide local content for products sold into the Chinese market, including cellular telephones and portable devices where local content requirements are being driven by the Chinese government. Our high-volume packaging site for advanced BGA packages is in Ichon, South Korea, which is significant for its proximity to large semiconductor customers and to an available pool of highly-skilled research and development and technical staff. Our Malaysian facility in Kuala Lumpur positions us to benefit from the growth in fabless manufacturing taking place in Southeast Asia. Our headquarters in Silicon Valley and state-of-the-art research and development facilities in Arizona and South Korea are located near our customers and provide us with the ability to work on a 24-hour-basis with our customers in the design process and in supply chain management.

• New and Diversifying Customer Base—In 2002, we continued to diversify and broaden our customer base to over 80 customers worldwide. Our customers comprise some of the largest companies in the semiconductor industry. Our largest customer accounted for 16.6% of our total sales in 2002, down from 20.2% of total sales in 2001, and was 13.2% for the quarter ended December 31, 2002.

• Among the Leaders in Growing Test Services—Through our long-term partnerships and existing customer base, we are well positioned to capitalize on the rapid growth of outsourced testing by semiconductor producers. This growth in outsourced testing is driven by the increasing demand for RF, mixed-signal and high performance logic devices that require greater capital expenditures on testing equipment. We have made significant capital expenditures on testing equipment that provides us with the capability to test mixed-signal, digital logic, memory, power and RF devices. By increasing our emphasis on our test business and adding capacity, we have significantly increased our test revenue over the past several years, and we expect this growth to continue. Our test business revenue grew to $56.2 million in 2002, an increase of $10.7 million from $45.5 million in 2001.

Our Services

We offer semiconductor packaging and test services to the semiconductor industry for applications in communications, computing, consumer, automotive and industrial end markets. Approximately 84.5% and 86.2% of our revenue were derived from packaging services during the years ended December 31, 2002 and 2001 respectively. Approximately 15.5% and 13.8% of our revenue were derived from test and other services during the years ended December 31, 2002 and 2001, respectively.

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Since customers require their suppliers to pass a lengthy and rigorous qualification process that can be costly to the customers, we believe they generally do business with a few suppliers. As our services are considered part of the customer’s manufacturing infrastructure, we must have dedicated resources and systems to provide flexible manufacturing, quick-turns and real-time information transfers.

Packaging

We have provided semiconductor packaging and test services since 1984, and offer a broad range of packaging formats for a wide variety of electronics applications. Our two main types of packaging services, leadframe and substrate, contributed approximately 33.6% and 50.9%, respectively, of revenue for the year ended December 31, 2002.

Leaded Packaging

“Leaded” or “Lead frame” packaging is the most widely used packaging type and is used in almost every electronic application, including automobiles, household appliances, desktop and notebook computers and telecommunications. Leaded packages have been in existence since semiconductors were first produced. According to Electronic Trends Publication, Leaded devices continue to account for approximately half of the total industry packaging volume. Leaded packages are characterized by a semiconductor die encapsulated in a plastic mold compound with metal leads surrounding the perimeter of the package. With leaded packages, the die is attached to a leadframe (a flat lattice of leads) and very small gold wires are bonded (welded) to the chip and then welded to the leads to provide the interconnect. The chip is then encapsulated in plastic to form a package, with the ends of the leadframe leads protruding from the edges of the package to enable connection to a printed circuit board. This packaging type has evolved from packages designed to be plugged into a printed circuit board by inserting the leads into holes on the printed circuit board to the more modern surface-mount design, in which the leads or pins are soldered to the surface of the printed circuit board. Specific packaging customization and improvements are continually being engineered to improve electrical and thermal performance, shrink package sizes and enable multi-chip capability.

We offer a wide range of lead counts and body sizes within this packaging group to satisfy customer die design variations. Our traditional leaded packages are at least two millimeters in thickness and include PDIP, PLCC, and SOIC. Our advanced leaded packages are thinner than our traditional leaded packages, approximately 2 millimeters in thickness or less, and generally have a finer pitch lead spacing, allowing for a higher pin count and greater functionality in a smaller package foot print. Our advanced leaded packages include MQFP, TQFP, iQUAD^®, TSSOP and SSOP. Our acquisition of the Malaysian business in 2000 added power packages to our portfolio.

Power Packaging

Power semiconductors are used in a variety of end-markets, including telecommunications and networking systems, computers and computer peripherals, consumer electronics, electronic office equipment, automotive systems and industrial products. These end markets increasingly depend upon power regulation and control in the trend toward smaller devices and longer operating times. Packaging manufacturers are left to contend with shrinking chip geometries owing to continued emphasis upon greater mobility and portability. Power semiconductors typically involve higher current and voltage levels than memory, logic and microprocessor devices. The high current involved with switching on/off high voltages and the phase control of AC signals results in considerable power dissipated internally that produces heat. Thus our power packages are designed in such a way as to conduct the resultant heat away from the chip as power is dissipated, preventing the power device from being destroyed.

Power package assembly is somewhat different from non-power IC assembly as it often employs special solder alloys requiring different semiconductor bonding machines. Higher current levels of power semiconductors likewise require larger diameter aluminum and gold wire than non-power IC’s to carry the load. Our Malaysian facility maintains a vast array of these special machines needed for power semiconductor assembly and test. With a capacity of over 25.0 million units per week, we believe we are the industry leader in power package assembly supporting a number of the world’s major power semiconductor manufacturers, whose products are designed and used in power supplies, battery chargers, ignition modules, voltage regulators, motor controllers, ignition controllers and power management devices.

Substrate Packaging

Substrate packaging represents one of the fastest growing areas in the packaging industry and is used primarily in computing platforms, networking, hand held consumer products, wireless communications devices, personal digital assistants, video cameras, home electronic devices such as DVDs and home video game machines. BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors. As the number of leads surrounding the integrated circuit increased, high lead count packages experienced significant electrical shorting problems. The BGA methodology solved this problem by effectively creating leads on the bottom surface of the package in the form of

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small bumps or solder balls. In a typical BGA package, the semiconductor die is placed on top of a plastic or tape laminate substrate rather than a lead frame. The die is connected to the circuitry in the substrate by a series of fine gold wires that are bonded to the top of the substrate near its edges. On the bottom of the substrate is a grid of metal balls that connect the packaged device to a printed circuit board. Benefits of BGA packaging over leaded packaging include:

• smaller size;

• greater pin count, or number of connections to the printed circuit board;

• greater reliability;

• better electrical signal integrity; and higher power dissipation

• easier attachment to a printed circuit board.

We supply our customers with substantially the entire family of BGA packaging services offered in the marketplace today, including:

• Standard BGA. Standard BGA packaging has a grid array of balls on the underside of the integrated circuit, and is used in high-performance applications, like personal computer chipsets, graphic controllers and DSPs. A standard BGA package generally has greater than 100 pins. Standard BGA packages have better thermal and electrical performance than leaded packages. They also feature more advanced surface mount technology, allowing for easier handling in the packaging process. Standard BGA packaging services accounted for 52.2% and 64.4% of our Substrate packaging revenue in the years ended December 31, 2002 and 2001, respectively.

• Chip-Scale. Chip-scale BGA, LFCSP, and BCC packaging includes all packages where the package is less than 1.2 times the size of the silicon die. Chip-scale BGA is a substrate-based package that is designed for memory devices and other medium pin count semiconductors and requires dense ball arrays in very small package sizes, like wireless telephones and personal digital assistants, video cameras, digital cameras and pagers. We also include LFCSP and BCC packages in this category. While they use a metal lattice instead of a laminate substrate, they are a chip-scale package serving these markets.

• System-in-Package. System-in-Package, or SiP, is a family of chip-scale-packages that contain several (1-4) semiconductor die in one package, either stacked on top of each other or side by side. This technology allows greater functionality in the same package footprint and thickness without significant cost increase. These packages are used in wireless handsets, consumer products and mobile computing applications.

• Flip-chip BGA. Flip-chip BGA packaging in which the silicon die is directly attached to the substrate using gold bumps instead of solder balls provides the most dense interconnect at the lowest cost and highest performance. Flip-chip BGA technology is used in a wide array of applications ranging from consumer products to highly sophisticated application specific integrated circuits, referred to as ASIC, computer chipsets, graphics and memory packages. While we believe that flip-chip BGA represents the next generation of BGA packaging technology, we believe that standard BGA and chip-scale BGA packaging will experience long life cycles as have many of our leaded packaging solutions.

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The following chart summarizes the different types of packaging services we offer and revenue for the year ended December 31, 2002. The full names of each packaging type are provided in the Glossary accompanying our registration statement on Form S-1 (Registration Number 333-39428).

	Year Ended December 31, 2002		Year Ended December 31, 2001		Year Ended December 31, 2000
	Revenue (in millions)	% of Total Assembly Revenue	Revenue (in millions)	% of Total Assembly Revenue	Revenue (in millions)	% of Total Assembly Revenue	Package Types	Application
Lead frame
	$109.0	35.4%	$104.9	37.0%	$132.2	29.4%	Traditional: PDIP, PLCC, SOIC, SSOP, TSOP, TSSOP, SIP, DPAK, D2PAK, and TO220	Telecommunications automobiles, household, and appliances, and desktop and notebook computers
	$   13.3	4.3%	$  27.2	9.6%	$  40.8	9.1%	Advanced: MQFP, TQFP, LQFP, and iQUAD®	Personal computers and telecommunications
Advanced
	$112.3	36.6%	$110.9	39.2%	$218.3	48.7%	BGA: PBGA, M2BGA® TBGA, EBGA, and Flip PAC	Personal computer chipsets, graphic controllers high-end network servers products, application specific integrated circuits, microprocessors and memory packages
	$ 72.9	23.7%	$  40.2	14.2%	$  57.4	12.8%	Chip Scale Packages: EconoCSP™, M2CSP®, Micro BGA™, LFCSP™, BCC, and Flip Chip CSP	Wireless telephones, personal digital assistants, video cameras, wireless pagers, and wireless LAN

Test Services

We also provide our customers with semiconductor test services for a number of device types, including mixed-signal, digital logic, memory, power and RF devices. Semiconductor testing measures and ensures the performance, functionality and reliability of a packaged device, and requires knowledge of the specific applications and functions of the devices being tested. In order to enable semiconductor companies to improve their time-to-market, streamline their operations and reduce costs, there has been an increasing trend toward outsourcing both packaging and test services. We have capitalized on this trend by enhancing our test service capabilities. Our test revenue increased 23.5% from 2001 to 2002. Our test revenue was essentially flat in 2001 compared to 2000 in a year where overall sales in the industry were significantly down compared to the prior year. The acquisition of the Malaysian business expanded our mixed-signal tester base and provided us with critical expertise for testing RF devices, one of the fastest growth areas for test outsourcing. We have also noted an increased demand from our customers to provide both assembly and test services on a full turn-key basis.

In order to test the capability of a semiconductor device, a semiconductor company will provide us with its proprietary test program and specify the test equipment to run that program. Alternatively, our customers at times may consign their test equipment to us. The devices to be tested are placed into a socket-custom load board by an automated handling system, which is connected to the test equipment, which then tests the devices using software programs developed and supplied by our customers. The cost of any specific test and the time required to conduct it, ranging from a few milliseconds to several seconds, varies depending on the complexity of the semiconductor device and the customer’s test program.

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Other Services

We also provide a full range of other value-added services, including:

• Design and Characterization Services. We offer design and characterization services at our Arizona, South Korea, Malaysia and China facilities. Our design engineers at these facilities select, design and develop the appropriate package, leadframe or substrate for that device by simulating the semiconductor’s performance and end-use environment.

• Dry Pack Services. In order to prevent the failure of any semiconductors due to exposure to moisture during shipping, we “dry pack” many of our packaged integrated circuits in specially sealed, environmentally secure containers.

• Tape and Reel Services. Many electronic assembly lines utilize “tape and reel” methods in which semiconductors are placed into a pocket tape to enable faster attachment to the printed circuit board. We offer a service in which we ship packaged and tested devices on a tape and reel mechanism rather than in a tray, to facilitate the assembly process.

• Warehousing and Drop Shipment. In order to enable semiconductor companies to improve their time-to-market and reduce supply chain and handling costs, we offer warehousing and drop shipment services in which we ship packaged semiconductor devices directly to our customers’ customers.

• Wafer Probe. We offer a wafer sort operation where an electrical test is performed on the die while still in wafer form. This process establishes which die on each wafer are suitable to be assembled into a final package.

Customers

In 2002, we continued to diversify and broaden our customer base to over 80 customers worldwide. Our customers are comprised of companies in the semiconductor industry located primarily in the United States of America. Our customers include some of the largest semiconductor companies in the world. There were five customers in 2002 and three customers in 2001 that each accounted for more than 10% of our total sales. These customers include Atmel, Fairchild, Intel, Intersil, LSI Logic and nVIDIA. Our largest single customer accounted for 16.6% and 20.2% of our total sales in 2002 and 2001, respectively. We anticipate that this customer concentration will decrease as we add new customers for which we have already become qualified and customers with which we are currently undergoing qualification.

Our customers are located around the world, but principally in the United States of America. We report geographic distribution of revenue based on the location of our customers’ headquarters. The following table details the percentage of total revenue we received from the United States, Asia and Europe:

	Year Ended December 31,
	2002		2001		2000
United States of America	89	%	92	%	83	%
Asia	10		6		14
Europe	1		2		3
Total	100	%	100	%	100	%

In general, our customers rely on at least two sources for packaging. A packaging and test service company must pass a lengthy and rigorous qualification process that typically takes three to six months, and typically costs the customer $250,000 to $300,000. Once a primary packager has been selected, that packager gains insight into its customer’s business operations and an understanding of its products as part of the overall working relationship. These factors, combined with the pressures of a semiconductor company to meet the time-to-market demands of its customers, result in high switching costs for semiconductor companies, making them adverse to changing or adding additional suppliers. We have been successful in attracting new customers because we are one of a few independent packaging and test companies that offers packaging, test and distribution services for a full portfolio of packages. Also, new customers are drawn to our unique advanced technologies.

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Marketing, Sales and Customer Support

We provide sales support to our customers through an international network of offices coordinated from our British Virgin Islands company:

• United States of America:

• Chandler, Arizona

• Fremont, California

• Irvine, California,

• Longmont, Colorado,

• Palm Bay, Florida,

• Northborough, Massachusetts,

• Austin, Texas,

• Dallas, Texas,

• Shanghai, China,

• Tokyo, Japan,

• Kuala Lumpur, Malaysia,

• Kampen, Netherlands,

• Singapore

• Ichon, South Korea,

• Seoul, South Korea, and

• HsinChu City, Taiwan

Our account managers, applications engineers, customer service representatives and sales support personnel form teams that focus on a specific customer or geographic region.

Customers deliver rolling six month forecasts and release production die to us in daily or weekly increments for packaging, test and distribution. These near-term forecasts guide us as to anticipated volumes, but provide no meaningful backlog statistics. Substantially all of our materials inventory is purchased based on customer forecasts. We carry small quantities of inventory and we have relatively low levels of finished goods inventory.

Our marketing efforts focus on creating a brand awareness and familiarity with our advanced device packaging technologies and an understanding of our end-user market applications in wireless handset and PDA graphics, PC chipsets, wireless LAN, memory, storage and networking. We market our leadership in advanced packaging, test technology, and distribution and our ability to supply a broad line of packaging and test services to the semiconductor industry. We target engineers and executive level decision makers through a direct sales force, the delivery of “white papers” at industry conferences, mailings of technical brochures and newsletters, advertisements in trade journals and our website.

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Suppliers

Our packaging operations depend upon obtaining adequate supplies of materials on a timely basis. The principal materials used in our packaging process are lead frames, rigid and flexible substrates, gold wire and molding compound. We purchase materials based on the demand forecasts of our customers. Our customers are responsible for the costs of any unique materials that we purchase but do not use, particularly those lead frames and substrates that are ordered on the basis of customer-supplied forecasts. We work closely with our primary materials suppliers to ensure the timely availability of materials supplies, and we are not dependent on any one supplier for a substantial portion of our materials requirements. We had no significant long-term agreements with materials suppliers in 2002. The materials we procure are normally available and we are able to meet our production requirements from multiple sources through periodic negotiation and placement of written purchase orders. We typically combine our global requirements into centrally negotiated blanket purchase orders to gain economies of scale in procurement and more significant volume discounts. Should material become scarce, we would look to enter into long-term supply agreements with key suppliers. Approximately 79.0% and 82.0% of our substrate costs in the years ended December 31, 2002 and 2001, respectively, were incurred from the purchase of materials from South Korea, with the balance coming primarily from Japan and Taiwan. We expect that in the next several years, an increasing portion of our materials will be supplied from sources in China, Taiwan, and Southeast Asia.

Our packaging operations and expansion plans also depend on obtaining adequate quantities of equipment on a timely basis. To that end, we work closely with our major equipment suppliers to insure that equipment deliveries are on time and the equipment meets our stringent performance specifications.

Intellectual Property

Our ability to develop and provide advanced packaging technologies and designs for our customers depends in part on our proprietary know-how, trade secrets and other patented and non-patented, confidential technologies, which we either own or license from third parties. We have licenses to use numerous third party patents, patent applications and other technology rights, as well as trademark rights, in the operation of our business. We believe that these licenses are renewable under normal commercial terms once they expire.

Our primary registered trademark and trade name is “ChipPAC^®.” We own or are licensed to use other secondary trademarks.

Research and Development

Our research and development efforts are focused on developing new packages, design, assembly and test technologies and on improving the efficiency and capabilities of our existing packaging and test services. Technology development is a basic competence of ChipPAC and a key competitive factor in the packaging industry. We have invested considerable resources and we are among the leaders in new product and technology development. Our web based proprietary design and performance characterization, SmartDESIGN^™ capability, provides the shortest time-to-market with predictable performance.

During the past two years, we have introduced the following new package families:

•	M2CSP®	Molded multi-die chip scale package family with the following chip-stack combinations in      package profile thickness ranging from 1.0 to 1.4mm:
	ü    M2CSP®	Two-chip stack, same chip size
	ü    M2CSP®	Three-chip stack, “pyramid stack”
	ü    M2CSP®	Three-chip stack with the two chips same size
	ü    M2CSP®	Three-chip stack with three chips same size
	ü    M2CSP®	Four-chip stack, “pyramid stack”
	ü    M2CSP®	Four-chip stack with two chips same size
•	LFCSP™	Lead frame chip scale package
•	BCC, BCC+, BCC++	Bumped Chip Carrier package family
•	G4™	“Gigabit-Green-Gold-to-Gold” flip chip interconnection package family of CSPs and BGAs
•	TEBGA+	Thermally enhanced ball grid array family with integrated passive components
•	TEBGA-II	Higher thermal performance TEBGA
•	FC-MPM	Flip Chip Multi Package Module family module

Materials engineering plays a critical role in advanced packaging and has enabled us to develop environmentally friendly, lead free, and halogen free packaging, which is already required by several of our customers.

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We have established four design centers where new packages are designed and fully characterized for performance and tested both for package and system level reliability to meet end customer needs.

During 2002 and 2001, we spent approximately $10.1 million and $14.2 million, respectively, on research and development. The reduction in spending in 2002 is due to the timing of projects. Employee headcount in research and development went up by 9.2% in 2002, compared to 2001.

Competition

The packaging and test industry is highly fragmented. Our primary competitors and their primary locations are as follows:

• Advanced Semiconductor Engineering, Inc.—Taiwan

• Amkor Technology, Inc.—South Korea, Japan and the Philippines

• ASE Test Limited—South Korea, Taiwan and Malaysia

• Siliconware Precision Industries Co., Ltd.—Taiwan

Each of these companies has significant packaging capacity, financial resources, research and development operations, marketing and other capabilities, and has some degree of operating experience. These companies also have established relationships with many large semiconductor companies, which are current or potential customers of ours. We also compete with the internal packaging and testing capabilities of many of our largest customers. We believe the principal elements of competition in the independent semiconductor packaging market include time-to-market, breadth of packaging services, technical competence, design services, quality, yield, customer service and price. We believe that we compete favorably in these areas.

In general, our customers principally rely on at least two independent packagers. A packaging company must pass a lengthy and rigorous qualification process that can take a minimum of three months for a typical leaded package and can take more than six months for a typical BGA package. Once a primary packager has been selected, that packager gains insight into its customer’s business operations and an understanding of its products as part of the overall working relationship. These factors, combined with the pressures of a semiconductor company to meet the time-to-market demands of its customers, result in high switching costs for semiconductor companies, making them adverse to changing or adding additional suppliers. We have been successful in attracting new customers because we are one of a few independent packaging and test companies that offers packaging, test and distribution services for a full portfolio of packages.

Employees

As of December 31, 2002, we employed 5,845 full-time employees, of whom approximately 119 were employed in research and development, 5,395 in packaging and test services and 331 in marketing, sales, customer service and administration.

Approximately 1,215 of our employees at the Ichon, South Korea facility are represented by ChipPAC Korea Labor Union and are covered by collective bargaining and wage agreements. The collective bargaining agreement, which covers basic union activities, working conditions and welfare programs, among other things and the wage agreement are both effective to May 1, 2003. We believe that we have good relationships with our employees and unions.

SEC Reports

Our annual reports on Form 10-K, quarterly reports on Form 10-Q, current reports on Form 8-K, and all amendments to these reports filed with the U.S. Securities and Exchange Commission, are available for review free of charge on our website at www.chippac.com as soon as reasonably practicable after such material is electronically filed or furnished to the Commission.

ITEM 2. PROPERTIES

Our corporate headquarters are located in Fremont, California, and we provide all packaging, test and distribution services through facilities in Ichon, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. The Ichon facility was founded in 1985 and is both ISO-9002 and QS-9000 certified. The Shanghai facility was founded in 1994 and is also ISO-9002 certified and QS-9000 certified. The Kuala Lumpur facility is ISO-9002, QS-9000 and ISO-14001 certified.

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The following chart summarizes the information about our key facilities:

Facility Location	Leased/Owned	Sq. Ft.	Functions/Services	Principal Packaging or Service Provided
Fremont, California	Leased	56,320	Executive Offices, Research and Development, Sales, Marketing and Administration	Sales, Marketing, Administration and Design Review Services
Chandler, Arizona	Leased	5,357	Research and Development, Sales and Marketing	Design and Characterization Services
Shanghai, China	Owned (1)	442,000	Packaging and Test Services, Warehousing Services Distribution Services	Leaded IC, Chip-Scale, BGA, Packaging and Test
Ichon, South Korea	Leased	474,000	Packaging and Test Services, Research and Development, Warehousing Services Distribution Services	Advanced Leaded, BGA, Chip-Scale, Flip-Chip Packaging and Test
Kuala Lumpur, Malaysia	Owned (1)	524,000	Packaging and Test Services, Warehousing Services	Discrete Power, Leaded IC, Test and Distribution Services

(1) Building and improvements are owned by ChipPAC but upon the termination of the existing long-term land lease revert to the lessor in the years 2044 and 2086 for our facilities in Shanghai, China and Kuala Lumpur, Malaysia, respectively.

ITEM 3. LEGAL PROCEEDINGS

We are not involved in any legal proceedings the outcome of which we believe would have a material adverse effect on our business, financial condition or results of operations. From time to time, however, we are involved in claims that arise in the ordinary course of business, and we maintain insurance that we believe to be adequate to cover these claims.

ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS

No matters were submitted to a vote of our stockholders during the fourth quarter of 2002.

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Part II

ITEM 5. MARKET FOR REGISTRANT’S COMMON EQUITY AND RELATED STOCKHOLDER MATTERS

Our Class A common stock is traded on the Nasdaq National Market under the symbol “CHPC.” Public trading of the Class A common stock began on August 9, 2000. Prior to that, there was no public market for our common stock. The following table sets forth, for the periods indicated, the high and low sale price per share of the our Class A common stock as quoted on the Nasdaq National Market.

	HIGH		LOW
2003
January 1, 2003—March 20, 2003	$	3.750	$	2.220
2002
Fourth Quarter		5.020		0.990
Third Quarter		6.750		1.890
Second Quarter		12.550		4.660
First Quarter		9.970		5.230
2001
Fourth Quarter		8.590		1.850
Third Quarter		11.590		1.800
Second Quarter		10.690		3.750
First Quarter		6.675		2.781

As of March 20, 2003, there were approximately 83 stockholders of record of our Class A common stock.

Shares Authorized for Issuance under Equity Compensation Plans

The following table sets forth the total shares of our Class A common stock that may be received by option holders upon the exercise of currently outstanding options, the weighted average exercise price of those outstanding options and the number of shares of our Class A common stock that are still available for future issuance under our equity compensation plans after considering the stock options currently outstanding. All of the options described below have been or can be issued pursuant to our 1999 Stock Purchase and Option Plan, our 2000 Equity Incentive Plan and our 2000 Employee Stock Purchase Plan. All of these plans have been approved by our stockholders.

Plan Category	Shares to Be Issued Upon Exercise of Outstanding Options	Weighted Average Exercise Price of Outstanding Options		Number of Shares Remaining Available for Future Issuance Under Equity Compensation Plans1
Equity Compensation Plans Approved by Stockholders	7,290,435	$	3.92	16,124,454
Option Plans	6,424,132		4.14	7,861,497
Employee Stock Purchase Plan	866,303		2.30	8,262,957
Equity Compensation Plans Not Approved by Stockholders	None			None

Dividend Policy

We have not in the past paid, and do not expect for the foreseeable future to pay dividends on our common stock. Instead, it is anticipated that all earnings, if any, in the foreseeable future will be used for working capital and other general corporate purposes. The payment of dividends by us to holders of our common stock is prohibited by our senior credit facilities and is restricted by the indenture relating to our senior subordinated notes. Any future determination to pay dividends will be at the discretion of the board of directors and will depend upon, among other factors, the results of operations, financial condition, capital requirements and contractual restrictions.

¹ The number of shares available for issuance for under our 2000 Equity Incentive Plan increases each year by one percent of the total shares of our outstanding common stock.

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ITEM 6. SELECTED FINANCIAL DATA

ChipPAC, Inc.

Selected Historical Financial Data

(In thousands)

	For the Years Ended December 31,
	2002			2001			2000			1999			1998
Statement of Operations Data
Revenue	$	363,666		$	328,701		$	494,411		$	375,530		$	334,081
Gross profit		55,601			31,113			109,144			58,042			63,716
Operating income (loss)		7,993			(55,229	)		62,330			12,619			40,429
Net income (loss)		(28,855	)		(93,736	)		12,056			(7,308	)		32,303
Net income (loss) available to Common stockholders		(28,855	)		(93,736	)		2,869			(11,528	)		32,303
Net income (loss) per share available to Common stockholders:
Basic	$	(0.33	)	$	(1.36	)	$	0.05		$	(0.30	)	$	0.83
Diluted	$	(0.33	)	$	(1.36	)	$	0.05		$	(0.30	)	$	0.83
Shares use in per share calculation:
Basic		87,430			68,878			57,067			38,935			38,861
Diluted		87,430			68,878			58,253			38,935			38,861
Other Financial Data:
Depreciation and amortization	$	58,949		$	59,909		$	45,049		$	56,701		$	45,855
Debt issuance cost amortization		2,281			2,112			1,950			774			—
Acquisition of property and equipment		78,910			46,392			93,174			57,856			61,332
Balance Sheet Data (at period end):
Cash and short-term investments	$	44,173		$	41,872		$	18,850		$	32,117		$	68,767
Accounts receivable, less allowance for doubtful accounts		38,793			32,034			45,904			30,003			37,729
Working capital		34,395			(17,981	)		(16,296	)		10,224			20,320
Total assets		470,204			430,715			469,245			343,429			359,472
Total long-term debt, including current portion		267,887			333,627			290,200			300,000			133,715
Mandatorily redeemable preferred stock		—			—			—			82,970			—
Total stockholders’ equity (deficit)		115,544			(23,226	)		65,697			(122,886	)		113,191

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ITEM 7.     MANAGEMENT’S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS

The following discussion and analysis of our financial condition and results of operations covers in part periods prior to our initial public offering in August 2000. As a result of the initial public offering, we significantly changed our capitalization. Accordingly, the results of operations for periods subsequent to the initial public offering are not necessarily comparable to prior periods. The following discussion should be read in conjunction with the consolidated financial statements contained in this annual report.

Overview

In 1997, we were incorporated as a distinct entity and established as the parent of a stand-alone worldwide business. Prior to this time, we operated as a separate division of Hyundai Electronics, now Hynix Semiconductor, one of the world’s largest semiconductor manufacturers and a member of the Hyundai Group, the South Korean conglomerate. In 1999, as part of a recapitalization, a group of equity investors along with management obtained control of ChipPAC. This transaction was accounted for as a recapitalization.

Our revenue consists of fees charged to our customers for packaging, testing, and distribution of their integrated circuits. From 1996 to 2002, revenue increased from $179.2 million to $363.7 million, a cumulative annual growth rate of 12.5%, primarily from the growth of substrate or BGA packaging, the growth of test revenue and the acquisition of our Malaysian business in 2000. The semiconductor industry is inherently volatile with sharp periodic downturns and slowdowns. These downturns have been characterized by, among other things, diminished product demand, excess production capacity and accelerated erosion of selling prices. The semiconductor industry is presently recovering from the worst downturn in its history. Due to the severity of this downturn for the semiconductor industry and for our customers, we experienced the first decline in revenue on a year-over-year basis in our history in 2001. Our revenue for the year ended December 31, 2002 increased to $363.7 million or by 10.6% compared to the year ended December 31, 2001. Our continuing growth will depend upon factors influenced by current economic conditions such as replenishment of inventory in the electronics supply chain, gradual recovery in our end markets and the ramp-up of new customers acquired in 2002. We are positioned in the fastest growth markets. We have re-engineered our business models over the last two years to focus on products and customers in the fastest growth segments of the industry such as chips for use in wireless, broadband, consumer and automotive products. However, we are still solidly positioned in the computing and industrial markets, which will benefit from an overall economic recovery when it occurs.

Management is continually re-evaluating estimates and the expectations above could and probably will change as the year unfolds.

The following table describes the composition of revenue by product group and test services, as a percentage of total revenue:

	Year Ended December 31,
	2002		2001		2000
Substrate	50.9	%	46.0	%	55.8	%
Lead frame	33.6		40.2		35.0
Test	15.5		13.8		9.2
Total	100.0	%	100.0	%	100.0	%

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Quarterly Results (Unaudited)

The following table describes our unaudited historical quarterly sales, gross profit, earnings per share and net income:

	2002												2001
	Q4			Q3			Q2			Q1			Q4			Q3			Q2			Q1
	(in thousands, except per share amount)
Revenue	$	92,708		$	94,659		$	97,086		$	79,213		$	76,807		$	74,662		$	87,373		$	89,859
Gross profit		12,322			15,960			17,764			9,555			5,907			2,025			11,460			11,721
Gross margin		13.3	%		16.9	%		18.3	%		12.1	%		7.7	%		2.7	%		13.1	%		13.0	%
Writedown of impaired assets		—			—			—			—			34,688			—			—			—
Restructuring charge		(661	)		—			—			—			3,270			—			—			2,962
Income (loss) before extraordinary item	$	(6,983	)	$	(3,179	)	$	(4,143	)	$	(11,545	)	$	(60,115	)	$	(16,441	)	$	(7,513	)	$	(9,667	)
Extraordinary item		—			—			(3,005	)		—			—			—			—			—
Net income (loss)	$	(6,983	)	$	(3,179	)	$	(7,148	)	$	(11,545	)	$	(60,115	)	$	(16,441	)	$	(7,513	)	$	(9,667	)
Income (loss) per share available to common stockholders before extraordinary item
Basic	$	(0.07	)	$	(0.03	)	$	(0.05	)	$	(0.15	)	$	(0.87	)	$	(0.24	)	$	(0.11	)	$	(0.14	)
Diluted		(0.07	)		(0.03	)		(0.05	)		(0.15	)		(0.87	)		(0.24	)		(0.11	)		(0.14	)
Extraordinary item per share available to common stockholders
Basic	$	—		$	—		$	(0.03	)	$	—		$	—		$	—		$	—		$	—
Diluted		—			—			(0.03	)		—			—			—			—			—

Results of Operations

The following table describes our results of operations based on the percentage relationship of operating and other financial data to revenue during the periods shown:

	Year Ended December 31,
	2002		2001		2000
Historical Statement of Operations Data:
Revenue	100.0	%	100.0	%	100.0	%
Gross margin	15.3		9.5		22.1
Selling, general & administrative	10.5		9.5		7.0
Research & development	2.8		4.3		2.4
Restructuring/other expenses	(0.2	)	12.4		—
Operating income	2.2	%	(16.8	)%	12.6	%

Year Ended December 31, 2002 Compared to Year Ended December 31, 2001

Revenue. Revenue was $363.7 million in the year ended December 31, 2002, an increase of 10.6% from the year ended December 31, 2001. The increase in revenue is primarily due to growth in our substrate and test product lines and the combination of higher end-market demand for our customers’ products and new customer and program wins in the year 2002 as compared to 2001. Unit volumes in 2002 also increased 10.2% versus the year 2001.

        Gross Profit. Gross profit during the year ended December 31, 2002 was $55.6 million, an increase of 78.8% from the year ended December 31, 2001. Gross margin as a percent of revenue was 15.3% for the year 2002 versus 9.5% for the year 2001. The actions taken by us, including reductions in work force and tight cost controls coupled with increased unit volume and higher equipment utilization, contributed to the increased gross profit realized for the year ended December 31, 2002. These results were reduced by the effect of higher gold prices and the appreciation of the South Korean Won against the United States Dollar when compared to the year ended December 31, 2001.

        Selling, General, and Administrative. Selling, general, and administrative expenses were $38.2 million in the year ended December 31, 2002, an increase of 22.4% from the year ended December 31, 2001. The increase in expenses was primarily due to implementation of strict cost reductions taken in 2001 in reaction to the decline in revenue. The cost controls in 2001 included mandatory shut-down days, salary reductions, travel restrictions, and deferment of expenditures where the timing could be delayed. In addition, we incurred additional expenses for our various employee incentive programs as a result of our improved results during the year ended December 31, 2002 as compared to the year ended December 31, 2001.

16

Research and Development. Research and development expenses for the year ended December 31, 2002 were $10.1 million, or 2.8% of revenue, compared to $14.2 million, or 4.3% of revenue, in the year ended December 31, 2001. Our research and development expenses in 2002 represent a 28.9% decrease from similar expenses in 2001. Although we increased the number of research and development employees and internal resources in the year 2002 compared to the year 2001, we were engaged in a significant project that required external spending during 2001. A comparable level of external spending was not required during 2002.

Restructuring and Other Charges. In the first and fourth quarter of 2001, we approved restructuring plans to realign our organization and reduce operating costs. These actions were designed to better align our existing workforce and to reduce operating expenses. These plans were a combination of reductions in work force and employee furloughs. Accordingly, our restructuring plans included reduction of associated employee positions by approximately 554 and 197 worldwide in connection with the first and fourth quarter plans, respectively. Restructuring and related charges of $3.0 million and $3.3 million were expensed during the first and fourth quarter of 2001, respectively. The entire first quarter charge of $3.0 million was related to employee separations and furloughs. The fourth quarter charge was comprised of $1.8 million related to employee separations and $1.5 million of other charges for the forgiveness of loans to executive officers. During the year ended December 31, 2002, we utilized $0.3 million of the restructuring accrual and completed another 92 of the planned 751 employee separations. We also utilized the $1.5 million of loan reserves. Cumulatively, we have completed 646 of the planned 751 employee separations. Due to stronger than expected performance from our Korean subsidiary and the sale of our plating line in Korea which we had planned on shutting down, reserve releases in the amount of $1.3 million were credited to restructuring charges in our statement of operations for December 31, 2002. We plan no further terminations or other restructuring activities related to our planned 2002 actions reserved in 2001. This credit was reduced by a restructuring action in our Malaysian plant in which $0.6 million was incurred to terminate 30 employees. This action was not included in the 2001 reserves.

In addition, we wrote down impaired assets by $34.7 million in the fourth quarter of 2001. There were no comparable write offs in the year ended December 31, 2002.

Interest Expense. Total outstanding interest bearing debt decreased to $267.9 million at December 31, 2002 compared to $383.6 million at December 31, 2001. The decrease in debt outstanding of $115.7 million from December 31, 2001 to December 31, 2002 was due to the $82.4 million pay down of our term loans and the $50.0 million paydown of our revolving line of credit, offset by an increase in foreign loans of $16.7 million. The decrease in debt was funded by our January 2002 and May 2002 public offerings of our common stock. Related interest expense was $32.0 million for the year ended December 31, 2002, a decrease of 14.0% compared to the year ended December 31, 2001. The reduction in interest expense was primarily due to the combination of reduced interest rates along with the reduction in debt outstanding.

Foreign Currency Losses. We had net foreign currency losses of $1.0 million in the year ended December 31, 2002 compared to a net foreign currency gain of $0.2 million in the year ended December 31, 2001. These non-cash losses are primarily due to the fluctuations between the exchange rate of the United States Dollar and the South Korean Won related to long-term pension benefits payable to our South Korean employees.

Income Taxes. Global income tax expense was $2.0 million and $2.6 million for the years ended December 31, 2002 and 2001, respectively, for effective tax rates of approximately (7.4%) in 2002 and (2.8%) in 2001. In the fourth quarter of 2001, we recorded a valuation reserve that reversed previously recorded benefits in 2001 and previous years. We have a mix of tax rates across the various jurisdictions in which we do business. The tax provision for 2002 does not take into account any future benefit from loss carryforwards, which we may realize once we again achieve profitability.

Extraordinary Item. A portion of the proceeds from our May 2002 public offering was used to extinguish term loan A and our capital expenditure loan and substantially pay down term loan B under our senior credit facilities. As a result, capitalized debt issuance costs of $3.0 million were written off and the charge was included in the results for the three and six month periods ended June 30, 2002 with no comparable results for the same periods in 2001. There is no tax benefit since the costs were written off in a tax jurisdiction that provides no benefit.

Net Loss Available to Common Stockholders. As a result of the items above, the net loss available to common stockholders decreased to $28.9 million loss for the year ended December 31, 2002, compared to a net loss of $93.7 million for the year ended December 31, 2001.

Year Ended December 31, 2001 Compared to Year Ended December 31, 2000

Revenue. Revenue was $328.7 million in the year ended December 31, 2001, a decrease of 33.5% from the year ended December 31, 2000. The decline in revenue was a result of lower end-market demand for our customers’ products. This decrease was realized across all the end markets we serve and was not significantly concentrated in any one end market. We believe that our customers purchased product for their inventory in amounts consistent with historical demand. Thus, as end-user demand dropped, our customers’ inventories increased, thereby decreasing demand for our products.

17

Gross Profit. Gross profit during the year ended December 31, 2001 was $31.1 million, a decrease of 71.5% from the year ended December 31, 2000. The majority of the decrease was caused by lower demand leading to lower equipment utilization as well as lower average selling prices in the year ended December 31, 2001 compared to the year ended December 31, 2000. Equipment utilization was 52.0% and 57.0% for the years ended December 31, 2001 and 2000, respectively. Although reductions in force, furloughs, plant shutdown days and other cost saving methods were used in the year ended December 31, 2001, they were insufficient to offset the decline in revenue.

Selling, General, and Administrative. Selling, general, and administrative expenses were $31.2 million in the year ended December 31, 2001, a decrease of 10.3% from the year ended December 31, 2000. Expenses declined compared to 2000, because we implemented strict cost controls in reaction to the decline in revenue and because of the reductions in force we implemented in the first quarter of 2001. In addition, we incurred staffing expenses in the second half of 2000 related to our initial public offering that did not occur in 2001.

Research and Development Expense. Research and development expenses for the year ended December 31, 2001 were $14.2 million, or 4.3% of revenue, compared to $12.0 million, or 2.4% of revenue, in the year ended December 31, 2000. Our research and development expenses in 2001 represent an 18.3% increase from similar expenses in 2000. The increases were mainly due to expenses related to power packaging technology, new processes development and flip-chip technology development.

Restructuring and Other Charges. Restructuring, write down of impaired assets and other charges. During the year ended December 31, 2001, we wrote down impaired assets by $34.7 million. The asset write down relates primarily to our manufacturing assets in the assembly and test facilities in South Korea and Malaysia. The Company determined that due to excess capacity the future expected cash flows related to equipment for certain niche package types will not be sufficient to recover the carrying value of the manufacturing equipment for those package types in the facility. The carrying values of these assets were written down to the estimated fair market value and will continue to be depreciated over the remaining useful lives. There were no equivalent write offs in the year ended December 31, 2000.

In addition, we recorded expenses associated with reduction in force and furlough costs of $4.7 million and a loss reserve of $1.5 million on executive officers loans forgiveness in 2002, that occurred in the year ended December 31, 2001 with no comparable costs in 2000.

Interest Expense. Total outstanding interest bearing debt increased to $383.6 million at December 31, 2001 compared to $298.0 million at December 31, 2000. The increase in debt was primarily due to draw down of our revolving credit line for general corporate purposes and issuance of $50.0 million of convertible debt and $15.0 million of additional high yield borrowings in June 2001. Related interest expense was $37.2 million for the year ended December 31, 2001, a decrease of 5.6% compared to the year ended December 31, 2000. The reduction in interest expense was primarily due to reduced interest rates on our debt.

Foreign Currency Gains. Net foreign currency gains were $0.2 million and $2.2 million for the years ended December 31, 2001 and 2000, respectively. These non-cash gains are primarily due to the fluctuations between the exchange rate of the United States Dollar and the South Korean Won related to long-term pension benefits payable to our South Korean employees.

Other (Income) and Expenses. Other (income) and expenses, net, was ($0.4) million and $7.9 million for the years ended December 31, 2001 and 2000, respectively. Other expenses for December 31, 2000 includes the one-time payment of $8.0 million, paid to Bain Capital and SXI Group in exchange for the termination of two advisory agreements, which were entered into during our recapitalization in 1999. There were no equivalent expenditures related to this one-time payment in the year ended December 31, 2001.

Accretion of Dividends and Recorded Value of the Intel Warrant. Accretion of dividends on preferred stock and the recorded value of the Intel Warrant was $0 in the year ended December 31, 2001, compared to $9.2 million in the year ended December 31, 2000. All preferred stock was redeemed or converted to non-dividend bearing Class A common stock concurrent with our initial public offering in August 2000. The Intel Warrant expired unexercised in February 2001.

Income Taxes. Income tax expense was $2.6 million and $3.6 million for the years ended December 31, 2001 and 2000, respectively, for an effective tax rates of approximately (2.8%) in 2001 and 20.0% in 2000. Concurrently with our recapitalization on August 5, 1999, the company was reorganized and as a result now has operations and earnings in jurisdictions with relatively low income tax rates, or where we enjoy tax holidays or other similar tax benefits.

18

Net (Loss) Income Available to Common Stockholders. As a result of the items above, we incurred a net loss available to common stockholders of $93.7 million for the year ended December 31, 2001, compared to net income of $2.9 million for the year ended December 31, 2000.

CRITICAL ACCOUNTING POLICIES

We believe the following accounting policies are most important to the portrayal of our financial condition and results of operations and require our significant judgments.

We have made and expect to continue to make significant investments in fixed assets, intellectual property and related intangible assets. Management evaluates the valuation of these assets every quarter paying special attention to events or changes in circumstances that would indicate that their carrying amount might not be recoverable. We determine whether or not the assets are recoverable based on estimated undiscounted future cash flows to be generated by the assets and if not, we calculate the amount of the impairment charge based on estimated discounted future cash flows to be generated by the assets or their appraised fair value. If different assumptions or conditions were to prevail rather than those used in estimating future cash flows, significantly different determination of recoverability or of fair value for these assets and results of operations could be reported. We recorded an asset impairment charge of $34.7 million for the year ended December 31, 2001 with no comparable amount in 2002.

In addition, management uses judgment when setting expected asset useful lives for long-lived assets. The asset useful lives used are based on historical experience and future expectations. However, business conditions or underlying technology may change in the future which could cause a change in asset lives. Any change in lives would cause a significant change in depreciation and amortization. After the recapitalization (see Note 1 to the consolidated financial statements), we reassessed the asset useful lives for our long-lived assets in 2000 and changed the useful lives from five years to eight years. This change resulted in depreciation expense for the year ended December 31, 2000 being $29.0 million lower than would have been recorded using five-year lives.

We record estimated reductions to revenue for customer programs and incentive offerings including special pricing agreements, price protection, promotions and other volume-based incentives. If market conditions were to decline, we may take actions to increase customer incentive offerings possibly resulting in an incremental reduction of revenue at the time the incentive is offered. Furthermore, if anticipated volume levels turn out to be different, this would impact reductions to revenue and accrued customer rebates.

We maintain allowances for doubtful accounts for estimated losses resulting from the inability of our customers to make required payments. If the financial condition of our customers were to deteriorate, resulting in an impairment of their ability to make payments, additional allowances may be required.

In the year ended December 31, 2002, we have maintained the valuation allowance to reflect the likelihood of utilization of certain deferred tax assets. While we have considered future taxable income and ongoing prudent and feasible tax planning strategies in assessing the need for the valuation allowance, in the event we were to determine that we would be able to realize deferred tax assets in the future in excess of the net recorded amount, an adjustment to the deferred tax asset would increase income in the period such determination was made. Likewise, should we determine that we would not be able to realize all or part of our net deferred tax asset in the future, an adjustment to the deferred tax asset would be charged to income in the period such determination was made.

19

Liquidity and Capital Resources

Our ongoing primary cash needs are for operations and equipment purchases. We spent $78.9 million on capital expenditures during the year ended December 31, 2002 compared to $46.4 million in capital expenditures during the year ended December 31, 2001. We anticipate spending $80.0 million in capital expenditures in 2003.

Under the terms of the agreement relating to our acquisition of the Malaysian business, during the period from June 1, 2000 to June 30, 2003, Intersil is entitled to receive additional contingent incentive payments based upon the achievement of milestones relating to the transfer of business previously subcontracted by Intersil to a third party. In the event that Intersil was to achieve all the milestones, we would pay Intersil an additional sum of approximately $17.9 million in the aggregate. As of December 31, 2002, we have cumulatively paid Intersil $14.5 million under this arrangement.

On January 30, 2002, we sold 10,000,000 shares of Class A common stock in an underwritten public offering for $6.00 per share. On February 14, 2002, we sold an additional 1,425,600 shares of Class A common stock in conjunction with the underwriters’ exercise of their over-allotment option for $6.00 per share. In connection with these sales, we received net proceeds of approximately $63.8 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $62.4 million from this offering were used to pay down term loans and revolving loans. The remaining $1.3 million was used for general corporate purposes.

On May 30, 2002, we sold 12,000,000 shares of Class A common stock in an underwritten public offering for $8.75 per share. In connection with these sales, we received net proceeds of approximately $99.2 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $50.0 million from this offering were used to pay down term loans and revolving loans. The remaining $49.2 million was used for general corporate purposes.

Our total potential commitments on our loans, operating leases, Intersil incentive payments, royalty and license agreements as of December 31, 2002, were as follows: (in thousands)

	Total		Within 1 Year		1 - 3 Years		3 - 5 Years		After 5 Years
On balance sheet commitments:
Senior credit facilities and other long-term debt	$	52,887	$	—	$	16,700	$	36,187	$	—
Senior subordinated notes		165,000		—		—		—		165,000
Convertible subordinated notes		50,000		—		—		—		50,000
Total on balance sheet commitments		267,887		—		16,700		36,187		215,000
Off balance sheet commitments:
Operating leases		51,257		7,061		10,385		10,334		23,477
Royalty/licensing agreements		1,737		588		803		346		—
Contingent payments to Intersil (relating to purchase of Malaysian business)		3,475		3,475		—		—		—
Total off balance sheet commitments		56,469		11,124		11,188		10,680		23,477
Total commitments	$	324,356	$	11,124	$	27,888	$	46,867	$	238,477

20

Our senior credit facilities, as amended, contain covenants restricting our operations and requiring that we meet specified financial tests. Our financial tests for 2002 were as follows: (1) a requirement to raise at least $20.0 million in junior capital by March 1, 2002, which was fulfilled by us through an underwritten public offering of our Class A common stock in January 2002 and (2) a minimum EBITDA (Earnings Before Interest, Taxes, Depreciation and Amortization which is a Non-GAAP term defined in our lending agreement) requirement based on a rolling 12 months ending June 30, 2002 and September 30, 2002, of $31.0 million and $37.0 million, respectively, with no requirement for December 31, 2002. Our actual 12 months EBITDA for the period ended September 30, 2002 significantly exceeded the requirement. Beginning with the quarter ended December 31, 2002, the financial covenants will consist solely of a minimum interest coverage ratio and a maximum senior leverage ratio based on a rolling 12 months calculation. There were no violations of the covenants under our senior credit facilities, as amended, through December 31, 2002.

During the quarter ended June 30, 2002, an assessment of approximately 16.0 billion Korean Won (approximately $13.3 million U.S. Dollars at December 31, 2002), was made by the Korean National Tax Administration, or NTA, relating to withholding tax not collected on the loan between our subsidiaries in Korea and Hungary. Withholding on the transactions in question is not required by the prevailing tax treaty. There were no further assessments made during the quarter ended December 31, 2002. We have appealed the assessment through the NTA’s Mutual Agreement Procedure and believe that the assessment will be overturned. As of December 31, 2002, no accrual has been made. On July 18, 2002, the Icheon tax office of the NTA approved a tax suspension of the proposed assessment until resolution of the disputed assessment. The NTA required a corporate guarantee of 120% of the assessment in exchange for the suspension. We complied with the guarantee request on August 1, 2002. No further assessments have been made.

We believe that our existing cash balances, cash flows from operations and the available borrowings under our senior credit facilities of $50.0 million will provide sufficient cash resources to meet our projected operating and other cash requirements for the next twelve months. An event of default under any debt instrument, if not cured or waived, could have a material adverse effect on us. We may require capital sooner than currently expected. We cannot assure you that additional financing will be available when we need it or, if available, that it will be available on satisfactory terms. In addition, the terms of our senior credit facilities and senior subordinated notes significantly reduce our ability to incur additional debt. Failure to obtain any such required additional financing could have a material adverse effect on our company.

Other than the covenants on the debt as discussed above, we have no performance guarantees or unconsolidated entities. Our off-balance sheet commitments are limited to equipment operating leases, royalty/license agreements, leases on office and manufacturing space and additional contingent incentive payments to Intersil. Our total off-balance sheet obligations are approximately $56.5 million.

In 2002, 2001, and 2000 cash provided by (used in) operations was $39.5 million, ($3.9) million, and $46.2 million, respectively. Cash from operations mainly consisted of net income (loss) plus depreciation and amortization as well as the write down of impaired assets in 2001 less utilization for working capital.

In 2002, 2001, and 2000 cash used in investing activities was $98.4 million, $59.0 million, and $130.5 million, respectively. In 2002, cash used in investing activities related mainly to net short-term investments of $10.0 million and property and equipment of $78.9 million. In 2001, cash used in investing activities mainly was invested in property and equipment. In 2000, in addition to the acquisition of property and equipment, cash was invested in the purchase of the Malaysian business, including purchased intellectual property.

In 2002, 2001, and 2000, cash provided by financing activities was $51.2 million, $85.9 million, and $71.0 million, respectively. Cash was mainly provided by or used in debt issuance, debt repayment, stock issuance, and stock redemption.

21

Recent Accounting Pronouncements

In June 2001, the Financial Accounting Standards Board, or FASB, issued Statement of Financial Accounting Standards No. 143, “Accounting for Asset Retirement Obligations.” SFAS No. 143 requires that the fair value of a liability for an asset retirement obligation be realized in the period in which it is incurred if a reasonable estimate of fair value can be made. Companies are required to adopt SFAS No. 143 for fiscal years beginning after June 15, 2002, but early adoption is encouraged. We have determined that this standard will not have a material impact on our financial position and results of operations.

In May 2002, the FASB issued SFAS No. 145, “Rescission of SFAS Nos. 4, 44, and 64, Amendment of SFAS No. 13, and Technical Corrections.” Among other things, SFAS No. 145 rescinds various pronouncements regarding early extinguishment of debt and allows extraordinary accounting treatment for early extinguishment only when the provisions of Accounting Principles Board Opinion No. 30, “Reporting the Results of Operations—Reporting the Effects of Disposal of a Segment of a Business and Extraordinary, Unusual and Infrequently Occurring Events and Transactions” are met. SFAS No. 145 provisions regarding early extinguishment of debt are generally effective for fiscal years beginning after May 15, 2002. Upon adoption of SFAS No. 145, we have to reclassify any gain or loss on extinguishment of debt that was classified as an extraordinary item in prior periods presented that does not meet the criteria in APB Opinion No. 30 for classification as an extraordinary item and show it within income from continuing operations.

In June 2002, the FASB issued SFAS No. 146, “Accounting for Exit or Disposal Activities.” SFAS No. 146 addresses significant issues regarding the recognition, measurement, and reporting of costs that are associated with exit and disposal activities, including restructuring activities that are currently accounted for under EITF No. 94-3, “Liability Recognition for Certain Employee Termination Benefits and Other Costs to Exit an Activity (Including Certain Costs Incurred in a Restructuring).” The scope of SFAS No. 146 also includes costs related to terminating a contract that is not a capital lease and termination benefits that employees who are involuntarily terminated receive under the terms of a one-time benefit arrangement that is not an ongoing benefit arrangement or an individual deferred-compensation contract. SFAS No. 146 will be effective for exit or disposal activities that are initiated after December 31, 2002 and early application is encouraged. We will adopt SFAS No. 146 during the first quarter of fiscal year 2003. The provisions of EITF No. 94-3 shall continue to apply for an exit activity initiated under an exit plan that met the criteria of EITF No. 94-3 prior to the adoption of SFAS No. 146. The effect on adoption of SFAS No. 146 will change on a prospective basis the timing of when restructuring charges are recorded from a commitment date approach to when the liability is incurred.

In November 2002, the Financial Accounting Standards Board issued FASB Interpretation No. 45, or FIN 45, “Guarantor’s Accounting and Disclosure Requirements for Guarantees, Including Indirect Guarantees of Indebtedness of Others.” FIN 45 requires that a liability be recorded in the guarantor’s balance sheet upon issuance of a guarantee. In addition, FIN 45 requires disclosures about the guarantees that an entity has issued, including a reconciliation of changes in the entity’s product warranty liabilities. The initial recognition and initial measurement provisions of FIN 45 are applicable on a prospective basis to guarantees issued or modified after December 31, 2002, irrespective of the guarantor’s fiscal year-end. The Company has met the disclosure requirements of FIN 45 and believes that the adoption of the remaining provisions of this standard will have no material impact on its financial statements.

In November 2002, the Emerging Issues Task Force, or EITF, reached a consensus on Issue No. 00-21, “Revenue Arrangements with Multiple Deliverables.” EITF Issue No. 00-21 provides guidance on how to account for arrangements that involve the delivery or performance of multiple products, services and/or rights to use assets. The provisions of EITF Issue No. 00-21 will apply to revenue arrangements entered into in fiscal periods beginning after June 15, 2003. We believe that the adoption of this standard will have no material impact on our financial statements.

In December 2002, the Financial Accounting Standards Board issued Statement of Financial Accounting Standards No. 148, “Accounting for Stock-Based Compensation, Transition and Disclosure.” SFAS No. 148 provides alternative methods of transition for a voluntary change to the fair value based method of accounting for stock-based employee compensation. SFAS No. 148 also requires that disclosures of the pro forma effect of using the fair value method of accounting for stock-based employee compensation be displayed more prominently and in a tabular format. Additionally, SFAS No. 148 requires disclosure of the pro forma effect in interim financial statements. The transition and annual disclosure requirements of SFAS No. 148 are effective for fiscal years ended after December 15, 2002. The interim disclosure requirements are effective for interim periods beginning after December 15, 2002. The Company has adopted the disclosure requirements and believes that the adoption of the remaining provisions of this standard will have no material impact on its financial statements.

22

In January 2003, the FASB issued FASB Interpretation No. 46, or FIN 46, “Consolidation of Variable Interest Entities, an Interpretation of ARB No. 51.” FIN 46 requires certain variable interest entities to be consolidated by the primary beneficiary of the entity if the equity investors in the entity do not have the characteristics of a controlling financial interest or do not have sufficient equity at risk for the entity to finance its activities without additional subordinated financial support from other parties. FIN 46 is effective immediately for all new variable interest entities created or acquired after January 31, 2003. For variable interest entities created or acquired prior to February 1, 2003, the provisions of FIN 46 must be applied for the first interim or annual period beginning after June 15, 2003. We believe that the adoption of this standard will have no material impact on our financial statements.

Acquisition of Malaysian Business

On June 30, 2000, we consummated our acquisition of Intersil’s packaging and test operations located in Kuala Lumpur, Malaysia along with related intellectual property for approximately $71.5 million in cash and preferred stock, which was converted into common stock at the time of our initial public offering. The acquisition has been accounted for using the purchase method of accounting. In connection with the acquisition, we entered into a five-year supply agreement with Intersil to provide Intersil assembly and test services on an exclusive basis.

The terms of the acquisition of the Malaysian business require us to pay until June 30, 2003 additional contingent incentive payments to Intersil based on the achievement of milestones. We have recorded these contingent payments as additional purchase price when they are earned. In the event that Intersil was to achieve all the milestones, Intersil would receive an additional sum of approximately $17.9 million in the aggregate. For the years ended December 31, 2002, 2001, and 2000, $6.6 million, $7.4 million, and $0.5 million, respectively, were paid for a cumulative total of $14.5 million. These payments increased the effective purchase price and were allocated to non-current assets. Additionally, in 2001, $2.4 million of other purchase price adjustments were recorded based on the difference between the final closing balance sheet and the estimated closing balance sheet of the Malaysian business. As of December 31, 2002, deferred tax of $4.5 million has been recorded on all of these adjustments. This resulted in a further increase in non-current assets.

There was no goodwill arising from the acquisition of the Malaysian business. The fair value of total assets and liabilities exceeded the purchase price by $56.2 million as of July 1, 2000. This amount has been allocated in full to non-current assets as summarized below:

Non-current asset	Estimated Fair Value		Initial Excess of Fair Value of Acquired Net Amounts Over Cost			Total Additional Purchase Price		Adjusted Fair Value
			(in millions)
Land and buildings	$	27.9	$	(11.1	)	$	4.0	$	20.8
Plant and equipment		93.9		(36.9	)		14.9		71.9
Intellectual property		20.9		(8.2	)		2.5		15.2
	$	142.7	$	(56.2	)	$	21.4	$	107.9

Intellectual property acquired along with the Malaysian business primarily consists of trade secrets and patents. The estimated average useful lives of these assets are between five and nine years.

An accrual of $7.4 million was established for expected costs of restructuring the Malaysian business. During the years ended December 31, 2001 and 2000, $2.5 million and $4.9 million of these non-recurring costs were paid in connection with the reorganization of the factory, product discontinuance and employee related costs. We began formulating exit plans and termination data during the due diligence relating to the acquisition of the Malaysian business. The accrual was originally comprised of $5.0 million for involuntary termination benefits and $2.4 million for other exit activities. Actual involuntary termination benefits and other exit costs amounted to $7.0 million and $0.4 million, respectively. The projected number of planned reductions in head count as a result of this planned restructuring was 380 employees, with an actual reduction of 373 employees. All restructuring activities were completed in the year ended December 31, 2001.

Intersil assigned to us patents, copyrights, and technical information used exclusively in or associated with the Malaysian business. Furthermore, Intersil granted to us a worldwide, non-exclusive, royalty-free license under other Intersil patents, copyright and technical information which is also used in or related to the operation of the Malaysian business. This license is perpetual and irrevocable. Any intellectual property rights in the bonding diagrams, test programs, maskworks and test boards uniquely related to the Intersil products for which we will provide packaging and test services under the supply agreement with Intersil are licensed to us only for use in providing those services.

23

The results of operations of the Malaysian business have been included within our results of operations for periods subsequent to June 30, 2000. Set forth below is our unaudited pro forma combined summary of operations for the year ended December 31, 2000, as if the acquisition had been made on January 1, 2000 (in thousands, except for per share amounts).

Pro Forma Disclosure

	Year Ended December 31, 2000
	(unaudited)
Net revenue	$	536,326
Income before extraordinary item		9,165
Net income		6,775
Earnings per share
Basic	$	0.10
Diluted	$	0.10
Shares used in per share calculation:
Basic		68,367
Diluted		69,553

Initial Public Offering

In July 2000, a 0.38098771 for 1 reverse stock split was made on our common stock. All share and per share information presented herein has been restated to give effect to the stock split.

On August 8, 2000, the Securities and Exchange Commission declared effective the Registration Statement on Form S-1 (Registration No. 333-39428) relating to the initial public offering of our Class A common stock. In connection with the closing of the initial public offering, we issued 10,000,000 shares of Class A Common Stock for gross proceeds of $120.0 million. The total proceeds from the offering and a concurrent private placement of stock, net of issuance costs, were $135.0 million.

On August 18, 2000, in connection with the underwriters’ exercise of their over-allotment option to purchase additional shares of our Class A common stock, an additional 1,500,000 shares of Class A common stock for gross proceeds of $18.0 million were issued by us. Total proceeds from the issuance of the additional shares, net of issuance costs, was $16.9 million.

The net proceeds, amounting to $151.8 million, were used to redeem in full our Class B mandatorily redeemable preferred stock of $79.3 million and to repay debt of $64.2 million.

In connection with the closing of the initial public offering, all outstanding shares of Class A and Class C mandatorily redeemable preferred stock were automatically converted into an aggregate of 4,349,254 shares of Class A common stock.

Secondary Public Offerings

On January 30, 2002, we sold 10,000,000 shares of Class A common stock in an underwritten public offering for $6.00 per share. On February 14, 2002, we sold an additional 1,425,600 shares of Class A common stock in conjunction with the underwriters’ exercise of their over-allotment option for $6.00 per share. In connection with these sales, we received net proceeds of approximately $63.8 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $62.4 million from this offering were used to pay down term loans and revolving loans. The remaining $1.3 million was used for general corporate purposes.

On May 30, 2002, we sold 12,000,000 shares of Class A common stock in an underwritten public offering for $8.75 per share. In connection with these sales, we received net proceeds of approximately $99.2 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $50.0 million from this offering were used to pay down term loans and revolving loans. The remaining $49.2 million was used for general corporate purposes.

24

Sources and Use of Funds From Issuances of Common Stock in 2002

	January Offering			May Offering			Totals
Source of funds:
Gross proceeds from issuance of common stock	$	68,554		$	105,000		$	173,554
Less related issuance costs		(4,768	)		(5,830	)		(10,598	)
Net proceeds from issuance of common stock	$	63,786		$	99,170		$	162,956
Use of funds:
Repayment of senior credit facilities	$	62,438		$	50,000		$	112,438
General corporate purposes		1,348			49,170			50,518
	$	63,786		$	99,170		$	162,956

In June 2002, we utilized $50.0 million of the public offering proceeds to extinguish term loan A and the capital expenditure loan and substantially pay down term loan B under the senior credit facilities. As a result, capitalized debt issuance costs of $3.0 million were written off and the expense is included in the year ended December 31, 2002 as an extraordinary item with no comparable results for the same period in 2001. There was no tax benefit for the write off because the costs were written off in a tax jurisdiction that provides no such benefit.

ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET RISK

We are exposed to financial market risks, including changes in interest rates and foreign currency exchange rates. We have no derivative financial instruments. We have long-term debt that carries fixed and variable interest rates. A fluctuation in interest rates of 1% would increase our annual interest charge by approximately $0.9 million. The exposure to foreign currency gains and losses has been significantly mitigated by the fact that we negotiated with the large majority of our material and equipment suppliers to denominate purchase transactions in U.S. Dollars.

For the years ended December 31, 2002, 2001 and 2000, we generated approximately 11.3%, 8.1%, and 16.7% of total revenue, respectively, from international markets. In addition, all of the facilities currently used to provide packaging services are located in China, Malaysia and South Korea. Moreover, many of our customers’ operations are located in countries outside of the United States of America. We cannot determine if our future operations and earnings will be affected by new laws, new regulations, a volatile political climate, armed conflicts, changes in or new interpretations of existing laws or regulations or other consequences of doing business outside the United States of America particularly in China, Malaysia and South Korea. If future operations are negatively affected by these changes, sales or profits may suffer.

Investment and Interest Risk

Our exposure to market risk for changes in interest rates relates primarily to our investment portfolio and short-term debt obligations. We do not use derivative financial instruments in our investment portfolio. We place our investments with high credit quality issuers and, by policy, limit the amount of credit exposure to any one issuer.

We mitigate default risk by investing in only the safest and highest credit quality securities and by monitoring the credit rating of investment issuers. Our portfolio includes only marketable securities with active secondary or resale markets to ensure portfolio liquidity. We have no material cash flow exposure due to rate changes for cash equivalents and short-term investments.

Our results are only affected by the interest rate changes to variable rate short-term borrowings. Due to the short-term nature of these borrowings, an immediate change to interest rates is not expected to have a material effect on our results. Our long-term bonds bear a fixed interest rate and the interest does not fluctuate with changes in short-term or long-term rates.

25

Foreign Currency Risk

Based on our overall currency rate exposure at December 31, 2002, a near term 10% appreciation or depreciation in the value of the U.S. dollar would have an insignificant effect on our financial position, results of operations and cash flows over the next fiscal year. There can be no assurance, however, that there will not be a material impact further in the future.

A portion of our costs is denominated in foreign currencies like the Chinese Renminbi, the Malaysian Ringgit and the South Korean Won. As a result, changes in the exchange rates of these currencies or any other applicable currencies to the U.S. dollar will affect the cost of goods sold and operating margins and could result in exchange losses. We cannot fully predict the impact of future exchange rate fluctuations on our profitability. From time to time, we may have engaged in, and may continue to engage in, exchange rate hedging activities in an effort to mitigate the impact of exchange rate fluctuations. However, we cannot assure that any hedging technique we implement will be effective. If it is not effective, we may experience reduced operating margins.

26

ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA

Report of Independent Accountants	28
Consolidated Balance Sheets—December 31, 2002 and 2001	29
Consolidated Statements of Operations for each of the three years in the period ended December 31, 2002	30
Consolidated Statements of Stockholders’ Equity for each of the three years in the period ended December 31, 2002	31
Consolidated Statements of Cash Flows for each of the three years in the period ended December 31, 2002	32
Notes to Consolidated Financial Statements	34
Financial Statement Schedule:

Schedule II—Valuation and Qualifying Accounts for each of the three years in the period ended December 31, 2002

27

Report of Independent Accountants

To the Stockholders and Board of Directors of ChipPAC, Inc.:

In our opinion, the accompanying consolidated balance sheets and the related consolidated statements of operations, of stockholders’ equity and of cash flows, present fairly, in all material respects, the financial position of ChipPAC, Inc. and its subsidiaries at December 31, 2002 and 2001, and the results of their operations and their cash flows for each of the three years in the period ended December 31, 2002, in conformity with accounting principles generally accepted in the United States of America. These financial statements are the responsibility of the Company’s management; our responsibility is to express an opinion on these financial statements based on our audits. We conducted our audits of these statements in accordance with auditing standards generally accepted in the United States of America, which require that we plan and perform the audit to obtain reasonable assurance about whether the financial statements are free of material misstatement. An audit includes examining, on a test basis, evidence supporting the amounts and disclosures in the financial statements, assessing the accounting principles used and significant estimates made by management, and evaluating the overall financial statement presentation. We believe that our audits provide a reasonable basis for our opinion.

/s/ PricewaterhouseCoopers LLP

San Jose, California

January 28, 2003

28

ChipPAC, Inc.

CONSOLIDATED BALANCE SHEETS

(In thousands, except per share amount)

	December 31, 2002			December 31, 2001
Assets:
Current assets:
Cash and cash equivalents	$	34,173		$	41,872
Short-term investments		10,000			—
Accounts receivable, less allowance for doubtful accounts of $391 and $449		38,793			32,034
Inventories (Note 6)		15,299			12,481
Prepaid expenses and other current assets		5,285			4,515
Total current assets		103,550			90,902
Property, plant and equipment, net (Note 6)		336,397			304,650
Other assets (Note 6)		30,257			35,163
Total assets	$	470,204		$	430,715
Liabilities and stockholders’ equity (deficit)
Current liabilities:
Revolving loans	$	—		$	50,000
Accounts payable		39,755			31,045
Accrued expenses and other current liabilities (Note 6)		29,400			27,838
Current portion of long-term debt		—			—
Total current liabilities		69,155			108,883
Long-term debt, less current portion		217,887			283,627
Convertible subordinated notes		50,000			50,000
Other long-term liabilities		17,618			11,431
Total liabilities		354,660			453,941
Commitments and contingencies (Note 13 and 18)
Stockholders’ equity (deficit):
Common stock, Class A—par value $0.01 per share; 250,000 shares authorized, 94,093 and 69,404 shares issued and outstanding at December 31, 2002 and 2001		941			694
Common stock, Class B—par value $0.01 per share; 250,000 shares, no shares issued or outstanding at December 31, 2002 and 2001		—			—
Additional paid-in capital		276,916			110,043
Receivable from stockholders		(480	)		(985	)
Accumulated other comprehensive income		9,169			9,169
Accumulated deficit		(171,002	)		(142,147	)
Total stockholders’ equity (deficit)		115,544			(23,226	)
Total liabilities and stockholders’ equity (deficit)	$	470,204		$	430,715

The accompanying notes are an integral part of these financial statements.

29

ChipPAC, Inc.

CONSOLIDATED STATEMENTS OF OPERATIONS

(In thousands, except per share amount)

	For the Years Ended December 31,
	2002			2001			2000
Revenue	$	363,666		$	328,701		$	494,411
Cost of revenue		308,065			297,588			385,267
Gross profit		55,601			31,113			109,144
Operating expenses:
Selling, general and administrative		38,159			31,199			34,799
Research and development		10,110			14,223			12,015
Restructuring, write down of impaired assets and other charges		(661	)		40,920			—
Total operating expenses		47,608			86,342			46,814
Operating income (loss)		7,993			(55,229	)		62,330
Non-operating (income) expenses:
Interest expense		31,986			37,214			39,432
Interest income		(626	)		(688	)		(843	)
Foreign currency loss (gains)		1,029			(187	)		(2,168	)
Other (income) expenses, net		(546	)		(410	)		7,849
Total non-operating (income) expenses		31,843			35,929			44,270
Income (loss) before income taxes and extraordinary item		(23,850	)		(91,158	)		18,060
Provision for income taxes		2,000			2,578			3,614
Income (loss) before extraordinary item		(25,850	)		(93,736	)		14,446
Extraordinary item:
Loss from early extinguishment of debt, net of related income tax benefit		3,005			—			2,390
Net income (loss)		(28,855	)		(93,736	)		12,056
Accretion of dividends on mandatorily redeemable preferred stock		—			—			(8,197	)
Accretion of recorded value of the Intel warrant		—			—			(990	)
Net income (loss) available to common stockholders	$	(28,855	)	$	(93,736	)	$	2,869
Income (loss) per share available to common stockholders before extraordinary item
Basic	$	(0.30	)	$	(1.36	)	$	0.09
Diluted	$	(0.30	)	$	(1.36	)	$	0.09
Extraordinary item
Basic	$	(0.03	)	$	—		$	(0.04	)
Diluted	$	(0.03	)	$	—		$	(0.04	)
Net income (loss) per share available to common stockholders
Basic	$	(0.33	)	$	(1.36	)	$	0.05
Diluted	$	(0.33	)	$	(1.36	)	$	0.05
Shares used in per share calculation:
Basic		87,430			68,878			57,067
Diluted		87,430			68,878			58,253

The accompanying notes are an integral part of these financial statements.

30

ChipPAC, Inc.

CONSOLIDATED STATEMENTS OF STOCKHOLDERS’ EQUITY

(In thousands)

	Common Stock					Warrants Class A Common Stock			Additional Paid in Capital			Receivable from Stockholders			Accumulated other Comprehensive Income		Accumulated Deficit			Total
	Number of Shares		Amount
Balance as of December 31, 1999	40,655		$	407		$	1,250		$	(81,304	)	$	(1,128	)	$	9,169	$	(51,280	)	$	(122,886	)
Repayment of amount due from stockholders													185								185
Sale of common stock	510			5			—			1,181			(562	)		—		—			624
Common stock repurchased by Company during the year	(61	)		(1	)		—			(39	)		—			—		—			(40	)
Conversion of preferred stock to common stock	4,349			43			—			28,588			—			—		—			28,631
Exercise of stock options	45			1			—			20			—			—		—			21
Accretion of recorded value of Intel warrant	—			—			—			—			—			—		(990	)		(990	)
Dividend accretion of mandatorily redeemable preferred stock	—			—			—			—			—			—		(8,197	)		(8,197	)
Issuance of common stock to Class L stockholders	8,880			89			—			(89	)		—			—		—			—
Stock issued in connection with termination of management advisory agreement	367			4			—			4,396			—			—		—			4,400
Stock issued at IPO, net of issuance cost of $11,108	13,693			137			—			151,756			—			—		—			151,893
Net income	—			—			—			—			—			—		12,056			12,056
Balance as of December 31, 2000	68,438			685			1,250			104,509			(1,505	)		9,169		(48,411	)		65,697
Repayment of amount due from stockholders	—			—			—			—			520			—		—			520
Expiration of Intel Warrant	—			—			(1,250	)		1,250			—			—		—			—
Employee stock purchases	922			9			—			4,117			—			—		—			4,126
Common stock repurchased by Company during the year	(63	)		(1	)		—			(18	)		—			—		—			(19	)
Exercise of stock options	107			1			—			185			—			—		—			186
Net loss	—			—			—			—			—			—		(93,736	)		(93,736	)
Balance as of December 31, 2001	69,404			694			—			110,043			(985	)		9,169		(142,147	)		(23,226	)
Repayment of amount due from stockholders	—			—			—			—			505			—		—			505
Employee stock purchases	1,092			11			—			3,324			—			—		—			3,335
Common stock repurchased by Company during the year	(71	)		(1	)		—			(23	)		—			—		—			(24	)
Exercise of stock options	242			3			—			850			—			—		—			853
Stock issued at public offerings, net of issuance cost of $10,598	23,426			234			—			162,722			—			—		—			162,956
Net loss	—			—			—			—			—			—		(28,855	)		(28,855	)
Balance as of December 31, 2002	94,093		$	941		$	—		$	276,916		$	(480	)	$	9,169	$	(171,002	)	$	115,544

The accompanying notes are an integral part of these financial statements.

31

ChipPAC, Inc.

CONSOLIDATED STATEMENTS OF CASH FLOWS

(In thousands)

	For the Years Ended December 31,
	2002			2001			2000
Cash flows from operating activities:
Net income (loss)	$	(28,855	)	$	(93,736	)	$	12,056
Adjustments to reconcile net income (loss) to net cash provided by (used in) operating activities:
Depreciation and amortization		58,949			59,909			45,049
Debt issuance cost amortization		2,281			2,112			1,950
Deferred tax		(121	)		1,636			2,029
Write down of impaired assets		—			34,688			—
Extraordinary loss on early debt extinguishment		3,005			—			2,390
Non-cash termination fees		—			—			4,400
Foreign currency (gain) loss		1,029			(187	)		(2,168	)
Gain on sale of equipment		(50	)		(1	)		(93	)
Changes in assets and liabilities:
Accounts receivable		(6,759	)		13,870			(3,519	)
Inventories		(2,818	)		8,769			(155	)
Prepaid expenses and other current assets		(770	)		2,205			(4,334	)
Other assets		(415	)		2,866			(14,048	)
Accounts payable		8,710			(23,618	)		(2,499	)
Accrued expenses and other current liabilities		1,562			(11,919	)		1,859
Other long-term liabilities		3,798			(510	)		3,297
Net cash provided by (used in) operating activities		39,546			(3,916	)		46,214
Cash flows from investing activities:
Purchase of short-term investments		(39,699	)		—			—
Proceeds from sale of short-term investments		29,699			—			—
Acquisition of intangible assets		(3,362	)		(6,156	)		—
Acquisition of property and equipment		(78,910	)		(46,392	)		(93,174	)
Proceeds from sale of equipment		488			965			17,549
Malaysian acquisition, net of cash and cash equivalents acquired		(6,643	)		(7,399	)		(54,835	)
Net cash used in investing activities		(98,427	)		(58,982	)		(130,460	)
Cash flows from financing activities:
Advances to affiliates		—			—			(434	)
Proceeds from revolving loans		105,596			84,633			45,600
Repayment of revolving loans		(155,596	)		(49,234	)		(37,800	)
Net proceeds from long term debt		16,700			79,085			63,660
Increase in debt issuance costs		(703	)		(4,520	)		—
Repayment of long-term debt		(82,440	)		(28,857	)		(73,460	)
Repayment of notes from stockholders		505			520			185
Proceeds from common stock issuances		167,144			4,312			152,578
Repurchase of common stock		(24	)		(19	)		(40	)

The accompanying notes are an integral part of these financial statements.

32

CONSOLIDATED STATEMENTS OF CASH FLOWS—(Continued)

	For the Years Ended December 31,
	2002			2001		2000
Redemption of Class B preferred stock		—			—		(79,310	)
Net cash provided by financing activities		51,182			85,920		70,979
Net increase (decrease) in cash and cash equivalents		(7,699	)		23,022		(13,267	)
Cash and cash equivalents at beginning of year		41,872			18,850		32,117
Cash and cash equivalents at end of year	$	34,173		$	41,872	$	18,850
Supplemental disclosure of noncash investing and financing activities
Dividend declared and accreted	$	—		$	—	$	(8,197	)
Accretion of recorded value of Intel warrant	$	—		$	—	$	(990	)
Sale of common stock for stockholder notes	$	—		$	—	$	562
Supplemental disclosure of cash flow information
Income taxes paid in cash	$	988		$	666	$	4,011
Interest paid in cash	$	31,504		$	33,659	$	36,865

The accompanying notes are an integral part of these financial statements.

33

ChipPAC, Inc.

Notes to Consolidated Financial Statements

Note 1: Business, Recapitalization and Merger

Business and Organization

ChipPAC, Inc. and its subsidiaries (the “Company” or “ChipPAC”) provide packaging and testing services to the semiconductor industry, with service offerings in communications, computing, consumer, automotive, industrial and multi-applications end markets. The Company packages and tests integrated circuits from wafers provided by its customers. The Company markets its services worldwide, with emphasis on the North American market, based on the headquarters of the Company’s customers. The Company’s packaging and testing operations are located in the Republic of Korea (“South Korea” or “Korea”), the People’s Republic of China (“China”) and Malaysia.

Recapitalization and Merger

Prior to August 5, 1999, the Company represented the combination of four business units of Hyundai Electronics Industries Co., Ltd. (currently Hynix Semiconductor, Inc.) (“HEI”) which operated collectively as HEI’s worldwide packaging and testing operations.

On August 5, 1999, affiliates of Bain Capital, Inc. and SXI Group LLC, a portfolio concern of Citicorp Venture Capital, Ltd., which we refer to collectively as the “Equity Investors,” and management acquired a controlling interest in the Company from HEI and Hyundai Electronics America (“HEA”) through a series of transactions, including a merger into ChipPAC, Inc. of a special purpose corporation organized by the Equity Investors. The merger was structured to be accounted for as a recapitalization.

Note 2: Summary of Significant Accounting Policies

Basis of Presentation

The financial statements for the years ended December 31, 2002, 2001 and 2000, have been prepared on a consolidated basis. The consolidated financial statements include the accounts of ChipPAC, Inc. and its majority controlled and owned subsidiaries. All significant intercompany balances and transactions have been eliminated on consolidation. Certain prior period balances have been reclassified to conform to the current period presentation.

Accounting Estimates

The preparation of financial statements in conformity with accounting principles generally accepted in the United States of America requires management to make estimates and assumptions that affect the reported amounts of assets and liabilities and revenue and expenses in the financial statements and accompanying notes. Significant estimates made by management include: the useful lives of property, plant and equipment and intangible assets as well as future cash flows to be generated by those assets; revenue reductions relating to customer programs and incentive offerings; allowances for doubtful accounts, customer returns, and deferred tax assets; inventory realizability and contingent liabilities, among others. Actual results could differ from the estimates, and such differences may be material to the consolidated financial statements.

Cash and Cash Equivalents

The Company considers all highly liquid investments purchased with an original maturity of three months or less to be cash equivalents. Cash and cash equivalents consisted of cash and money market funds at December 31, 2002 and 2001.

Short-term Investments

The Company invests excess cash in auction rate corporate notes which are high-quality and easily marketable instruments to ensure cash is readily available for use in current operations. These instruments have maturity terms of generally 30 days or less. Short-term investments are categorized as available for sale and recorded at market. Due to the short-term nature of these investments, cost approximates market value. The average interest rates on the cash and cash equivalents and short-term investments were 1.4% and 2.1%, respectively.

Financial Instruments

The amounts reported for cash and cash equivalents, short-term investments, accounts receivable, certain other assets, accounts payable, certain accrued and other liabilities, short-term and long-term debt approximate fair value due to their short maturities or market interest rates. As of December 31, 2002, our senior subordinated notes, which have a fixed interest rate, were trading at 105.

34

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Comprehensive Income (Loss)

Statement of Financial Accounting Standard No. 130 “Reporting Comprehensive Income” (“SFAS No. 130”) establishes standards for reporting and displaying comprehensive income and its components in a full set of general-purpose financial statements. Comprehensive income (loss) includes all changes in equity during a period from transactions and events from non owner sources. In the years ended December 31, 2002, 2001 and 2000, comprehensive income (loss) equaled net income (loss).

Inventories

Inventories are stated at the lower of cost (computed using the first-in, first-out method) or market value. The Company generally does not take ownership of its customer supplied semiconductors. The risk of loss associated with the customer supplied semiconductors remains with the customer. These customer supplied semiconductors are not included as part of the Company’s inventories.

Property, Plant and Equipment

Property, plant and equipment are recorded at cost. The Company uses the straight-line method to depreciate machinery and equipment over their estimated useful lives from three to eight years. Building facilities and building improvements located in the Shanghai, China facilities are depreciated over 20 years. Building facilities and building improvements in the Kuala Lumpur, Malaysia facilities are depreciated over 25 and 17 years, respectively. Land use rights in Shanghai, China and Kuala Lumpur, Malaysia are amortized over 50 and 99 years, respectively. Leasehold improvements are amortized over the shorter of the asset life or the remaining lease term.

Intangibles

Intangibles are amortized over their useful lives on a straight-line basis over a period of three to nine years.

Long-Lived Assets

Long-lived assets held by the Company are reviewed for impairment whenever events or circumstances indicate that the carrying amount of an asset may not be recoverable. Recoverability is measured by comparison of carrying amounts to future net cash flows an asset is expected to generate. If an asset is considered to be impaired, the impairment to be recognized is measured by the amount to which the carrying amount of the assets exceeds the fair value of the asset.

Concentration of Credit Risk and Major Customers

Financial instruments, which potentially subject the Company to concentrations of credit risk, consist principally of trade accounts receivable and cash and cash equivalents.

The Company’s customers are comprised of companies in the semiconductor industry located primarily in the United States of America. Credit risk with respect to the Company’s trade receivables is mitigated by selling to well established companies, performing ongoing credit evaluations and maintaining frequent contact with customers. The allowance for doubtful accounts is based upon the expected collectability of the Company’s accounts receivable.

At December 31, 2002, three customers accounted for 16%, 15% and 11% of the outstanding trade receivables. At December 31, 2001, three customers accounted for 19%, 12% and 11% of the outstanding trade receivables. Loss of or default by these customers could have an adverse effect upon the Company’s financial position, results of operations and cash flows.

Cash and cash equivalents are deposited with banks in the United States of America, South Korea, China, Malaysia, Barbados, British Virgin Islands, Luxembourg, and Hungary. Deposits in these banks may exceed the amount of insurance provided on such deposits; however, the Company is exposed to loss only to the extent of the amount of cash and cash equivalents reflected on its balance sheets. The Company has not experienced any losses to date on its bank cash deposits.

35

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Revenue Recognition

The Company recognizes revenue, net of rebates and discounts, upon completion of services, generally at the time of shipment of packaged semiconductors to its customers. The Company generally does not take ownership of customer supplied semiconductors as these materials are sent to the Company on a consignment basis. Accordingly, the value of the customer supplied materials are neither reflected in revenue nor in cost of revenue. The Company warrants its services; warranty claims historically have been insignificant.

Research and Development Costs

Research and development costs are charged to expense as incurred.

Accounting for Income Taxes

The Company accounts for deferred income taxes using the liability method whereby deferred tax assets and liabilities are recorded for temporary differences between amounts reported in the financial statements and amounts that are reported in the Company’s income tax returns. A valuation allowance is provided for deferred tax assets when management cannot conclude, based on the available evidence, that it is more likely than not that all or a portion of the deferred tax assets will be realized through future operations. The provision for income taxes represents taxes that are payable for the current period, plus the net change in deferred tax amounts.

Computation of Net Income per Share of Common Stock

Basic net income available to common stockholders per share of common stock is computed using the weighted-average number of common shares outstanding during the period. Diluted net income per share of common stock is computed using the weighted-average number of common and dilutive common equivalent shares outstanding during the period. Dilutive common equivalent shares result from stock options and the convertible subordinated notes.

Foreign Exchange Contracts

The Company has not entered into any foreign exchange contracts since 1999, and accordingly, no gains and losses were recorded in the years ended December 31, 2002, 2001 and 2000.

Foreign Currency Translation

The functional currency of the Company’s foreign operations is the U.S. dollar. Therefore, gains and losses resulting from translation from local currencies to the U.S. dollar are included in determining net income or loss for the period.

36

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Stock-Based Compensation

At December 31, 2002, the Company had three stock-based employee compensation plans, which are described more fully in Note 15. The Company accounts for those plans under the recognition and measurement principles of APB No. 25, Accounting for Stock Issued to Employees, and related interpretations. No stock-based employee compensation cost is reflected in net income, as all options granted under those plans had an exercise price equal to the market value of the underlying common stock on the date of grant. The following table illustrates the effect on net income and earnings per share if the Company had applied the fair value recognition provisions of FASB Statement No. 123, Accounting for Stock-Based Compensation, to the stock-based employee compensation.

	Year Ended December 31,
	2002			2001			2000
	(In thousands, except per share amounts)
Net income (loss) as reported	$	(28,855	)	$	(93,736	)	$	2,869
Deduct: Total stock-based employee compensation expense determined under fair value based method for all awards, net of related tax effects		(4,581	)		(6,130	)		(2,111	)
Pro forma net income (loss)	$	(33,436	)	$	(99,866	)	$	758
Earnings (loss) per share as reported:
Basic	$	(0.33	)	$	(1.36	)	$	0.05
Diluted	$	(0.33	)	$	(1.36	)	$	0.05
Pro forma earnings (loss) per share:
Basic	$	(0.38	)	$	(1.45	)	$	0.01
Diluted	$	(0.38	)	$	(1.45	)	$	0.01

Recent Accounting Pronouncements

In June 2001, the Financial Accounting Standards Board, or FASB, issued Statement of Financial Accounting Standards No. 143, “Accounting for Asset Retirement Obligations.” SFAS No. 143 requires that the fair value of a liability for an asset retirement obligation be realized in the period which it is incurred if a reasonable estimate of fair value can be made. Companies are required to adopt SFAS No. 143 for fiscal years beginning after June 15, 2002, but early adoption is encouraged. The Company has determined that this standard will not have a material impact on its financial position and results of operations.

In May 2002, the FASB issued SFAS No. 145, “Rescission of SFAS Nos. 4, 44, and 64, Amendment of SFAS No. 13, and Technical Corrections.” Among other things, SFAS No. 145 rescinds various pronouncements regarding early extinguishment of debt and allows extraordinary accounting treatment for early extinguishment only when the provisions of Accounting Principles Board Opinion No. 30, “Reporting the Results of Operations—Reporting the Effects of Disposal of a Segment of a Business and Extraordinary, Unusual and Infrequently Occurring Events and Transactions” are met. SFAS No. 145 provisions regarding early extinguishment of debt are generally effective for fiscal years beginning after May 15, 2002. Upon adoption of SFAS No. 145, the Company has to reclassify any gain or loss on extinguishment of debt that was classified as an extraordinary item in prior periods presented that does not meet the criteria in APB Opinion No. 30 for classification as an extraordinary item and show it within income from continuing operations.

In June 2002, the FASB issued SFAS No. 146, “Accounting for Exit or Disposal Activities.” SFAS No. 146 addresses significant issues regarding the recognition, measurement, and reporting of costs that are associated with exit and disposal activities, including restructuring activities that are currently accounted for under EITF No. 94-3, “Liability Recognition for Certain Employee Termination Benefits and Other Costs to Exit an Activity (Including Certain Costs Incurred in a Restructuring).” The scope of SFAS No. 146 also includes costs related to terminating a contract that is not a capital lease and termination benefits that employees who are involuntarily terminated receive under the terms of a one-time benefit arrangement that is not an ongoing benefit arrangement or an individual deferred-compensation contract. SFAS No. 146 will be effective for exit or disposal activities that are initiated after December 31, 2002 and early application is encouraged. We will adopt SFAS No. 146 during the first quarter of fiscal year 2003. The provisions of EITF No. 94-3 shall continue to apply for an exit activity initiated under an exit plan that met the criteria of EITF No. 94-3 prior to the adoption of SFAS No. 146. The effect on adoption of SFAS No. 146 will change on a prospective basis the timing of when restructuring charges are recorded from a commitment date approach to when the liability is incurred

37

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

In November 2002, the Financial Accounting Standards Board issued FASB Interpretation No. 45, or FIN 45, “Guarantor’s Accounting and Disclosure Requirements for Guarantees, Including Indirect Guarantees of Indebtedness of Others.” FIN 45 requires that a liability be recorded in the guarantor’s balance sheet upon issuance of a guarantee. In addition, FIN 45 requires disclosures about the guarantees that an entity has issued, including a reconciliation of changes in the entity’s product warranty liabilities. The initial recognition and initial measurement provisions of FIN 45 are applicable on a prospective basis to guarantees issued or modified after December 31, 2002, irrespective of the guarantor’s fiscal year-end. The Company has met the disclosure requirements of FIN 45 and believes that the adoption of the remaining provisions of this standard will have no material impact on its financial statements.

In November 2002, the Emerging Issues Task Force, or EITF, reached a consensus on Issue No. 00-21, “Revenue Arrangements with Multiple Deliverables.” EITF Issue No. 00-21 provides guidance on how to account for arrangements that involve the delivery or performance of multiple products, services and/or rights to use assets. The provisions of EITF Issue No. 00-21 will apply to revenue arrangements entered into in fiscal periods beginning after June 15, 2003. The Company believes that the adoption of this standard will have no material impact on its financial statements.

In December 2002, the Financial Accounting Standards Board issued Statement of Financial Accounting Standards No. 148, “Accounting for Stock-Based Compensation, Transition and Disclosure.” SFAS No. 148 provides alternative methods of transition for a voluntary change to the fair value based method of accounting for stock-based employee compensation. SFAS No. 148 also requires that disclosures of the pro forma effect of using the fair value method of accounting for stock-based employee compensation be displayed more prominently and in a tabular format. Additionally, SFAS No. 148 requires disclosure of the pro forma effect in interim financial statements. The transition and annual disclosure requirements of SFAS No. 148 are effective for fiscal years ended after December 15, 2002. The interim disclosure requirements are effective for interim periods beginning after December 15, 2002. The Company has adopted the disclosure requirements and believes that the adoption of the remaining provisions of this standard will have no material impact on its financial statements.

In January 2003, the Financial Accounting Standards Board issued FASB Interpretation No. 46, or FIN 46, “Consolidation of Variable Interest Entities, an Interpretation of ARB No. 51.” FIN 46 requires certain variable interest entities to be consolidated by the primary beneficiary of the entity if the equity investors in the entity do not have the characteristics of a controlling financial interest or do not have sufficient equity at risk for the entity to finance its activities without additional subordinated financial support from other parties. FIN 46 is effective immediately for all new variable interest entities created or acquired after January 31, 2003. For variable interest entities created or acquired prior to February 1, 2003, the provisions of FIN 46 must be applied for the first interim or annual period beginning after June 15, 2003. The Company believes that the adoption of this standard will have no material impact on its financial statements.

Note 3: Acquisition of Malaysian Business

On June 30, 2000, the Company consummated the acquisition of Intersil’s packaging and test operations located in Kuala Lumpur, Malaysia along with related intellectual property for approximately $71.5 million in cash and preferred stock, which was converted into common stock at the time of the initial public offering. The acquisition has been accounted for using the purchase method of accounting. In connection with the acquisition, the Company entered into a five-year supply agreement with Intersil to provide Intersil assembly and test services on an exclusive basis.

The terms of the acquisition of the Malaysian business require the Company to pay until June 30, 2003 additional contingent incentive payments to Intersil based on the achievement of milestones with respect to the transfer of the seller’s packaging business. The Company records these contingent payments as additional purchase price if and when they are earned. In the event that Intersil was to achieve all the milestones, Intersil would receive an additional sum of approximately $17.9 million in the aggregate. For the years ended December 31, 2002, 2001 and 2000, $6.6 million, $7.4 million, and $0.5 million, respectively, were paid for a cumulative total of $14.5 million. These payments increased the effective purchase price and were allocated to non-current assets. Additionally, in 2000, $2.4 million of other purchase price adjustments were recorded based on the difference between the final closing balance sheet and the estimated closing balance sheet of the Malaysian business. As of December 31, 2002, deferred tax of $4.5 million has been recorded on all of these adjustments. This resulted in a further increase in non-current assets.

38

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

There was no goodwill arising from the acquisition of the Malaysian business. The fair value of total assets and liabilities exceeded the purchase price by $56.2 million as of July 1, 2000. This amount has been allocated in full to non-current assets as summarized below:

Non-current asset	Estimated Fair Value		Initial Excess of Fair Value of Acquired Net Amounts Over Cost			Total Additional Purchase Price		Adjusted Value
			(in millions)
Land and buildings	$	27.9	$	(11.1	)	$	4.0	$	20.8
Plant and equipment		93.9		(36.9	)		14.9		71.9
Intellectual property		20.9		(8.2	)		2.5		15.2
	$	142.7	$	(56.2	)	$	21.4	$	107.9

Intellectual property acquired along with the Malaysian business primarily consists of trade secrets and patents. The estimated average useful lives of these assets are between five and nine years.

An accrual of $7.4 million was established for expected costs of restructuring the Malaysian business. During the years ended December 31, 2001 and 2000, $2.5 million and $4.9 million of these non-recurring costs were paid in connection with the Company’s factory reorganization, product discontinuance and employee related costs. The Company began formulating exit plans and termination data during the due diligence relating to the acquisition of the Malaysian business. The accrual was originally comprised of $5.0 million for involuntary termination benefits and $2.4 million for other exit activities. Actual involuntary termination benefits and other exit costs amounted to $7.0 million and $0.4 million, respectively. The projected number of planned reductions in head count as a result of this planned restructuring was 380 employees, with an actual reduction of 373 employees. All restructuring activities were completed in the year ended December 31, 2001.

Intersil assigned to the Company patents, copyrights, and technical information used exclusively in or associated with the Malaysian business. Furthermore, Intersil granted a worldwide, non-exclusive, royalty-free license under other Intersil patents, copyright and technical information, to the Company, which is also used in or related to the operation of the Malaysian business. This license is perpetual and irrevocable. Any intellectual property rights in the bonding diagrams, test programs, maskworks and test boards uniquely related to the Intersil products for which the Company will provide packaging and test services under the supply agreement with Intersil are licensed to the Company only for use in providing those services.

The results of operations of the Malaysian business have been included within the Company’s results of operations for periods subsequent to June 30, 2000. Set forth below is the unaudited pro forma combined summary of operations of the Company for the year ended December 31, 2000, as if the acquisition had been made on January 1, 2000 (in thousands, except for per share amounts).

Pro Forma Disclosure

	Year Ended December 31, 2000
	(unaudited)
Net revenue	$	536,326
Income before extraordinary item		9,165
Net income		6,775
Earnings per share
Basic	$	0.10
Diluted	$	0.10
Shares used in per share calculation:
Basic		68,367
Diluted		69,553

39

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 4: Termination of Advisory Agreements

At the time of the 1999 recapitalization, the Company entered into two advisory agreements with certain Equity Investors under which the Equity Investors provided financial, advisory and consulting services to the Company. Each advisory agreement was to remain in effect for an initial term of ten years. Expenses related to these contracts were recorded as selling, general and administrative expenses.

The Company agreed to terminate the advisory agreements with the Equity Investors upon the closing of the initial public offering for a one-time aggregate payment of $8.0 million consisting of a $3.6 million cash payment and the issuance of $4.4 million of the Company’s Class A common stock at a price per share equal to the initial public offering price of $12.00 per share. There were no active consulting projects involving the Equity Investors at the time the agreements were cancelled. The one-time charge to income of $8.0 million was classified as other expense and was made in the third quarter of fiscal 2000 for the termination of these agreements.

Note 5: Risks and Uncertainties

Industry

The Company’s business involves certain risks and uncertainties. Factors that could affect the Company’s future operating results and cause actual results to vary materially from expectations include, but are not limited to, dependence on a cyclical industry that is characterized by rapid technological changes, fluctuations in end-user demands, availability of materials and equipment, evolving industry standards, competitive pricing and declines in average selling prices, risks associated with foreign currencies, and enforcement of intellectual property rights. Additionally, the market in which the Company operates is very competitive. As a result of these industry and market characteristics, key elements of competition in the independent semiconductor packaging market include breadth of packaging offerings, time-to-market, technical competence, design services, quality, production yields, reliability of customer service and price.

As a result of difficult business and market conditions in the semiconductor industry, the Company incurred net losses of $28.9 million and $93.7 million for the years ended December 31, 2002 and 2001, respectively. The Company completed two equity offerings in 2002 (see note 12) providing net proceeds of $163.0 million and used $112.4 million to repay debt. The Company believes that its existing cash balances, cash flows from operations and the available borrowings under the senior credit facilities of $50.0 million will provide sufficient cash resources to meet the projected operating and other cash requirements for the next twelve months. An event of default under any debt instrument, if not cured or waived, could have a material adverse effect on the Company. The Company may require capital sooner than currently expected. The Company cannot assure that additional financing will be available when it is needed or, if available, that it will be available on satisfactory terms. In addition, the terms of the senior credit facilities and senior subordinated notes significantly reduce the Company’s ability to incur additional debt. Failure to obtain any such additional financing, if required, could have a material adverse effect on the Company.

The Company reduced the concentration of its customers that make up more than 10.0% of sales from two customers in the year 2000 accounting for 47.0%, three customers in the year 2001 accounting for 51.3% of total revenue, to five customers in 2002 accounting for 66.3% of total revenue. Nonetheless, any decommitment from any major customer for products could have an adverse impact on the Company’s financial position, results of operations and cash flows.

In 2002, 2001 and 2000, the Company had five, three and two customers, which each accounted for more than 10.0% of sales, respectively. These customers include Atmel, Fairchild, Intel, Intersil, LSI Logic and nVIDIA.

Other

South Korean, Chinese, and Malaysian foreign currency exchange regulations may place restrictions on the flow of foreign funds into and out of those countries. The Company is required to comply with these regulations when entering into transactions in foreign currencies in South Korea, China and Malaysia. As of December 31, 2002 and 2001, there were no restrictions on foreign funds flow.

The Company procures materials from local vendors in the ordinary course of business. Three vendors in South Korea supply approximately 43.0% of the Company’s component parts used in performing packaging services. Loss of a major supplier could have an adverse impact on the Company’s financial position, results of operations and cash flows.

Note 6: Selected Balance Sheet Accounts

The components of inventories were as follows (in thousands):

	December 31,
	2002		2001
Raw materials	$	11,198	$	7,949
Work in process		3,293		3,080
Finished goods		808		1,452
	$	15,299	$	12,481

40

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Property, plant and equipment were comprised of the following (in thousands):

	December 31,
	2002			2001
Land use rights	$	12,368		$	11,969
Buildings and improvements		78,021			63,258
Equipment		518,093			457,171
		608,482			532,398
Less accumulated depreciation and amortization		(272,085	)		(227,748	)
	$	336,397		$	304,650

Land use rights represent payments made to secure, on a fully paid-up basis, the use of the property where the Company’s facilities are located in Shanghai, China and Kuala Lumpur, Malaysia for a period of 50 and 99 years, respectively. These land use rights expire in the year 2044 for Shanghai, China and in the year 2086 for Kuala Lumpur, Malaysia.

Effective January 1, 2000, the Company re-evaluated the estimated useful lives of equipment. Based on the Company’s assessment of the data gathered, estimated useful lives of assembly and test product equipment and furniture and fixtures were changed from five years to eight years. Previously, such equipment was depreciated on a straight-line basis over an estimated useful life of five years. For all periods presented, useful lives of eight years have been consistently applied to these property, plant and equipment categories.

Other assets were comprised of the following (in thousands):

	December 31,
	2002		2001
Deposits	$	836	$	1,603
Long-term employee loans		802		652
Debt issuance costs, net of amortization of $5,944 and $7,226		10,132		14,715
Intangibles, net of amortization of $17,087 and $12,015		17,300		18,038
Other		1,187		155
	$	30,257	$	35,163

Intangible assets balances as of December 31, 2002 are summarized as follows (in thousands):

	Gross Assets		Accumulated Amortization		Net Assets
Intellectual property	$	15,734	$	4,980	$	10,754
Software and software development		14,231		8,460		5,771
Licenses		4,422		3,647		775
	$	34,387	$	17,087	$	17,300

Amortization expense for intangible assets is summarized as follows (in thousands):

	Years Ended December 31,
	2002		2001		2000
Intellectual property	$	2,121		$1,955	$	904
Software and software development		2,554		2,483		3,423
Licenses		397		2,812		438
	$	5,072		$7,250	$	4,765

Intangible assets are being amortized over estimated useful lives of three to nine years. Estimated future amortization expense is as follows (in thousands):

2003	$	5,069
2004		4,251
2005		4,164
2006		2,559
2007		1,257
Thereafter		—
Total	$	17,300

41

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Debt issuance costs of $16.8 million were incurred in 2000 and 1999 as a result of raising $300.0 million of debt in connection with the recapitalization and approximately $55.8 million of debt in connection with the Malaysian acquisition, respectively. In June 2001, the Company issued $50.0 million of convertible subordinated notes and $15.0 million of senior subordinated notes in a private placement. Debt issuance costs of $0.7 million and $4.5 million were incurred in 2002 and 2001, respectively, in connection with the issuance of these debt obligations.

On early retirement of certain debt with proceeds from the secondary public offerings and the initial public offering, the Company recorded an extraordinary loss of $3.0 million, net of related tax benefit in the year ended December 31, 2002 and $2.4 million, net of related tax benefit, in the year ended December 31, 2000 principally representing the write-down of debt issuance costs. There was no extraordinary item in 2001.

Accrued expenses and other liabilities were comprised of the following (in thousands):

	December 31,
	2002		2001
Payroll and related items	$	14,778	$	9,696
Interest payable		9,210		10,954
Other expenses		5,412		7,188
	$	29,400	$	27,838

Note 7: Restructuring, write down of impaired assets and other charges

2002

In 2002, the Company utilized $0.3 million of the restructuring accrual for reductions in workforce in its South Korean operations and wrote off the executive officer loans against the related $1.5 million loan loss reserve. In 2002, the Company completed another 92 of the planned 751 employee separations. Cumulatively the Company has completed 646 of the planned 751 employee separations at December 31, 2002. Due to stronger than expected performance from the South Korean subsidiary and the sale of its plating line in Korea which had been planned to be shut down, reserve releases in the amount of $1.3 million were credited to restructuring charges in the statement of operations for the year ended December 31, 2002. There are no further terminations or other restructuring activities planned for which amounts were reserved in 2001. This credit of $1.3 million was reduced by a restructuring action in the Malaysian plant in which $0.6 million was incurred to terminate 30 employees. This action was not included in the 2001 reserves.

2001

In the first and fourth quarters of 2001, ChipPAC’s management approved restructuring plans to realign its organization and reduce operating costs. These actions were designed to better align ChipPAC’s workforce with the decrease in demand and to reduce selling, general, and administrative expenses. These plans were a combination of reductions in force and furloughs. Accordingly, ChipPAC planned to reduce associated employee positions by approximately 554 and 197 worldwide in connection with the first and fourth quarter plans, respectively. Restructuring and related charges of $3.0 million and $3.3 million were expensed during the first and fourth quarters of 2001, respectively. The entire first quarter charge was related to employee separations and furloughs. The fourth quarter charge was comprised of $1.8 million related to employee separations and a $1.5 million loan loss reserve for executive officer loans. Employee separation benefits under each plan were similar and included severance, medical and other benefits. As of December 31, 2001, ChipPAC completed 554 of the planned 751 employee separations and all of the furloughs planned for 2001.

Components of accrued restructuring costs and amounts charged for restructuring as of December 31, 2002 were as follows (in thousands):

	Beginning Accrual		Expenditures			December 31, 2001		Adjustments			Expenditures			December 31, 2002
Employee separations	$	4,732	$	(3,100	)	$	1,632	$	(1,283	)	$	(349	)	$	—
Loan loss reserve		1,500		—			1,500		—			(1,500	)		—
	$	6,232	$	(3,100	)	$	3,132	$	(1,283	)	$	(1,849	)	$	—

42

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

The Company reviews property, plant and equipment and other long-lived assets for impairment whenever events or changes in circumstances indicate that the carrying amount of an asset may not be recoverable. The Company determines whether there has been an impairment by comparing the anticipated undiscounted future net cash flows to be generated by an asset to its carrying value. If an asset is considered impaired, the asset is written down to fair value which is either determined based on discounted cash flows or appraised or estimated values, depending on the nature of the asset. During the year ended December 31, 2001, the Company wrote down impaired assets by $34.7 million. The asset write down related primarily to the Company’s manufacturing assets in the assembly and test facilities in South Korea and Malaysia. The Company determined that due to excess capacity, the future expected cash flows related to equipment for certain package types would not be sufficient to recover the carrying value of the manufacturing equipment in the facility for those package types. The carrying values of these assets were written down to the estimated fair value and were continued to be depreciated over their remaining useful lives.

Note 8: Dividends Accreted

	2002		2001		2000
(in thousands)
Preferred Stock, Class A (“Intel Preferred Stock”)	$	—	$	—	$	620
Preferred Stock, Class B (“Hyundai Preferred Stock”)		—		—		5,756
Preferred Stock, Class C (“Intersil Preferred Stock”)		—		—		1,821
	$	—	$	—	$	8,197

Dividends on the Intel Preferred Stock were accrued on a daily basis at a rate of 10.0% per annum. Accumulated and unpaid dividends as of December 31, 1999 were capitalized as part of Mandatorily Redeemable Preferred Stock. Total accreted dividends and liquidation value of $11.0 million were converted into 2,800,438 shares of common stock at the initial public offering.

Dividends on the Hyundai Preferred Stock were accrued on a daily basis at a rate of 12.5% per annum. Dividends were recorded as accumulated and unpaid dividends as part of Mandatorily Redeemable Preferred Stock. Total dividends and liquidation value of $79.3 million were paid in full through the proceeds of the initial public offering.

Dividends on the Intersil Preferred Stock were accrued on a daily basis at a rate of 5.0% per annum. Accumulated and unpaid dividends were recorded as part of Mandatorily Redeemable Preferred Stock. Total dividends and liquidation value of $17.6 million were converted into 1,548,816 shares of common stock at the initial public offering.

Note 9: Earnings per Share

Statement of Accounting Standards No. 128 (“SFAS 128”) requires a reconciliation of the numerators and denominators of the basic and diluted per share computations. Basic earnings per share (“EPS”) is computed by dividing net income available to stockholders (numerator) by the weighted average number of common shares outstanding (denominator) during the period. Diluted EPS is computed using the weighted average number of shares of common stock and all potentially dilutive shares of common stock outstanding during the period. In computing diluted EPS, the average stock price for the period is used in determining the number of shares assumed to be purchased from the exercise of stock options and the if-converted method is used for determining the number of shares assumed issued from the conversion of the convertible subordinated notes.

As of December 31, 2002, there were options outstanding to purchase 6.4 million shares of Class A common stock with a weighted average exercise price of $4.14, which could potentially dilute basic earnings per share in the future, but which were not included in diluted earnings per share as their effect would have been antidilutive. The Company also has outstanding $50.0 million of convertible subordinated notes, which are convertible into approximately 5.0 million shares of Class A common stock but were not included in diluted earnings per share as their effect would also have been antidilutive. Had these options and the convertible subordinated notes been included in the diluted earnings per share counts, the total of weighted average shares of Class A common stock would have been 98,828,000 shares.

43

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Following is a reconciliation of the numerators and denominators of the basic and diluted EPS computations for the periods presented below.

	December 31, 2002							December 31, 2001							December 31, 2000
	Loss			Shares	Per-Share Amount			Loss			Shares	Per-Share Amount			Income		Shares	Per-Share Amount
	(In thousands, except per share amounts)
Basic EPS:
Income (loss) per share available to common stockholder before extraordinary item	$	(25,850	)	87,430	$	(0.30	)	$	(93,736	)	68,878	$	(1.36	)	$	5,259	57,067	$	0.09
Effect of dilutive securities:
Stock options and warrants				—							—						1,186
Diluted EPS:
Income (loss) per share available to common stockholder before extraordinary item	$	(25,850	)	87,430	$	(0.30	)	$	(93,736	)	68,878	$	(1.36	)	$	5,259	58,253	$	0.09
Basic EPS:
Extraordinary item	$	3,005		87,430	$	(0.03	)	$	—			$	—		$	2,390	57,067	$	(0.04	)
Effect of dilutive securities:
Stock options and warrants				—							—						1,186
Diluted EPS:
Extraordinary item	$	3,005		87,430	$	(0.03	)	$	—		—	$	—		$	2,390	58,253	$	(0.04	)
Basic EPS:
Net Income (loss) per share available to common stockholders	$	(28,855	)	87,430	$	(0.33	)	$	(93,736	)	68,878	$	(1.36	)	$	2,869	57,067	$	0.05
Effects of dilutive securities:
Stock options and warrants				—							—						1,186
Diluted EPS
Net Income (loss) per share available to common stockholders	$	(28,855	)	87,430	$	(0.33	)	$	(93,736	)	68,878	$	(1.36	)	$	2,869	58,253	$	0.05

Note 10: Segments and Geographic Information

The Company is engaged in one industry segment, the packaging and testing of integrated circuits.

The following table describes the composition of revenue by product group and test services, as a percentage of total revenue:

	Year Ended December 31,
	2002		2001		2000
Substrate	50.9	%	46.0	%	55.8	%
Lead frame	33.6		40.2		35.0
Test	15.5		13.8		9.2
Total	100.0	%	100.0	%	100.0	%

44

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Revenue from unaffiliated customers is based on the geographic location of each customer’s principal place of business. The Company’s sales by geographic location of the customer were as follows (in thousands):

	Years Ended December 31,
Region	2002		2001		2000
USA	$	323,663	$	302,405	$	410,361
Asia		36,367		19,722		69,128
Europe		3,636		6,574		14,832
Total	$	363,666	$	328,701	$	494,411

The following table presents long-lived identifiable assets based on the location of the asset (in thousands):

	December 31,
	2002		2001
United States	$	9,079	$	10,373
British Virgin Islands		18,928		23,151
South Korea		142,630		122,255
China		103,177		101,183
Malaysia		92,840		82,851
	$	366,654	$	399,813

45

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 11: Term Debt and Credit Facilities

Under the terms of the recapitalization and merger in 1999 all short and long-term debt, loans and leases and other credit facilities existing prior to the recapitalization were terminated at the recapitalization date.

To finance part of the recapitalization, the Company borrowed $300.0 million of new debt, comprising $150.0 million of term loans and $150.0 million of senior subordinated notes. The term loans bear interest based on the London Interbank Offered Rate (LIBOR, 1.43% at December 31, 2002) plus 4.3% and the senior subordinated notes bear interest at 12.75% per annum. The senior subordinated notes mature on August 1, 2009. If a change of control occurs, the Company may be required to allow holders of the senior subordinated notes to sell the Company their notes at a purchase price of 101.0% of the principal amount of the notes, plus accrued and unpaid interest. Interest is payable semi-annually for the senior subordinated notes and quarterly for the term loans.

At December 31, 2002, the Company has a borrowing capacity of $50.0 million for working capital and general corporate purposes under the revolving credit line portion of the senior credit facilities. The revolving credit line under the senior credit facilities matures on July 31, 2005. As of December 31, 2002, there was no outstanding balance on the revolving line of credit and the entire $50.0 million was available to the Company.

In June 2001, the Company issued $50.0 million of convertible subordinated notes and $15.0 million of senior subordinated notes in a private placement. The convertible subordinated notes bear interest of 8.0% per annum and mature on June 15, 2011. The senior subordinated notes bear interest at 12.75% per annum and mature on August 1, 2009. A majority of the proceeds from these sales were used to pay down the term loans and revolving loans.

As of December 31, 2002, the Company’s debt consisted of $267.9 million of borrowings, which was comprised of $36.2 million in term loans, $165.0 million of senior subordinated notes, $50.0 million of convertible subordinated notes and $16.7 million in foreign loans. The foreign loan was established with Cho Hung Bank of South Korea in 2002 providing $16.7 million utilized for general corporate purposes. As of December 31, 2002, the Company had all $16.7 million outstanding with an interest rate of 4.18%. This loan matures in 2004.

The Company has also established two separate lines of credit with Korean Exchange Bank and Cho Hung Bank, with credit limits of $10.2 million and $8.0 million, respectively. As of December 31, 2002, there were no outstanding borrowings against these lines of credit. Both agreements are subject to an annual review by Korean Exchange Bank and Cho Hung Bank for the continued use of the credit line facility.

The Company’s senior credit facilities, as amended, contain covenants restricting the Company’s operations and requiring that the Company meet specified financial tests. The financial tests for 2002 were as follows: (1) a requirement to raise at least $20.0 million in junior capital by March 1, 2002, which was fulfilled by the Company through an underwritten public offering of Class A common stock in January 2002 and (2) a minimum EBITDA requirement based on a rolling 12 months ended June 30, 2002 and September 30, 2002, of $31.0 million and $37.0 million, respectively, with no requirement for December 31, 2002. Beginning with the quarter ended December 31, 2002, the financial covenants consist solely of a minimum interest coverage ratio and a maximum senior leverage ratio based on a rolling 12 months calculation. There were no violations of the covenants under the senior credit facilities, as amended, through December 31, 2002.

46

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Future maturities of long-term debt at December 31, 2002 were as follows (in thousands):

Year Ended December 31,
2003	$	—
2004		—
2005		16,700
2006		36,187
2007		—
2008		—
2009		165,000
2010		—
2011		50,000
	$	267,887
Less current portion		—
Non current portion	$	267,887

Substantially all assets of the ChipPAC consolidated group, with the exception of the Chinese non-guarantor entity, ChipPAC Shanghai, have been pledged as collateral under the term debt and revolving credit facilities agreement put in place on August 5, 1999. The indenture governing the 12.75% senior subordinated notes has been fully and unconditionally guaranteed, jointly and severally on a senior subordinated basis by the parent company and the guaranteeing subsidiaries. See Note 19.—Supplemental Financial Statements of Guarantor/Non-Guarantor Entities.

On early retirement of certain debt upon the secondary public offerings and the initial public offering, the Company recorded an extraordinary loss of $3.0 million, net of related tax benefit in the year ended December 31, 2002 and $2.4 million, net of related tax benefit, in the year ended December 31, 2000 principally representing the write-down of debt issuance costs. There was no extraordinary item in 2001.

Note 12: Common Stock and Stockholders’ Equity

A portion of certain shares sold by the Company are subject to a right of repurchase by the Company subject to vesting, which is generally over a four year period from the earlier of grant date or employee hire date, as applicable until vesting is complete. At December 31, 2002, there were 211,459 shares subject to repurchase.

The Company currently has authorized Class A and B common stock. There are 250,000,000, $0.01 par value, shares authorized of each Class A and Class B common stock. At December 31, 2002 and 2001 there were 94,093,000 and 69,404,000 shares, respectively, of Class A common stock issued and outstanding. There were no shares of Class B common stock issued or outstanding at December 31, 2002 or 2001.

On June 13, 2000 the Company was reincorporated in Delaware (“ChipPAC Delaware”). In order to effect the reincorporation, ChipPAC, Inc., a California corporation (“ChipPAC California”), was merged with and into ChipPAC Delaware and as a result of which ChipPAC California ceased to exist. The Company operates its business as ChipPAC, Inc. The merger occurred immediately prior to the effectiveness of the Company’s Registration Statement on Form S-1 for its initial public offering. In the merger, each outstanding share of ChipPAC California Class A common stock was converted into one share of ChipPAC Delaware Class A common stock. Each outstanding share of ChipPAC California Class B common stock was converted into one share of ChipPAC Delaware Class B common stock. Each outstanding share of ChipPAC California Class L common stock was converted into and became one share of ChipPAC Delaware Class A common stock plus an additional number of shares of ChipPAC Delaware Class A common stock which was determined by dividing a preferential distribution, based in part on the original cost of such share plus an amount which accrued daily at a rate of 12.0% per annum, compounded quarterly, by the per share price of the ChipPAC Delaware Class A common stock in the initial public offering. As a result, Class L common stockholders received 8,880,507 shares of Class A common stock.

The Company currently has authorized 10,000,000 shares of preferred stock, par value $0.01, which may be issued in one or more series. At December 31, 2002, 2001 and 2000, there were no shares of preferred stock outstanding.

47

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Initial Public Offering

In July 2000, a 0.38098771 for 1 reverse stock split was made on the Company’s common stock. All share and per share information presented herein has been restated to give effect to the stock split.

On August 8, 2000, the Securities and Exchange Commission declared effective the Registration Statement on Form S-1 (Registration No. 333-39428) relating to the initial public offering of the Company’s Class A common stock. In connection with the closing of the initial public offering, the Company issued 10,000,000 shares of Class A Common Stock for gross proceeds of $120.0 million. The total proceeds from the offering and a concurrent private placement, net of issuance costs, were $135.0 million.

On August 18, 2000 in connection with the underwriters’ exercise of their over-allotment option to purchase additional shares of our Class A common stock, an additional 1,500,000 shares of Class A common stock for gross proceeds of $18.0 million were issued by the Company. Total proceeds from the issuance of the additional shares, net of issuance costs, was $16.9 million.

The net proceeds, amounting to $151.8 million, were used to redeem in full the Class B mandatorily redeemable preferred stock of $79.3 million and to repay debt of $64.2 million.

In connection with the closing of the initial public offering, all outstanding shares of Class A and Class C mandatorily redeemable preferred stock were automatically converted into an aggregate of 4,349,254 shares of Class A common stock.

Secondary Public Offerings

On January 30, 2002, the Company sold 10,000,000 shares of Class A common stock in an underwritten public offering for $6.00 per share. On February 14, 2002, the Company sold an additional 1,425,600 shares of Class A common stock in conjunction with the underwriter’s exercise of their over-allotment option for $6.00 per share. In connection with these sales, the Company received net proceeds of approximately $63.8 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $62.4 million from this offering were used to pay down term loans and revolving loans. The remaining $1.3 million was used for general corporate purposes.

On May 30, 2002, the Company sold 12,000,000 shares of Class A common stock in an underwritten public offering for $8.75 per share. In connection with these sales, the Company received net proceeds of approximately $99.2 million, after deducting underwriting discounts, commissions and estimated offering expenses. Net proceeds of $50.0 million from this offering were used to pay down term loans and revolving loans. The remaining $49.2 million was used for general corporate purposes.

Sources and Use of Funds From Issuances of Common Stock in 2002

	January Offering			May Offering			Totals
	(in thousands)
Source of funds:
Gross proceeds from issuance of common stock	$	68,554		$	105,000		$	173,554
Less: related issuance costs		(4,768	)		(5,830	)		(10,598	)
Net proceeds from issuance of common stock	$	63,786		$	99,170		$	162,956
Use of funds:
Repayment of senior credit facilities	$	62,438		$	50,000		$	112,438
General corporate purposes		1,348			49,170			50,518
	$	63,786		$	99,170		$	162,956

In June 2002, the Company utilized $50.0 million of the public offering proceeds to extinguish term loan A and the capital expenditure loan and to substantially pay down term loan B under its senior credit facility. As a result, capitalized debt issuance costs of $3.0 million were written off and the expense is included in the results for the year ended December 31, 2002 as an extraordinary item with no comparable results for the same period in 2001. There was no tax benefit for the write off because the costs were written off in a tax jurisdiction that provides no such benefit.

48

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 13: Commitments

On August 5, 1999, the Company and Intel entered into the Intel Materials Agreement pursuant to which Intel would outsource to the Company a portion of its semiconductor packaging needs. In return, the Company would provide Intel with rebates based upon the volume of packaging services outsourced to the Company. Rebates were deducted from revenue and accrued as current liabilities when the sale was made. The agreement expired on March 31, 2002. For the years ended December 31, 2002 and 2001, there was no rebate amount earned by Intel. For the year ended December 31, 2000, Intel earned and received $3.6 million.

The Company’s executive offices in the United States of America were leased from HEA until May 2001. Thereafter, the Company’s executive offices were moved to Fremont, California and are leased from an unrelated party. The Company’s facilities in Korea are leased from HEI under non-cancelable operating lease arrangements through 2004 with an option to extend to 2009. Rent expense in the years ended December 31, 2002, 2001, and 2000 was $5.0 million, $6.4 million, and $5.2 million respectively.

Future annual minimum lease payments under noncancellable operating leases that have initial or remaining noncancellable lease terms in excess of one year at December 31, 2002 were as follows (in thousands):

Years Ended December 31,
2003	$	7,061
2004		5,241
2005		5,144
2006		5,162
2007		5,172
Thereafter		23,477
	$	51,257

Note 14: Related Party Transactions

	December 31,
	2002		2001		2000
	(In thousands)
Revenue from sale of packaging and testing services to HEI group	$	3,367	$	4,623	$	31,500
Reimbursement for plating services provided to HEI group including margin of $25, $2,020 and $4,236 respectively		4,526		6,392		9,300
Accounts receivable at year end for sales and plating services to HEI group		6		417		814
Accounts payable to HEI group for common area use of facilities and utilities.		962		1,370		—

During the years ended December 31, 2001 and 2000, HEA charged $0.3 million and $0.7 million, respectively to the Company for rent and building related taxes, insurance, and maintenance. There were no similar expenses in the year 2002.

At June 30, 1998, Hyundai Information Technology (“HIT”) entered into a three-year agreement with ChipPAC Korea to provide information technology services. This agreement was extended to June 2002. For the years ended December 31, 2002, 2001 and 2000, HIT charged ChipPAC Korea $0.5 million, $0.9 million and $1.6 million, respectively.

At the time of the recapitalization, the Company entered into two ten-year advisory agreements with the Equity Investors. The Company and the Equity Investors agreed to terminate the advisory agreements upon the closing of the initial public offering (see Note 4).

In 2001, in conjunction with restructuring and related activities, a loan loss reserve of $1.5 million for executive officer loans was established (see Note 7).

49

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 15: 2000 Equity Incentive Plan, 2000 Employee Stock Purchase Plan and 1999 Stock Purchase and Option Plan

The Company adopted the 1999 Stock Purchase and Option Plan, or the “1999 Stock Plan,” which authorized the granting of stock options and the sale of Class A common stock or Class L common stock to current or future employees, directors, consultants or advisors of the Company. Under the 1999 Stock Plan, a committee of the board of directors is authorized to sell or otherwise issue Class A common stock or Class L common stock at any time prior to the termination of the 1999 Stock Plan in such quantity, at such price, on such terms and subject to such conditions as established by the committee up to an aggregate of 15,500,000 shares of Class A common stock and 500,000 shares of Class L common stock, including shares of common stock with respect to which options may be granted, subject to adjustment upon the occurrence of specified events to prevent any dilution or expansion of the rights of participants that might otherwise result from the occurrence of such events. No options or stock grants have been made under the 1999 Stock Plan since the initial public offering, when the 2000 Equity Incentive Plan or “2000 Plan” became effective.

The Company’s 2000 Plan was adopted by the board of directors and approved by the stockholders on June 14, 2000. Amendments to the 2000 Plan were adopted by the board of directors on January 30, 2001, and approved by the stockholders on March 16, 2001. The 2000 Plan provides for the grant of incentive stock options to employees (including officers and employee directors) and for the grant of nonstatutory stock options to employees, directors and consultants. A total of (1) 11,615,698 shares of common stock, (2) any shares returned to the Company’s 1999 Stock Plan as a result of termination of options and (3) annual increases to be added on the date of each annual meeting of stockholders of the Company commencing in 2001 equal to one percent of the outstanding shares of common stock, or a lesser amount as may be determined by the board of directors, have been reserved for issuance pursuant to the 2000 Plan.

In 2002, 160,313 shares were returned from the 1999 Stock Plan and pooled into the 2000 Stock Plan. In May 2002, an additional 811,081 shares were added to the 2000 Plan as the result of the annual increase of one percent of the outstanding shares of common stock as of the annual meeting of the stockholders.

Options are granted at the fair market value and expire up to ten years after the date of grant. Vesting occurs usually over a two-to four-year period.

The following table summarizes stock option activity under the 1999 Stock Plan:

1999 Option Plan	Options Available for Grant		Options Outstanding		Weighted Average Exercise Price
Balances at December 31, 1999	670,825		1,157,918		$	4.19
Options reserved	51,909		—			—
Options granted	(682,154	)	682,154			10.30
Options cancelled	106,658		(106,658	)		4.96
Options exercised	—		(45,174	)		0.47
Options transferred	(147,238	)	—			—
Balances at December 31, 2000	—		1,688,240		$	6.71
Options reserved	57,669		—			—
Options cancelled	201,362		(201,362	)		6.99
Vested options expired	22,612		(22,612	)		7.48
Options exercised	—		(106,772	)		1.74
Options transferred	(281,643	)	—			—
Balances at December 31, 2001	—		1,357,494		$	7.05
Options reserved	30,719		—			—
Options cancelled	111,670		(111,670	)		6.33
Vested options expired	17,924		(17,924	)		10.59
Options exercised	—		(104,395	)		4.20
Options transferred	(160,313	)	—			—
Balances at December 31, 2002	—		1,123,505		$	7.35

50

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

The following table summarizes stock option activity under the 2000 Plan:

2000 Option Plan	Options Available for Grant		Options Outstanding		Weighted Average Exercise Price
Balances at January 1, 2000
Options reserved	1,142,963		—		$	—
1999 options unused	147,238		—			—
Options granted	(1,263,502	)	1,263,502			5.01
Options cancelled	12,770		(12,770	)		12.60
Balances at December 31, 2000	39,469		1,250,732		$	4.93
Options reserved	10,756,426		—			—
1999 options unused	281,643		—			—
Options granted	(4,768,235	)	4,768,235			2.95
Options cancelled	228,001		(228,001	)		4.81
Vested options expired	200		(200	)		7.88
Balances at December 31, 2001	6,537,504		5,790,766		$	3.30
Options reserved	811,081		—			—
1999 options unused	160,313		—			—
Options granted	(334,600	)	334,600			6.02
Options cancelled	668,865		(668,865	)		3.32
Vested options expired	18,334		(18,334	)		8.03
Options exercised	—		(137,540	)		2.97
Balances at December 31, 2002	7,861,497		5,300,627		$	3.46

The following table summarizes information with respect to options outstanding and exercisable at December 31, 2002:

	Options Outstanding			Options Exercisable
Exercise Price	Number of Shares	Weighted Avg. Exercise Price	Weighted Avg. Remaining Contractual Life	Number of Shares	Weighted Avg. Exercise Price
$0.29 – 0.29	125,657	$ 0.29	6.8	66,574	$ 0.29
1.80 – 1.94	1,988,900	1.88	8.7	976,699	1.88
2.55 – 4.07	2,685,648	3.48	8.1	685,317	3.33
5.50 – 7.88	973,724	5.89	7.6	462,995	5.73
9.32 – 12.75	650,203	11.93	7.7	228,675	12.35
$0.29 – 12.75	6,424,132	$ 4.14	8.2	2,420,260	$ 3.97

The estimated weighted-average grant-date fair value of options granted in 2002, 2001 and 2000 were $6.02, $2.95 and $5.01, respectively, based on the Black-Scholes option pricing model using assumptions as described below.

Employee Stock Purchase Plan

In 2000, the Company adopted an employee stock purchase plan (“ESPP”) for the benefit of its employees. The ESPP qualified in the United States of America under section 423 of the Internal Revenue Code. Under the ESPP, substantially all employees may purchase the Company’s Class A common stock through payroll deductions at a price equal to 85.0% of the lower of the fair market value at the beginning or the end of each specified six-month offering period. Stock purchases are limited to 15.0% of an employee’s eligible compensation. During 2002, a total of 1,092,047 shares of Class A common stock at a weighted average price of $3.05 per share, were issued through the ESPP. For the year 2001, a total of 921,656 shares of Class A common stock at a weighted average price of $4.48 per share were issued. At December 31, 2002, 9,129,260 shares were reserved for future issuance under the ESPP.

The estimated weighted-average grant-date fair value of rights granted under the Employee Stock Purchase Plan in 2002 and 2001 was $1.90 and $1.88, respectively.

51

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Stock-Based Compensation

No stock-based employee compensation cost is reflected in net income, as all options granted under those plans had an exercise price equal to the market value of the underlying common stock on the date of grant. The following table illustrates the effect of net income and earnings per share if the Company had applied the fair value recognition provisions of FASB Statement No. 123, Accounting for Stock-Based Compensation, to the stock-based employee compensation.

	Year Ended December 31,
	2002			2001			2000
	(In thousands, except per share amounts)
Net income (loss) as reported	$	(28,855	)	$	(93,736	)	$	2,869
Deduct: Total stock-based employee compensation expense determined under fair value based method for all awards, net of related tax effects		(4,581	)		(6,130	)		(2,111	)
Pro forma net income (loss)	$	(33,436	)	$	(99,866	)	$	758
Earnings (loss) per share as reported:
Basic	$	(0.33	)	$	(1.36	)	$	0.05
Diluted	$	(0.33	)	$	(1.36	)	$	0.05
Pro forma earnings (loss) per share:
Basic	$	(0.38	)	$	(1.45	)	$	0.01
Diluted	$	(0.38	)	$	(1.45	)	$	0.01

In calculating pro forma compensation, the fair value of each stock option and stock purchase right is estimated on the date of grant using the Black-Scholes option-pricing model and the following weighted average assumptions:

	Employee Stock Options December 31,
	2002	2001	2000
Dividend yield	None	None	None
Volatility	56%	57%	54%
Risk-free interest rate	3.00%-4.57%	3.63%-4.83%	5.99%-7.13%
Expected lives (in years)	4	2-4	4
	Employee Stock Purchase Plan December 31,
	2002	2001	2000
Dividend yield	None	None	None
Volatility	56%	57%	—
Risk-free interest rate	1.96%-2.95%	4.96%-6.33%	—
Expected lives (in years)	0.5	0.5	—

Because of the Company’s short trading history as a public company, the Company’s volatility factor is based on the stock price of similar companies in its industry. The Company will begin weighting the volatility factor for its own trading history in 2003.

Note 16: Income Taxes

The components of the provision for income taxes is comprised of the following (in thousands):

	Year Ended December 31,
	2002			2001			2000
Current
Federal	$	—		$	—		$	—
State		6			1			1
Foreign		2,115			941			1,584
Total Current		2,121			942			1,585
Deferred
Federal		—			3,327			(3,533	)
State		—			385			(420	)
Foreign		(121	)		(2,076	)		5,982
Total Deferred		(121	)		1,636			2,029
Tax expense	$	2,000		$	2,578		$	3,614

52

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Income (loss) before taxes and extraordinary items is comprised of the following (in thousands):

	Year Ended December 31,
	2002			2001			2000
Domestic	$	(2,117	)	$	(483	)	$	(9,003	)
Foreign		(21,733	)		(90,675	)		27,063
	$	(23,850	)	$	(91,158	)	$	18,060

A summary of the composition of net deferred income tax assets (liabilities) is as follows (in thousands):

	December 31,
	2002			2001
Assets:
Loss due to impaired assets	$	1,783		$	6,424
Income recognized for tax but not for books		15,099			11,324
Tax credits		10,691			7,712
NOL carryforward		6,137			5,671
Other		2,331			4,255
Total gross deferred tax assets		36,041			35,386
Less valuation allowance		(24,188	)		(24,373	)
Net deferred tax assets		11,853			11,013
Liabilities:
Depreciation		(18,354	)		(16,086	)
Other		—			(69	)
Gross deferred tax liabilities		(18,354	)		(16,155	)
Total net deferred tax asset/(liability)	$	(6,501	)	$	(5,142	)

Included in deferred tax liabilities relating to depreciation as of December 31, 2002 and 2001 were $4.5 million and $3.1 million, respectively, relating to additional purchase price for the Malaysia business. The change during fiscal year 2002 increased non-current assets instead of increasing the income tax provision for the year. The total net deferred tax liability is included in other long-term tax liabilities.

Reconciliation of the statutory federal income tax to the Company’s effective tax:

	December 31,
	2002		2001		2000
Tax at federal statutory rate	35.0	%	35.0	%	35.0	%
State, net of federal benefit	2.1		0.9		(1.7	)
Valuation allowance on net operating loss	—		(6.8	)	—
Foreign operation net difference	(44.6	)	(31.4	)	(16.5	)
Other	0.1		(0.5	)	3.2
Provision for taxes	(7.4	)%	(2.8	)%	20.0	%

        At December 31, 2002, the Company had approximately $10.0 million of federal and $5.0 million of state net operating loss carryforwards available to offset future taxable income, which expire in varying amounts from 2006 to 2020. Additionally, the Company had $8.2 million Korean net operating loss which begin to expire in 2005. Under the Tax Reform Act of 1986, the amounts of the benefits from net operating loss carryforwards may be impaired or limited in certain circumstances. Events which cause limitations in the amount of net operating losses that the Company may utilize in any one year, include, but are not limited to, a cumulative ownership change of more than 50.0%, as defined over a three-year period.

        As of December 31, 2002, the Company maintains a partial valuation allowance against its gross deferred tax assets to reduce the assets to the amount the Company deemed, more likely than not, to be recoverable prior to repatriation. The Company considered, among other factors, the historical profitability prior to one-time charges, projections of future profits and the ability of the Company’s foreign subsidiaries to utilize their deferred tax assets.

53

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 17: Employee Benefit Plans

Retirement and Deferred Savings Plan—United States of America

The Company maintains a retirement and deferred savings plan for its employees (the “401(k) Plan”). The 401(k) Plan is intended to qualify as a tax qualified plan under the Internal Revenue Code. The 401(k) Plan provides that each participant may contribute up to 15.0% of tax gross compensation (up to a statutory limit). Under the 401(k) Plan, the Company is required to make contributions based on contributions made by employees. The Company’s contributions to the 401(k) Plan for the years ended December 31, 2002, 2001 and 2000 were approximately $0.2 million in each year. All amounts contributed by participants and related earnings are fully vested at all times.

Severance Benefits—Korea

Employees and directors with more than one year of service are entitled to receive a lump-sum payment upon termination of their employment with ChipPAC Korea, based on their length of service and rate of pay at the time of termination. Accrued severance benefits are adjusted annually for all eligible employees based on their employment as of the balance sheet date.

In accordance with the National Pension Act of South Korea, a certain portion of severance benefits has been deposited with the Korean National Pension Fund and deducted from accrued severance benefits. The amounts contributed will be refunded to employees from the National Pension Fund upon retirement. The expense for severance benefits for the years ended December 31, 2002, 2001, and 2000 amounted to approximately $3.8 million, $2.6 million, and $3.0 million, respectively.

Note 18: Contingent Liabilities

On June 30, 2000, the Company consummated the acquisition of Intersil’s packaging and test operations located in Kuala Lumpur, Malaysia, along with related intellectual property for approximately $71.5 million in cash and preferred stock.

The terms of the acquisition of the Malaysian business require the Company to pay until June 30, 2003 additional contingent incentive payments to Intersil based on the achievement of milestones with respect to the transfer of the Intersil’s packaging business, previously subcontracted by Intersil to third parties, to the Company. The Company records these contingent payments as additional purchase price if and when they are earned. In the event that Intersil were to achieve all of the milestones, Intersil would receive an additional sum of approximately $17.9 million in the aggregate. For the year ended December 31, 2002, the Company paid $6.6 million relating to the achievement of milestones and cumulatively $14.5 million of contingent incentive payments have been paid since the acquisition. These payments increased the effective purchase price and were allocated to non-current assets.

During the quarter ended June 30, 2002, an assessment of approximately 16.0 billion Korean Won (approximately $13.3 million U.S. Dollars at December 31, 2002), was made by the Korean National Tax Administration (“NTA”) relating to withholding tax not collected and remitted related to a loan between our subsidiaries in Korea and Hungary. Withholding on the transactions in question is not required by the prevailing tax treaty. The Company appealed the assessment through the Mutual Agreement Procedure and believes that the assessment will be overturned. On July 18, 2002, the Icheon tax office of the NTA approved a tax suspension of the proposed assessment until resolution of the disputed assessment. The NTA required a corporate guarantee of 120% of the assessment in exchange for the suspension. The Company complied with the guarantee request on August 1, 2002. There were no further assessments made during the remainder of the year ended December 31, 2002.

54

ChipPAC, Inc.

Notes to Consolidated Financial Statements—Continued

Note 19: Supplemental Financial Statements of Guarantor/Non-Guarantor Entities

In connection with the recapitalization in August 1999, ChipPAC International Company Limited, (“CP Int’l”), issued senior subordinated debt securities which are fully and unconditionally guaranteed, jointly and severally, on a senior subordinated basis, by the parent company, ChipPAC, Inc. (“CPI”) and by ChipPAC (Barbados) Ltd., ChipPAC Limited, ChipPAC Korea Company Limited (“CPK”), ChipPAC Malaysia Sdn. Bhd. (“CPM”), ChipPAC Luxembourg S.a.R.L., and ChipPAC Liquidity Management Hungary Limited Liability Company (the “Guarantor Subsidiaries”). All Guarantor Subsidiaries are wholly-owned direct or indirect subsidiaries of CPI. ChipPAC Shanghai Limited (“CPS”) did not provide a guarantee (the “Non-Guarantor Subsidiary”). The following is consolidated financial information for CP Int’l, CPI, CPM, CPK, CPS, ChipPAC (Barbados) Ltd., ChipPAC Limited, ChipPAC Luxembourg S.a.R.L., and ChipPAC Liquidity Management Hungary Limited Liability Company, segregated between the Guarantor and Non-Guarantor Subsidiaries.

55

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED BALANCE SHEETS

December 31, 2002

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non- Guarantor China			Eliminations			Consolidated
Assets
Current assets:
Cash and cash equivalents	$	3,653		$	10,166		$	14,994		$	5,360		$	—		$	34,173
Short-term investments		10,000			—			—			—			—			10,000
Intercompany accounts receivable		116,175			69,010			23,165			16,863			(225,213	)		—
Accounts receivable, net		17			—			38,760			16			—			38,793
Inventories		—			—			12,095			3,204			—			15,299
Prepaid expenses and other current assets		968			—			2,852			1,465			—			5,285
Total current assets		130,813			79,176			91,866			26,908			(225,213	)		103,550
Property, plant and equipment, net		5,528			5,582			222,698			102,589			—			336,397
Intercompany loans receivable		—			252,500			—			—			(252,500	)		—
Investment in subsidiaries		33,263			—			57,827			—			(91,090	)		—
Other assets		3,550			7,398			18,720			589			—			30,257
Total assets	$	173,154		$	344,656		$	391,111		$	130,086		$	(568,803	)	$	470,204
Liabilities and stockholders’ equity (deficit)
Current liabilities:
Intercompany accounts payable	$	960		$	60,221		$	139,978		$	24,054		$	(225,213	)	$	—
Revolving loans		—			—			—			—			—			—
Accounts payable		1,373			1,953			26,729			9,700			—			39,755
Accrued expenses and other current liabilities		5,277			9,258			8,607			6,258			—			29,400
Total current liabilities		7,610			71,432			175,314			40,012			(225,213	)		69,155
Long-term debt, less current portion		—			201,187			16,700			—			—			217,887
Convertible subordinated notes		50,000			—			—			—			—			50,000
Intercompany loans payable		—			—			218,500			34,000			(252,500	)		—
Other long-term liabilities		—			—			17,618			—			—			17,618
Total liabilities		57,610			272,619			428,132			74,012			(477,713	)		354,660
Stockholders’ equity (deficit):
Common stock		941			—			—			—			—			941
Additional paid in capital		276,916			81,689			120,692			115,093			(317,474	)		276,916
Receivable from stockholders		(480	)		—			—			—			—			(480	)
Accumulated other comprehensive income		9,169			—			8,705			464			(9,169	)		9,169
Accumulated deficit		(171,002	)		(9,652	)		(166,418	)		(59,483	)		235,553			(171,002	)
Total Stockholders’ equity (deficit)		115,544			72,037			(37,021	)		56,074			(91,090	)		115,544
Total liabilities and stockholders’ equity (deficit)	$	173,154		$	344,656		$	391,111		$	130,086		$	(568,803	)	$	470,204

56

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF OPERATIONS

Year ended December 31, 2002

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non- Guarantor China			Eliminations			Consolidated
Revenue
Intercompany revenue	$	27,668		$	400		$	—		$	67,503		$	(95,571	)	$	—
Customer revenue		—			—			363,386			280			—			363,666
Revenue		27,668			400			363,386			67,783			(95,571	)		363,666
Cost of revenue		355			240			340,570			62,471			(95,571	)		308,065
Gross profit		27,313			160			22,816			5,312			—			55,601
Operating expenses:
Selling, general and administrative		22,666			212			11,397			3,884			—			38,159
Research and development		2,771			—			7,339			—			—			10,110
Restructuring, write down of impaired assets and other charges		—			—			(661	)		—			—			(661	)
Total operating expenses		25,437			212			18,075			3,884			—			47,608
Operating income (loss)		1,876			(52	)		4,741			1,428			—			7,993
Non-operating (income) expenses
Interest expense		4,401			26,931			28,509			3,318			(31,173	)		31,986
Interest income		(404	)		(30,828	)		(543	)		(24	)		31,173			(626	)
Loss from investment in Subsidiaries		26,735			—			2,088			—			(28,823	)		—
Foreign currency gains		—			—			973			56			—			1,029
Other (income) expense, net		(4	)		—			(358	)		(184	)		—			(546	)
Total non-operating expenses		30,728			(3,897	)		30,669			3,166			(28,823	)		31,843
Income (loss) before income taxes and extraordinary item		(28,852	)		3,845			(25,928	)		(1,738	)		28,823			(23,850	)
Provision for (benefit from) income taxes		3			150			1,497			350			—			2,000
Income (loss) before extraordinary item		(28,855	)		3,695			(27,425	)		(2,088	)		28,823			(25,850	)
Extraordinary item		—			3,005			—			—			—			3,005
Net income (loss)	$	(28,855	)	$	690		$	(27,425	)	$	(2,088	)	$	28,823		$	(28,855	)

57

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF CASH FLOWS

Year Ended December 31, 2002

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non- Guarantor China			Eliminations			Consolidated
Cash flows from operating activities:
Net income (loss)	$	(28,855	)	$	690		$	(27,425	)	$	(2,088	)	$	28,823		$	(28,855	)
Adjustments to reconcile net loss to net cash provided by (used in) operating activities:
Depreciation and amortization		1,448			240			43,608			13,653			—			58,949
Debt issuance cost amortization		380			1,901			—			—			—			2,281
Deferred taxes		—			—			(121	)		—			—			(121	)
Non operating extraordinary loss on early debt extinquishment		—			3,005			—			—			—			3,005
Foreign currency loss		—			—			973			56			—			1,029
(Gain) loss on sale of equipment		—			—			(88	)		38			—			(50	)
Equity loss from investment in subsidiaries		26,735			—			2,088			—			(28,823	)		—
Changes in assets and liabilities:
Intercompany accounts receivable		(57,071	)		16,848			(2,818	)		(4,697	)		47,738			—
Accounts receivable		13			11			(6,799	)		16			—			(6,759	)
Inventories		—			—			(2,413	)		(405	)		—			(2,818	)
Prepaid expenses and other current assets		(575	)		—			675			(870	)		—			(770	)
Other assets		304			—			(725	)		6			—			(415	)
Intercompany accounts payable		938			10,203			33,782			2,815			(47,738	)		—
Accounts payable		(808	)		1,204			5,114			3,200			—			8,710
Accrued expenses and other current liabilities		2,422			(2,064	)		779			425			—			1,562
Other long-term liabilities		—			—			3,854			(56	)		—			3,798
Net cash provided by (used in) operating activities		(55,069	)		32,038			50,484			12,093			—			39,546
Cash flows from investing activities:
Purchase of short-term investments		(39,699	)		—			—			—			—			(39,699	)
Proceeds from sale of short-term investments		29,699			—			—			—			—			29,699
Acquisition of intangible assets		(527	)		—			(2,768	)		(67	)		—			(3,362	)
Acquisition of property, plant and equipment		(218	)		(5,822	)		(57,246	)		(15,624	)		—			(78,910	)
Proceeds from sale of equipment		—			—			488			—			—			488
Malaysian acquisition, net of cash and cash equivalents acquired		—			—			(6,643	)		—			—			(6,643	)
Investment in subsidiaries		(100,000	)		—			(6,960	)		—			106,960			—
Net cash used in investing activities		(110,745	)		(5,822	)		(73,129	)		(15,691	)		106,960			(98,427	)
Cash flows from financing activities:
Proceeds from revolving loans		—			100,000			5,596			—			—			105,596
Repayment of revolving loans		—			(150,000	)		(5,596	)		—			—			(155,596	)
Net proceeds from long term debt		—			—			16,700			—			—			16,700
Increase in debt issuance costs		—			(703	)		—			—			—			(703	)
Intercompany loan payments		—			100,000			(100,000	)		—			—			—
Intercompany capital contributions		—			—			100,000			6,960			(106,960	)		—
Repayment of long-term debt		—			(82,440	)		—			—			—			(82,440	)
Repayment of notes from stockholders		505			—			—			—			—			505
Proceeds from common stock issuance		167,144			—			—			—			—			167,144
Repurchase of common stock		(24	)		—			—			—			—			(24	)
Net cash provided by financing activities		167,625			(33,143	)		16,700			6,960			(106,960	)		51,182
Net increase (decrease) in cash		1,811			(6,927	)		(5,945	)		3,362			—			(7,699	)
Cash and cash equivalents at beginning of year		1,842			17,093			20,939			1,998			—			41,872
Cash and cash equivalents at end of year	$	3,653		$	10,166		$	14,994		$	5,360		$	—		$	34,173

58

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED BALANCE SHEETS

December 31, 2001

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non- Guarantor China			Eliminations			Consolidated
Assets
Current assets:
Cash and cash equivalents	$	1,842		$	17,093		$	20,939		$	1,998		$	—		$	41,872
Intercompany accounts receivable		59,103			85,860			20,347			12,166			(177,476	)		—
Accounts receivable, net		30			11			31,961			32			—			32,034
Inventories		—			—			9,682			2,799			—			12,481
Prepaid expenses and other current assets		393			—			3,527			595			—			4,515
Total current assets		61,368			102,964			86,456			17,590			(177,476	)		90,902
Property, plant and equipment, net		6,054			—			198,161			100,435			—			304,650
Intercompany loans receivable		—			352,500			—			—			(352,500	)		—
Investment in subsidiaries		(40,002	)		—			49,171			—			(9,169	)		—
Other assets		4,319			11,694			18,402			748			—			35,163
Total assets	$	31,739		$	467,158		$	352,190		$	118,773		$	(539,145	)	$	430,715
Liabilities and stockholders’ equity (deficit)
Current liabilities:
Intercompany accounts payable	$	25		$	50,018		$	106,196		$	21,239		$	(177,478	)	$	—
Revolving loans		—			50,000			—			—			—			50,000
Accounts payable		2,181			749			21,615			6,500			—			31,045
Accrued expenses and other current liabilities		2,759			11,417			7,829			5,833			—			27,838
Total current liabilities		4,965			112,184			135,640			33,572			(177,478	)		108,883
Long-term debt, less current portion		—			283,627			—			—			—			283,627
Convertible subordinated notes		50,000			—			—			—			—			50,000
Intercompany loans payable		—			—			318,500			34,000			(352,500	)		—
Other long-term liabilities		—			—			11,431			—			—			11,431
Total liabilities		54,965			395,811			465,571			67,572			(529,978	)		453,941
Stockholders’ equity (deficit):
Common stock		694			—			—			—			—			694
Additional paid in capital		110,043			81,689			16,907			108,133			(206,729	)		110,043
Receivable from stockholders		(985	)		—			—			—			—			(985	)
Accumulated other comprehensive income		9,169			—			8,705			464			(9,169	)		9,169
Accumulated deficit		(142,147	)		(10,342	)		(138,993	)		(57,396	)		206,731			(142,147	)
Total Stockholders’ equity (deficit)		(23,226	)		71,347			(113,381	)		51,201			(9,167	)		(23,226	)
Total liabilities and stockholders’ equity (deficit)	$	31,739		$	467,158		$	352,190		$	118,773		$	(539,145	)	$	430,715

59

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF OPERATIONS

Year ended December 31, 2001

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non- Guarantor China			Eliminations			Consolidated
Revenue
Intercompany revenue	$	27,168		$	—		$	—		$	56,338		$	(83,506	)	$	—
Customer revenue		—			—			328,693			8			—			328,701
Revenue		27,168			—			328,693			56,346			(83,506	)		328,701
Cost of revenue		23			—			328,732			52,339			(83,506	)		297,588
Gross profit		27,145			—			(39	)		4,007			—			31,113
Operating expenses:
Selling, general and administrative		19,378			303			8,127			3,391			—			31,199
Research and development		4,364			—			9,859			—			—			14,223
Restructuring, write down of impaired assets and other charges		1,760			—			36,855			2,305			—			40,920
Total operating expenses		25,502			303			54,841			5,696			—			86,342
Operating income (loss)		1,643			(303	)		(54,880	)		(1,689	)		—			(55,229	)
Non-operating (income) expenses
Interest expense		2,249			34,963			31,065			3,440			(34,503	)		37,214
Interest income		(146	)		(34,523	)		(439	)		(83	)		34,503			(688	)
Loss from investment in Subsidiaries		89,413			—			4,983			—			(94,396	)		—
Foreign currency gains		—			—			(156	)		(31	)		—			(187	)
Other (income) expense, net		23			—			(401	)		(32	)		—			(410	)
Total non-operating expenses		91,539			440			35,052			3,294			(94,396	)		35,929
Loss before income taxes		(89,896	)		(743	)		(89,932	)		(4,983	)		94,396			(91,158	)
Provision for (benefit from) income taxes		3,840			1,104			(2,366	)		—			—			2,578
Net loss	$	(93,736	)	$	(1,847	)	$	(87,566	)	$	(4,983	)	$	94,396		$	(93,736	)

60

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF CASH FLOWS

Year Ended December 31, 2001

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non-Guarantor China			Eliminations			Consolidated
Cash flows from operating activities:
Net loss	$	(93,736	)	$	(1,847	)	$	(87,566	)	$	(4,983	)	$	94,396		$	(93,736	)
Adjustments to reconcile net loss to net cash provided by (used in) operating activities:
Depreciation and amortization		1,821			—			48,211			9,877			—			59,909
Debt issuance cost amortization		160			1,952			—			—			—			2,112
Deferred tax		1,636			—			—			—			—			1,636
Write down of impaired assets		—			—			32,383			2,305			—			34,688
Foreign currency gains		—			—			(156	)		(31	)		—			(187	)
(Gain) loss on sale of equipment		112			—			(116	)		3			—			(1	)
Equity income from investment in subsidiaries		89,413			—			4,983			—			(94,396	)		—
Changes in assets and liabilities:
Intercompany accounts receivable		(51,042	)		(66,805	)		5,039			(3,862	)		116,670			—
Accounts receivable		15			(12	)		13,879			(12	)		—			13,870
Inventories		—			—			8,190			579			—			8,769
Prepaid expenses and other current assets		14			—			(212	)		2,403			—			2,205
Other assets		465			—			2,973			(572	)		—			2,866
Intercompany accounts payable		22			47,529			75,360			(6,241	)		(116,670	)		—
Accounts payable		1,172			749			(25,638	)		99			—			(23,618	)
Accrued expenses and other current liabilities		3,332			1,951			(17,649	)		447			—			(11,919	)
Other long-term liabilities		(240	)		—			(162	)		(108	)		—			(510	)
Net cash provided by (used in) operating activities		(46,856	)		(16,483	)		59,519			(96	)		—			(3,916	)
Cash flows from investing activities:
Acquisition of intangible assets		—			—			(6,156	)		—			—			(6,156	)
Acquisition of property, plant and equipment		(4,847	)		—			(29,968	)		(11,577	)		—			(46,392	)
Proceeds from sale of equipment		1,731			—			8,162			(8,928	)		—			965
Malaysian acquisition, net of cash and cash equivalents acquired		—			—			(7,399	)		—			—			(7,399	)
Investment in subsidiaries		—			—			(18,540	)		—			18,540			—
Net cash used in investing activities		(3,116	)		—			(53,901	)		(20,505	)		18,540			(58,982	)
Cash flows from financing activities:
Proceeds from revolving loans		—			84,633			—			—			—			84,633
Repayment of revolving loans		—			(49,234	)		—			—			—			(49,234	)
Net proceeds from long term debt		51,340			27,745			—			—			—			79,085
Increase in debt issuance costs		(4,520	)		—			—			—			—			(4,520	)
Intercompany loan payments		—			—			—			18,540			(18,540	)		—
Repayment of long-term debt		—			(28,857	)		—			—			—			(28,857	)
Repayment of notes from stockholders		520			—			—			—			—			520
Proceeds from common stock issuance		4,312			—			—			—			—			4,312
Repurchase of common stock		(19	)		—			—			—			—			(19	)
Net cash provided by financing activities		51,633			34,287			—			18,540			(18,540	)		85,920
Net increase (decrease) in cash		1,661			17,804			5,618			(2,061	)		—			23,022
Cash and cash equivalents at beginning of year		181			(711	)		15,321			4,059			—			18,850
Cash and cash equivalents at end of year	$	1,842		$	17,093		$	20,939		$	1,998		$	—		$	41,872

61

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF OPERATIONS

Year ended December 31, 2000

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non-Guarantor China			Eliminations			Consolidated
Revenue
Intercompany revenue	$	28,827		$	—		$	403,796		$	53,813		$	(486,436	)	$	—
Customer revenue		—			—			494,408			3			—			494,411
Revenue		28,827			—			898,204			53,816			(486,436	)		494,411
Cost of revenue		—			—			796,639			45,289			(456,661	)		385,267
Gross profit		28,827			—			101,565			8,527			(29,775	)		109,144
Operating expenses:
Selling, general and administrative		24,550			(8	)		38,927			1,105			(29,775	)		34,799
Research and development		5,562			—			6,453			—			—			12,015
Total operating expenses (income)		30,112			(8	)		45,380			1,105			(29,775	)		46,814
Operating income (loss)		(1,285	)		8			56,185			7,422			—			62,330
Non-operating (income) expense
Interest expense		—			39,425			58,147			3,440			(61,580	)		39,432
Interest income		(257	)		(30,587	)		(31,504	)		(75	)		61,580			(843	)
Income from investment in
Subsidiaries		(17,107	)		—			(4,512	)		—			21,619			—
Foreign currency (gains) loss		126			—			(1,839	)		(455	)		—			(2,168	)
Other (income) expenses, net		7,849			—			—			—			—			7,849
Total non-operating (income) expense		(9,389	)		8,838			20,292			2,910			21,619			44,270
Income (loss) before income taxes		8,104			(8,830	)		35,893			4,512			(21,619	)		18,060
Provision for (benefit from) income taxes		(3,952	)		323			7,243			—			—			3,614
Income (loss) before extraordinary item		12,056			(9,153	)		28,650			4,512			(21,619	)		14,446
Extraordinary item:
Loss from early extinguishment of debt, net of related income tax benefit		—			2,390			—			—			—			2,390
Net income (loss)	$	12,056		$	(11,543	)	$	28,650		$	4,512		$	(21,619	)	$	12,056

62

ChipPAC, Inc.

SUPPLEMENTAL CONSOLIDATING CONDENSED STATEMENTS OF CASH FLOWS

Year Ended December 31, 2000

(In thousands)

	Parent Guarantor CPI			Issuer CP Int’l			Other Guarantors			Non-  Guarantor China			Eliminations			Consolidated
Cash flows from operating activities:
Net income (loss)	$	12,056		$	(11,543	)	$	28,650		$	4,512		$	(21,619	)	$	12,056
Adjustments to reconcile net income (loss) to net cash provided by (used in) operating activities:
Depreciation and amortization		2,281			—			34,073			8,695			—			45,049
Debt issuance cost amortization		—			1,950			—			—			—			1,950
Deferred tax		(3,712	)		—			5,741			—			—			2,029
Non-operating extraordinary loss on early debt extinguishment		—			2,390			—			—			—			2,390
Non-cash termination fees		4,400			—			—			—			—			4,400
Foreign currency (gains) loss		126			—			(1,839	)		(455	)		—			(2,168	)
(Gain) loss on sale of equipment		—			—			75			(168	)		—			(93	)
Equity income from investment in subsidiaries		(17,107	)		—			(4,512	)		—			21,619			—
Changes in assets and liabilities:
Intercompany accounts receivable		(1,381	)		(9,222	)		11,598			11,957			(12,952	)		—
Accounts receivable		(73	)		—			(3,446	)		—			—			(3,519	)
Inventories		—			—			3,057			(3,212	)		—			(155	)
Prepaid expenses and other current assets		(177	)		—			(1,431	)		(2,726	)		—			(4,334	)
Other assets		417			1,922			(16,145	)		(242	)		—			(14,048	)
Intercompany accounts payable		—			—			2,161			(3,611	)		1,450			—
Accounts payable		(242	)		(40	)		(6,966	)		4,749			—			(2,499	)
Accrued expenses and other current liabilities		1,878			(262	)		(1,438	)		1,681			—			1,859
Other long-term liabilities		(240	)		—			3,537			—			—			3,297
Net cash provided by (used in) operating activities		(1,774	)		(14,805	)		53,115			21,180			(11,502	)		46,214
Cash flows from investing activities:
Acquisition of property, plant and equipment		—			—			(69,557	)		(23,617	)		—			(93,174	)
Proceeds from sale of equipment		—			—			16,415			1,134			—			17,549
Malaysian acquisition, net of cash and cash equivalents acquired		—			—			(54,835	)		—			—			(54,835	)
Investment in subsidiaries		(72,030	)		65,120			(4,592	)		—			11,502			—
Net cash provided by (used in) investing activities		(72,030	)		65,120			(112,569	)		(22,483	)		11,502			(130,460	)
Cash flows from financing activities:
Advances to affiliates		(434	)		—			—			—			—			(434	)
Proceeds from revolving loans		—			45,600			—			—			—			45,600
Repayment of revolving loans		—			(37,800	)		—						—			(37,800	)
Net proceeds from long-term debt		—			(9,800	)		73,460			—			—			63,660
Intercompany loan (advances) payments		—			(52,500	)		52,500			—			—			—
Repayment of long-term debt		—			—			(73,460	)		—			—			(73,460	)
Repayment of notes from stockholders		185			—			—			—			—			185
Proceeds from common stock issuance		152,578			—			—			—			—			152,578
Repurchase of common stock		(40	)		—			—			—			—			(40	)
Redemption of Class B preferred stock		(79,310	)		—			—			—			—			(79,310	)
Net cash provided by (used in) financing activities		72,979			(54,500	)		52,500			—			—			70,979
Net decrease in cash		(825	)		(4,185	)		(6,954	)		(1,303	)		—			(13,267	)
Cash and cash equivalents at beginning of year		1,006			3,474			22,275			5,362			—			32,117
Cash and cash equivalents at end of year	$	181		$	(711	)	$	15,321		$	4,059		$	—		$	18,850

63

ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURES

Not Applicable.

PART III

ITEM 10. DIRECTORS AND EXECUTIVE OFFICERS OF THE REGISTRANT.

The information required by this item with respect to directors and executive officers is incorporated by reference to ChipPac’s proxy statement for the 2003 annual meeting of stockholders, or our “2003 Proxy Statement.”

ITEM 11. EXECUTIVE COMPENSATION

The information appearing under the captions “Director Compensation” and “Executive Compensation” (including all related sub-captions thereof) in the 2003 Proxy Statement is incorporated herein by reference. The Company does not incorporate by reference in this Form 10-K either the “Compensation Committee Report on Executive Compensation” or the “Performance Graph” sections of the 2003 Proxy Statement.

ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT

The information required by this item is incorporated by reference to the section captioned “Principal Stockholders” contained in the 2003 Proxy Statement.

ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS

The information required by this item is incorporated by reference to the sections captioned “Compensation Committee Interlocks and Insider Participation” and “Certain Relationships and Related Transactions” in the 2003 Proxy Statement.

ITEM 14. CONTROLS AND PROCEDURES

At the beginning of the third quarter, in response to recent legislation and additional requirements, we reviewed our internal control structure and our disclosure of 2002 controls and procedures. As a result of this review we implemented minor changes, primarily to formalize and document the procedures already in place. We have designed our disclosure controls and procedures to ensure that material information related to ChipPAC, Inc. (including our consolidated subsidiaries) is made known to our disclosure committee, including our Chief Financial Officer, General Counsel and Chief Accounting Officer on a regular basis, in particular during the period in which the quarterly reports are being prepared. As required, we will evaluate the effectiveness of these disclosure controls and procedures on a quarterly basis, and we did so within 90 days prior to the filing of this annual report. We believe as of that date, such controls and procedures were operating effectively as designed.

We presented the results of our most recent evaluation to the Audit Committee of our Board of Directors. Based on this evaluation, the Company’s management, including the Chief Executive Officer and Chief Financial Officer, concluded that the Company’s disclosure controls and procedures are adequate to ensure the clarity and material completeness of the Company’s disclosures in its periodic reports required to be filed with the SEC and there are no significant deficiencies in the design or operation of internal controls which could significantly affect our ability to record, process, summarize and report financial data. There have not been any significant changes in internal controls, or in factors that could significantly affect internal controls, subsequent to the date the Chief Executive Officer and Chief Financial Officer completed their evaluation. Certifications of the Chief Executive Officer and Chief Financial Officer regarding, among other items, disclosure controls and procedures are included immediately after the Signatures section of this annual report.

ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES AND REPORTS ON FORM 8-K

(a) The following documents are filed as part of this report

(1) Financial Statements. See the “Index to Financial Statements” in item 8.

(2) Financial Statement Schedules. See the schedule captioned “Valuation and Qualifying Accounts”.

64

Report of Independent Accountants on

Financial Statement Schedule

To the Board of Directors of ChipPAC, Inc.:

Our audits of the consolidated financial statements referred to in our report dated January 28, 2003 appearing in this Annual Report on Form 10-K of ChipPAC, Inc. also included an audit of the financial statement schedule listed in Item 15(a)(2) of this Form 10-K. In our opinion, this financial statement schedule presents fairly, in all material respects, the information set forth therein when read in conjunction with the related consolidated financial statements.

/s/ PricewaterhouseCoopers LLP

San Jose, California

January 28, 2003

65

CHIPPAC, INC.

SCHEDULE II—VALUATION AND QUALIFYING ACCOUNTS

Year ended December 31,	Balance at Beginning of Year		Additions Charged to Costs and Expenses		Deductions			Balance at End of Year
	(in thousands)
2002
Allowance for Doubtful Receivables	$	449	$	36	$	(94	)	$	391
2001
Allowance for Doubtful Receivables		972		—		(523	)		449
2000
Allowance for Doubtful Receivables		1,196		—		(224	)		972

(3) Exhibits.

2.1	Amended and Restated Agreement and Plan of Merger of ChipPAC, Inc., a California corporation, and ChipPAC, Inc., a Delaware corporation.**
2.2	Agreement and Plan of Recapitalization and Merger, dated as of March 13, 1999, by and among Hyundai Electronics Industries Co., Ltd., Hyundai Electronics America, ChipPAC, Inc. and ChipPAC Merger Corp.*
2.3	First Amendment to Agreement and Plan of Recapitalization and Merger, dated as of June 16, 1999 by and among Hyundai Electronics Industries Co., Ltd., Hyundai Electronics America, ChipPAC, Inc. and ChipPAC Merger Corp.*
2.4	Second Amendment to Agreement and Plan of Recapitalization and Merger, dated as of August 5, 1999, by and among Hyundai Electronics Industries Co., Ltd., Hyundai Electronics America, ChipPAC, Inc. and ChipPAC Merger Corp.*
3.1	Amended and Restated Certificate of Incorporation of ChipPAC, Inc.**
3.2	Amended and Restated By-Laws of ChipPAC, Inc.**
4.1	Specimen certificate for ChipPAC, Inc. Common Stock.**
10.1	Credit Agreement, dated as of August 5, 1999, as amended and restated as of June 30, 2000, by and among ChipPAC International Company Limited, ChipPAC, Inc., the Lenders listed therein and Credit Suisse First Boston, as Administrative Agent, Sole Lead Manager and Collateral Agent.*
10.2	Guaranty, dated as of August 5, 1999, by and among ChipPAC, Inc. and certain subsidiaries of ChipPAC, Inc., in favor of Credit Suisse First Boston (incorporated by reference to Exhibit 4.5 of the Company’s registration statement on Form S-3 (Registration No. 333-69704)).
10.3	Amendment No. 1 to Amended and Restated Credit Agreement, dated as of March 13, 2001, by and among ChipPAC International Company Limited, ChipPAC, Inc., the Lenders listed therein and Credit Suisse First Boston, as Administrative Agent, Sole Lead Manager and Collateral Agent (incorporated by reference to Exhibit 10.1 to the Company’s quarterly report on Form 10-Q for the period ended June 30, 2002 (No. 000-31173)).

66

10.4	Amendment No. 2 to Amended and Restated Credit Agreement, as amended, dated as of December 31, 2001 by and among ChipPAC International Company Limited, ChipPAC, Inc., the Lenders listed therein and Credit Suisse First Boston, as Administrative Agent and Collateral Agent (incorporated by reference to Exhibit 10.1 to the Company’s quarterly report on Form 10-Q for the period ended June 30, 2001 (No. 000-31173)).
10.5	Amendment No. 3 to Amended and Restated Credit Agreement, as amended, dated as of December 31, 2001 by and among ChipPAC International Company Limited, ChipPAC, Inc., the Lenders listed therein and Credit Suisse First Boston, as Administrative Agent and Collateral Agent (incorporated by reference to Exhibit 10.1 to the Company’s current report on Form 8-K (No. 000-31173)).
10.6	Amendment No. 4 to Amended and Restated Credit Agreement, as amended, dated as of May 17, 2002 by and among ChipPAC International Company Limited, ChipPAC, Inc, the Lenders listed therein and Credit Suisse First Boston, as Administrative Agent and Collateral Agent (incorporated by reference to the Company’s quarterly report on Form 10-Q for the period ended September 30, 2002).
10.7	Subsidiary Guaranty Agreement, dated as of August 5, 1999, by and among ChipPAC Korea Company Ltd., ChipPAC Limited, ChipPAC (Barbados) Ltd., ChipPAC Luxembourg S.a.R.L., ChipPAC Liquidity Management Hungary Limited Liability Company and ChipPAC International Company Limited, in favor of Firstar Bank of Minnesota, N.A.*
10.7.1	Subsidiary Guaranty Agreement, dated as of October 12, 2001, by ChipPAC Malaysia Sdn. Bhd, in favor of U.S. Bank, N.A. (incorporated by reference to Exhibit 4.7 of the Company’s registration statement on Form S-3 (Registration No. 333-69704)).
10.8	Amended and Restated Registration Agreement, dated as of August 5, 1999, by and among ChipPAC, Inc. the Hyundai Group (as defined therein), the Bain Group (as defined therein), the SXI Group (as defined therein), Intel Corporation, ChipPAC Equity Investors LLC, and Sankaty High Yield Asset Partners, L.P.*
10.8.1	Amendment No. 1 to Amended and Restated Registration Agreement, dated as of June 30, 2000, by and among ChipPAC, Inc., Sapphire Worldwide Investments, Inc., the Bain Stockholders (as defined therein) and SXI Group LLC.**
10.8.2	Form of Amendment No. 2 to Amended and Restated Registration Agreement, dated as of July 13, 2000, by and among ChipPAC, Inc., Qualcomm Incorporated, SXI Group LLC and the Bain Shareholders (as defined therein).**
10.8.3	Form of Amendment No. 3 to Amended and Restated Registration Agreement, dated as of August 2, 2000, by and among ChipPAC, Inc., Bain Capital, Inc., SXI Group LLC and the Bain Shareholders (as defined therein).**
10.9	Transition Services Agreement, dated as of August 5, 1999, by and among Hyundai Electronics Industries Co., Ltd., Hyundai Electronics America, ChipPAC, Inc., ChipPAC Korea Company Ltd., Hyundai Electronics Company (Shanghai) Ltd., ChipPAC Assembly and Test (Shanghai) Company Ltd., ChipPAC Barbados Limited and ChipPAC Limited.*
10.10	Lease Agreement, dated as of June 30, 1998, by and between Hyundai Electronics Industries Co., Ltd. and ChipPAC Korea Ltd.*
10.10.1	Amendment Agreement, dated September 30, 1998, to Lease Agreement, dated June 30, 1998, by and between Hyundai Electronics Industries Co., Ltd. and ChipPAC Korea Ltd.*
10.10.2	Amendment Agreement 2, dated September 30, 1999, to Lease Agreement, dated June 30, 1998, by and between Hyundai Electronics Industries Co., Ltd. and ChipPAC Korea Ltd.*
10.11	Agreement Concerning Supply of Utilities, Use of Welfare Facilities and Management Services for Real Estate, dated as of June 30, 1998, by and between Hyundai Electronics Industries Co., Ltd. and ChipPAC Korea Ltd.*
10.12	Service Agreement, dated as of August 5, 1999, by and between Hyundai Electronics Industries Co., Ltd. and ChipPAC Limited.+*
10.13	Sublease Agreement, dated as of May 1, 1998, by and between Hyundai Electronics America and ChipPAC, Inc.*

67

10.14	Employment letter agreement, dated as of January 10, 2003 between ChipPAC, Inc. and Robert Krakauer.++
10.15	Employment letter agreement, dated as of January 13, 2003 between ChipPAC, Inc. and Patricia McCall ..++
10.16	Employment Agreement, dated as of October 1, 1999, between ChipPAC, Inc. and Dennis McKenna.*++
10.17	ChipPAC, Inc. 1999 Stock Purchase and Option Plan.* ++
10.18	ChipPAC, Inc. 2000 Equity Incentive Plan.** ++
10.19	ChipPAC, Inc. 2000 Employee Stock Purchase Plan.** ++
10.21	Form of Key Employee Purchased Stock Agreement.* ++
10.21.1	Form of Key Employee Purchased Stock Agreement (with Loan).* ++
10.22	Form of Employee Restricted Stock Agreement.* ++
10.23	Form of Directors Tranche I Stock Option Agreement.* ++
10.24	Form of Employees Tranche I Stock Option Agreement.* ++
10.25	Form of Tranche II Stock Option Agreement.* ++
10.26	Indenture, dated as of July 29, 1999, by and among ChipPAC International Limited, ChipPAC Merger Corp. and Firstar Bank of Minnesota, N.A., as trustee.*
10.27	First Supplemental Indenture, dated as of August 5, 1999, by and among ChipPAC International Company Limited, ChipPAC, Inc. and Firstar Bank of Minnesota, N.A., as trustee.*
10.28	12.75% Senior Subordinated Notes Due 2009.*
10.29	Form of Series B 12.75% Senior Subordinated Notes Due 2009.*
10.30	Intellectual Property Rights Agreement, entered into as of June 30, 2000, by and between Intersil Corporation and ChipPAC Limited.**
10.31	Supply Agreement, entered into as of June 30, 2000, by and between Intersil Corporation and ChipPAC Limited.**
10.32	Shareholders Agreement, dated as of June 30, 2000, by and among ChipPAC, Inc., the Bain Group (as defined therein), the SXI Group (as defined therein) and Sapphire Worldwide Investments, Inc.**
10.33	Class A Common Stock Purchase Agreement, dated as of July 13, 2000, by and between ChipPAC, Inc. and Qualcomm Incorporated.**
10.34	Promissory Note, dated as of August 2, 2000 by and between Dennis McKenna and ChipPAC, Inc.**
10.35	Promissory Note, dated as of August 2, 2000, by and between Robert Krakauer and ChipPAC, Inc.**
10.36	Employment letter agreement, dated as of November 15, 1999 between ChipPAC, Inc. and Robert Krakauer (incorporated by reference to the Company’s annual report on Form 10-K for the period December 31, 2000).++

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10.37	Employment letter agreement, dated as of October 4, 2000 between ChipPAC, Inc. and Richard Freeman (incorporated by reference to the Company’s annual report on Form 10-K for the year ended December 31, 2001). ++
10.38	Employment letter agreement, dated as of October 9, 2000 between ChipPAC, Inc. and Patricia McCall (incorporated by reference to the Company’s annual report on Form 10-K for the year ended December 31, 2001). ++
10.39	Indenture, dated as of June 15, 2001, by and between ChipPAC, Inc. and Firstar Bank, N.A. as trustee (incorporated by reference to the Company’s quarterly report on Form 10-Q for the period ended June 30, 2001).
10.40	Registration Rights Agreement, dated June 22, 2001, by and between ChipPAC International Company Limited and Citicorp Capital Investors Limited (incorporated by reference to the Company’s quarterly report on Form 10-Q for the period ended June 30, 2001).
10.41	Registration Rights Agreement, dated June 22, 2001, by and between ChipPAC, Inc. and Citicorp Mezzanine III, L.P. (incorporated by reference to the Company’s quarterly report on Form 10-Q for the period ended June 30, 2001).
10.42	Patent and Technology License Agreement, dated as of August 5, 1999, by and between Hyundai Electronics Industries, Co., Ltd. and ChipPAC Limited (incorporated by reference to the Company’s annual report on Form 10-K for the year ended December 31, 2001). +
21.1	Subsidiaries of ChipPAC, Inc., ChipPAC International Company Limited, ChipPAC (Barbados) Ltd., ChipPAC Limited, ChipPAC Liquidity Management Limited Liability Company, ChipPAC Luxembourg S.a.R.L. and ChipPAC Korea Company Ltd. (incorporated by reference to the Company’s quarterly report on Form 10-Q for the period ended on June 30, 2002).
23.1	Consent of PricewaterhouseCoopers LLP.
99.1	Risk Factors.
99.2	Certification of Principal Executive Officer Pursuant to Section 906 of the Sarbanes-Oxley Act of 2002.
99.3	Certification of Principal Financial Officer Pursuant to Section 906 of the Sarbanes-Oxley Act of 2002.

* Incorporated by reference to the Company’s Form S-4 (No. 333-91641).

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** Incorporated by reference to the Company’s Form S-1 (No. 333-39428).

+ Confidential treatment has been granted as to certain portions of these exhibits, which are incorporated by reference.

++ Denotes management contract or compensatory plan or arrangement required to be filed as an Exhibit to this Form 10-K.

(b) Reports on Form 8-K.

None

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SIGNATURES

Pursuant to the requirements of Section 13 or 15(d) of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized, as of March 31, 2003.

CHIPPAC, INC.

(Registrant)

/s/    ROBERT KRAKAUER

Robert Krakauer

Senior Vice President and Chief Financial Officer

/s/    MICHAEL G. POTTER

Michael G. Potter

Vice President, Controller and Principal Accounting Officer

Pursuant to the requirements of the Securities Exchange Act of 1934, this report has been signed below by the following persons on behalf of the registrant and in the capacities and on the dates indicated.

POWER OF ATTORNEY

KNOW ALL MEN BY THESE PRESENTS, that each person whose signature appears below constitutes and appoints Dennis P. McKenna, Robert Krakauer and Michael G. Potter, and each of them, his true and lawful attorneys-in-fact and agents, with full power of substitution and resubstitution, for him and in his name, place and stead, in any and all capacities, to sign any or all amendments to this annual report on Form 10-K under the Securities Exchange Act of 1934, as amended, and to file the same, with all exhibits thereto, and other documents in connection therewith, with the Securities and Exchange Commission, granting unto said attorneys-in-fact and agents, and each of them, full power and authority to do and perform each and every act and thing requisite and necessary to be done in and about the premises, as fully to all intents and purposes as he might or could do in person, hereby ratifying and confirming all that said attorneys-in-fact and agents or any of them, or their or his substitute or substitutes, may lawfully do or cause to be done by virtue hereof.

Signature	Title	Date
/s/     DENNIS P. MCKENNA         Dennis P. McKenna	President, Chief Executive Officer and Director (Principal Executive Officer)	March 31, 2003
/s/     ROBERT J. KRAKAUER         Robert J. Krakauer	Senior Vice President and Chief Financial Officer (Principal Financial Officer)	March 31, 2003
/s/    MICHAEL G. POTTER         Michael G. Potter	Vice President and Controller (Principal Accounting Officer)	March 31, 2003
/s/    EDWARD CONARD         Edward Conard	Director	March 31, 2003
/s/    ROBERT CONN         Robert Conn	Director	March 31, 2003
/s/    MICHAEL A. DELANEY         Michael A. Delaney	Director	March 31, 2003
/s/    MARSHALL HAINES         Marshall Haines	Director	March 31, 2003
/s/    DOUGLAS NORBY         Douglas Norby	Director	March 31, 2003
/s/    CHONG SUP PARK         Chong Sup Park	Director	March 31, 2003
/s/    PAUL C. SCHORR, IV         Paul C. Schorr, IV	Director	March 31, 2003

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CERTIFICATION

CHIPPAC, INC.

CERTIFICATION OF PRINCIPAL EXECUTIVE OFFICER PURSUANT TO SECTION 302

OF THE SARBANES-OXLEY ACT OF 2002

I, Dennis P. McKenna, the Chief Executive Officer of ChipPAC, Inc. (the “registrant”), certify that:

1. I have reviewed this annual report on Form 10-K for the period ended December 31, 2002 of ChipPAC, Inc.;

2. Based on my knowledge, this annual report does not contain any untrue statement of a material fact or omit to state a material fact necessary to make the statements made, in light of the circumstances under which such statements were made, not misleading with respect to the period covered by this annual report;

3. Based on my knowledge, the financial statements, and other financial information included in this annual report, fairly present in all material respects the financial condition, results of operations and cash flows of the registrant as of, and for, the periods presented in this annual report;

4. Robert Krakauer, the registrant’s other certifying officer, and I are responsible for establishing and maintaining disclosure controls and procedures (as defined in Exchange Act Rules 13a-14 and 15d-14) for the registrant and we have:

a. designed such disclosure controls and procedures to ensure that material information relating to the registrant, including its consolidated subsidiaries, is made known to us by others within those entities, particularly during the period in which this annual report is being prepared;

b. evaluated the effectiveness of the registrant’s disclosure controls and procedures as of a date within 90 days prior to the filing date of this annual report (the “Evaluation Date”); and

c. presented in this annual report our conclusions about the effectiveness of the disclosure controls and procedures based on our evaluation as of the Evaluation Date;

5. Robert Krakauer, the registrant’s other certifying officer, and I have disclosed, based on our most recent evaluation, to the registrant’s auditors and the audit committee of registrant’s board of directors (or persons performing the equivalent function):

a. all significant deficiencies in the design or operation of internal controls which could adversely affect the registrant’s ability to record, process, summarize and report financial data and have identified for the registrant’s auditors any material weaknesses in internal controls; and

b. any fraud, whether or not material, that involves management or other employees who have a significant role in the registrant’s internal controls; and

6. Robert Krakauer, the registrant’s other certifying officer, and I have indicated in this annual report whether or not there were significant changes in internal controls or in other factors that could significantly affect internal controls subsequent to the date of our most recent evaluation, including any corrective actions with regard to significant deficiencies and material weaknesses.

March 31, 2003

/s/    DENNIS P. MCKENNA

Dennis P. McKenna

Chief Executive Officer

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CHIPPAC, INC.

CERTIFICATION OF PRINCIPAL FINANCIAL OFFICER PURSUANT TO SECTION 302

OF THE SARBANES-OXLEY ACT OF 2002

I, Robert Krakauer, the Chief Financial Officer of ChipPAC, Inc. (the “registrant”), certify that:

1. I have reviewed this annual report on Form 10-K for the period ended December 31, 2002 of ChipPAC, Inc.;

2. Based on my knowledge, this annual report does not contain any untrue statement of a material fact or omit to state a material fact necessary to make the statements made, in light of the circumstances under which such statements were made, not misleading with respect to the period covered by this annual report;

3. Based on my knowledge, the financial statements, and other financial information included in this annual report, fairly present in all material respects the financial condition, results of operations and cash flows of the registrant as of, and for, the periods presented in this annual report;

4. Dennis P. McKenna, the registrant’s other certifying officer, and I are responsible for establishing and maintaining disclosure controls and procedures (as defined in Exchange Act Rules 13a-14 and 15d-14) for the registrant and we have:

a. designed such disclosure controls and procedures to ensure that material information relating to the registrant, including its consolidated subsidiaries, is made known to us by others within those entities, particularly during the period in which this annual report is being prepared;

b. evaluated the effectiveness of the registrant’s disclosure controls and procedures as of a date within 90 days prior to the filing date of this annual report (the “Evaluation Date”); and

c. presented in this annual report our conclusions about the effectiveness of the disclosure controls and procedures based on our evaluation as of the Evaluation Date;

5. Dennis P. McKenna, the registrant’s other certifying officer, and I have disclosed, based on our most recent evaluation, to the registrant’s auditors and the audit committee of registrant’s board of directors (or persons performing the equivalent function):

a. all significant deficiencies in the design or operation of internal controls which could adversely affect the registrant’s ability to record, process, summarize and report financial data and have identified for the registrant’s auditors any material weaknesses in internal controls; and

c. any fraud, whether or not material, that involves management or other employees who have a significant role in the registrant’s internal controls; and

6. Dennis P. McKenna, the registrant’s other certifying officer, and I have indicated in this annual report whether or not there were significant changes in internal controls or in other factors that could significantly affect internal controls subsequent to the date of our most recent evaluation, including any corrective actions with regard to significant deficiencies and material weaknesses.

March 31, 2003

/s/     ROBERT KRAKAUER

Robert Krakauer

Chief Financial Officer

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EX-10.14

Exhibit 10.14

January 10, 2003

Mr. Robert Krakauer

7851 Perry Lane

Pleasanton, CA 94588

Dear Bob:

On behalf of ChipPAC Inc., I am pleased to confirm your compensation increase. You will continue in your position of Senior Vice President and Chief Financial Officer, reporting to Dennis McKenna, President and Chief Executive Officer.

In this position, your increased compensation will include:

• Effective January 1, 2003, an annual base salary of $275,000 (two hundred seventy-five thousand dollars) to be paid on a semi-monthly basis.

• You will continue to participate in the Short Term Incentive (STI) Plan with a revised target payout rate of 80% of your annual base salary. This revised rate will be effective January 1, 2003. The payout will be in accordance with the plan guidelines as established each year.

ChipPAC continues to recognize the traditional Employment-At-Will doctrine between an employer and an employee, which means that either party has the right to terminate the employment relationship at any time with or without cause or notice. Similarly, we both agree that any dispute arising with respect to your employment, the termination of that employment, including any alleged breach of contract claims or breach of covenant of good faith and fair dealing related to your employment at ChipPAC shall be settled by binding arbitration in accordance with the rules of the American Arbitration Association.

This letter and the Agreement of November 15, 1999 contain the entire agreement with respect to your employment and supersede any other agreements regarding your employment status. No ChipPAC representative, with the exception of ChipPAC’s President or Human Resources has any authority to modify or enter into an agreement or modification, express or implied, contrary to the foregoing.

Sincerely,

/s/    Connie Fredrickson-Bray

Vice President, Human Resources

EX-10.15

Exhibit 10.15

January 13, 2003

Ms. Patricia H. McCall

10350 Magdalena Road

Los Altos Hills, CA 94024

Dear Pat:

On behalf of ChipPAC Inc., this is to confirm the change in your position responsibilities and compensation. Effective January 1, 2003, your position will be that of Senior Vice President, General Counsel and Secretary to our BOD, reporting to Dennis McKenna, President and Chief Executive Officer.

In this position, your revised compensation will be as follows:

• An annual base salary of $225,000 (two hundred twenty-five thousand dollars) to be paid on a semi-monthly basis.

All other provisions remain as agreed in the previous letter Agreement dated October 9, 2000. ChipPAC continues to recognize the traditional Employment-At-Will doctrine between an employer and an employee, which means that either party has the right to terminate the employment relationship at any time with or without cause or notice. Similarly, we both agreed that any dispute arising with respect to your employment, the termination of that employment, including any alleged breach of contract claims or breach of covenant of good faith and fair dealing related to your employment at ChipPAC shall be settled by binding arbitration in accordance with the rules of the American Arbitration Association.

This letter and the Agreement of October 9, 2000 contain the entire agreement with respect to your employment and supersede any other agreements regarding your employment status. No ChipPAC representative, with the exception of ChipPAC’s President or Human Resources has any authority to modify or enter into an agreement or modification, express or implied, contrary to the foregoing.

Sincerely,

/s/    Connie Fredrickson-Bray

Vice President, Human Resources

EX-23.1

Exhibit 23.1

Consent of Independent Accountants

We hereby consent to the incorporation by reference in the Registration Statements on Form S-8 No. (333-54628) and Form S-3 No. (333-69704 and 333-73674) of ChipPAC, Inc. of our reports dated January 28, 2003, relating to the financial statements and financial statement schedule, which appear in this Form 10-K.

/s/ PricewaterhouseCoopers LLP

San Jose, California

March 31, 2003

EX-99.1

Exhibit 99.1

CHIPPAC, INC.

RISK FACTORS

You should carefully consider the following factors in addition to the other information set forth in this document in analyzing an investment in the Class A common stock, 12 ³/4% senior subordinated notes or 8% convertible subordinated notes of ChipPAC, Inc. We believe that the risks and uncertainties described below are the current material risks facing us. If any of the following risks actually occur, our business, financial condition or results of operations will likely suffer. In that case, the trading price of our publicly traded Class A common stock, 12 ³/4% senior subordinated notes or 8% convertible subordinated notes could fall and you may lose all or part of the money you invested.

Risks Related to Our Business

Our operating results for the year ended December 31, 2002 improved from the year ended December 31, 2001, but we are still operating at a loss.

Our revenue, gross margins and operating income for the year ended December 31, 2002 increased as compared to the year ended December 31, 2001. Our net loss for the year ended December 31, 2002 has decreased from the net loss for the year ended December 31, 2001 as a result of increased revenue and better gross margin. Our revenue for the year ended December 31, 2002 was $363.7 million, compared to $328.7 million in the year 2001. The increase is attributable to the growth in our substrate and test product lines as a result of the combination of higher end-market demand for our customers’ products and new customer and program wins in the year 2002 as compared to 2001. Also, our gross margin as a percentage of revenue grew from 9.5% in 2001 to 15.3% in 2002, due to cost cutting measures we implemented coupled with increased unit volume and higher equipment utilization. We cannot assure you that our business will continue to increase or that our performance will continue to improve.

We may not be able to continue to implement our cost saving strategy. Even if we do, it may not reduce our operating expenses by as much as we anticipated and could even compromise the development of our business.

In 2001 and 2002, as a response to the weakness in demand for semiconductors, we implemented cost saving measures, including significant reduction in our workforce, furloughs, reduced work shift schedules, reductions in discretionary spending, reduced materials cost and lower capital expenditures and redesign of our manufacturing processes to improve productivity. We cannot assure you that these cost saving measures will increase productivity or that any expected net savings will occur. In fact, our cost saving measures could adversely affect our revenue, as they could create inefficiencies in our business operations, result in labor disruptions and limit our ability to expand and grow our business.

The cyclicality of the semiconductor industry could adversely affect our operating results.

Our operations are substantially affected by market conditions in the semiconductor industry, which is highly cyclical and, at various times, has experienced significant economic downturns characterized by reduced product demand and production overcapacity which can result in rapid erosion of average selling prices. Since the end of 2000, we have been experiencing a general slowdown in the semiconductor industry.

Our profitability is affected by average selling prices which tend to decline.

Decreases in the average selling prices of our packaging and test services can have a material adverse effect on our profitability. The average selling prices of packaging and test services have declined historically, with packaging services in

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particular experiencing severe pricing pressure. This pricing pressure for packaging and test services is likely to continue. Our ability to maintain or increase our profitability will continue to be dependent, in large part, upon our ability to offset decreases in average selling prices by improving production efficiency, increasing unit volumes packaged or tested, or by shifting to higher margin packaging and test services. If we are unable to do so, our business, financial condition and results of operations could be materially and adversely affected.

If we are unable to develop and market new technologies, we may not remain competitive within the semiconductor packaging industry.

The semiconductor packaging and test industry is characterized by rapid increases in the diversity and complexity of packaging services. As a result, we expect that we will need to continually introduce more advanced package designs in order to respond to competitive industry conditions and customer requirements. The requirement to develop, license and maintain advanced packaging capabilities and equipment could require significant research and development and capital expenditures in future years. Any failure by us to achieve advances in package design or to obtain access to advanced package designs developed by others could reduce our growth prospects and operating income.

The intensity of competition in our industry could result in the loss of our customers, which could adversely affect our revenues and profits.

We face substantial competition from a number of established independent packaging companies and with the internal capabilities of many of our largest customers. Each of our primary competitors has significant operational capacity, financial resources, research and development operations, and established relationships with many large semiconductor companies, which are current or potential customers of ours. Furthermore, our competitors may in the future capture our existing or potential customers through superior responsiveness, service quality, product design, technical competence or other factors, which we view as principal elements of competition in our industry. In addition, our primary customers may, in the future, shift more of their packaging and test service demand internally. As a result, we may have reduced revenues and profits.

Our research and development efforts may not yield profitable and commercially viable services; thus, we may have significant short-term research and development expenses, which will not necessarily result in increases in revenue.

Our research and development efforts may not yield commercially viable packages or test services. The qualification process for new customers is conducted in various stages which may take one or more years to complete, and during each stage there is a substantial risk that we will have to abandon a potential package or test service which is no longer marketable and in which we have invested significant resources. In the event we are able to qualify new packages, a significant amount of time will have elapsed between our investment in new packages and the receipt of any related revenues.

We could lose customers, and thus revenue, if we cannot maintain the quality of our services.

The semiconductor packaging process is complex and involves a number of precise steps. Defective packaging can result from a number of factors, including the level of contaminants in the operational environment, human error, equipment malfunction, use of defective materials and plating services and inadequate sample testing. From time to time, we expect to experience lower than anticipated yields as a result of these factors, particularly in connection with any expansion of capacity or change in processing steps. In addition, our yield on new packaging could be lower during the period necessary for us to develop the requisite expertise and experience with these processes. Any failure by us to maintain high quality standards or acceptable yields, if significant and sustained, could result in the loss of customers, delays in shipments, increased costs and cancellation of orders.

2

Our business may be adversely affected by the loss of, or reduced purchases by, any of our large customers. Additionally, we may encounter difficulties in soliciting new customers.

For the year ended December 31, 2002, sales to our top five customers in the aggregate accounted for approximately 66.3% of total net revenues. If any of our main customers were to purchase significantly less of our services in the future, these decreased levels of purchases could harm our operating results.

Semiconductor packaging companies must pass a lengthy and rigorous qualification process that can take up to six months at a cost to the customer of approximately $250,000 to $300,000. If we fail to qualify packages with potential customers or customers with which we have recently become qualified do not use our services, then our customer base could become more concentrated with a limited number of customers accounting for a significant portion of our revenues. Moreover, we believe that once a semiconductor company has selected a particular packaging and test foundry company’s services, the semiconductor company generally relies on that vendor’s packages for specific applications and, to the extent possible, subsequent generations of that vendor’s packages. Accordingly, it may be difficult to achieve significant sales from a particular or potential customer once it selects another vendor’s packaging services.

Our substantial indebtedness could adversely affect our financial health and make us vulnerable to adverse economic and industry conditions.

As of December 31, 2002, our total indebtedness was $267.9 million. Our substantial indebtedness could have important consequences to you. For example, it could:

• increase our vulnerability to general adverse economic and industry conditions by limiting our flexibility in planning for, or reacting to, changes in our business and the industry in which we operate;

• require us to dedicate a substantial portion of our cash flow from operations to payments on our indebtedness, thus reducing the availability of our cash flow to fund working capital, capital expenditures, research and development efforts and other general corporate purposes;

• place us at a competitive disadvantage relative to our competitors that have less debt; and

• limit, along with the financial and other restrictive covenants in our indebtedness, our ability to borrow additional funds. Furthermore, failing to comply with those covenants could result in an event of default which, if not cured or waived, could have a material adverse effect on our ability to increase our revenues and profitability and meet our growth objectives.

Despite our current levels of indebtedness, we still may be able to incur substantially more debt which could increase the risks created by our substantial indebtedness.

We may be able to incur substantial additional indebtedness in the future. Our senior credit facility provides for revolving loans up to $50.0 million, including letters of credit. Additionally, the indenture for the existing senior subordinated notes permits us to incur additional indebtedness if we meet a test measuring our cash flow relative to our required interest payments. This indenture also allows us to incur debt under our senior credit facility. The indenture for our convertible notes does not limit our ability to incur additional indebtedness. All of the borrowings under our senior credit facility are secured by all of our assets and those of our subsidiaries, except those of our Chinese operating subsidiary. The addition of new debt to our current debt levels could intensify the debt-related risks that we now face that are described above.

3

The senior credit facilities and the indenture governing our 12 ³/4% senior subordinated notes impose limitations on how we conduct our business; as a result, we may not be able to pursue strategies that could be in the best interests of holders of our stock.

The senior credit facilities and the indenture governing our 12 ³/4% senior subordinated notes contain restrictions on us that could increase our vulnerability to general adverse economic and industry conditions by limiting our flexibility in planning for and reacting to changes in our business and industry. Specifically, these restrictions limit our ability to:

• incur additional debt;

• pay dividends and make other distributions;

• prepay subordinated debt;

• make investments and other restricted payments;

• enter into sale and leaseback transactions;

• create liens;

• sell assets;

• enter into transactions with affiliates; and

• consolidate or merge.

Beginning with the quarter ending December 31, 2002, the financial covenants under our senior credit facilities consist solely of a minimum interest coverage ratio and a maximum senior leverage ratio based on a rolling 12 months calculation. As of December 31, 2002, there were no violations of the covenants under the senior credit facilities. As a result of these restrictions, we may not be able to pursue business strategies that could be in the best interest of the holders of our notes and stock.

If we fail to comply with any of the restrictions in the senior credit facilities, a default may also occur under the indenture governing our 12 ³/4% senior subordinated notes and any other financing agreements. This default may allow some creditors, if their respective agreements so provide, to accelerate payments owed on such debt as well as any other indebtedness as to which a cross-acceleration or cross-default provision applies. The creditors who may be entitled to accelerated payments in the event of a default are: (1) the holders of our 12 ³/4% senior subordinated notes issued in the aggregate principal amount of $165.0 million, under an indenture dated July 29, 1999 by and among us, ChipPAC International Company Limited, and Firstar Bank, N.A. as trustee; and (2) the senior credit facility lenders, including Credit Suisse First Boston, New York branch, BankBoston N.A., State Street Bank and Trust Company, Balanced High-Yield Fund II Limited, CIBC Inc., First Source Financial LLP, Heller Financial, Inc., The First National Bank of Chicago and IBM Credit Corporation, under our senior credit facility, dated as of August 5, 1999 by and among the us, ChipPAC International Company Limited, and Credit Suisse First Boston, New York branch as the administrative agent, collateral agent and sole lead arranger for the senior facility lenders. As of December 31, 2002, the aggregate principal amount of the senior credit facility was $86.2 million of which approximately $36.2 million was outstanding. In addition, our lenders may be able to terminate any commitments they had made to supply us with further funds.

An economic or political crisis in Asia where our manufacturing facilities and most of our suppliers are located could prevent us from meeting the requirements of our customers and result in a decrease in our revenues.

4

Our manufacturing facilities are located in China, South Korea and Malaysia. Most of our materials suppliers are also located in Asia. For the last two years over half of our substrate costs were incurred from the purchase of materials from South Korean suppliers. In the future, we expect that a growing portion of these materials will be supplied by sources in China, Taiwan and Southeast Asia. Several countries in this region have experienced currency devaluation and/or difficulties in financing short-term obligations. We cannot assure you that the effect of an economic crisis on our suppliers will not impact operations, or that the effect on our customers in that region will not adversely affect both the demand for our services and the collectibility of receivables.

Furthermore, the region may suffer political unrest as a result of terrorist activity or armed conflict. The terrorist group, Abyu Sayyaf, which has been responsible for several kidnappings, is active in and near Malaysia. There are also other terrorist organizations which could target United States interests in the region. In addition, North Korea’s recent decision to withdraw from the nuclear Non-Proliferation Treaty and related geopolitical maneuverings may escalate into war or otherwise adversely affect South Korea. Any disruption resulting from these events could cause significant delays in shipments of our products until we are able to shift our manufacturing facilities and supply sources to other locations.

The failure of our vendors to supply sufficient quantities of materials on a timely basis could prevent us from fulfilling our customers’ orders. In addition, we may not be able to pass on any unexpected increase in the cost of these materials to our customers.

We obtain materials to fill orders for our packaging and test services directly from vendors. To maintain competitive packaging operations, we must obtain from our vendors, in a timely manner, sufficient quantities of acceptable materials at expected prices. We source most of our materials, including critical materials like laminate substrates, lead frames, mold compounds and gold wires, from a limited group of suppliers. We purchase all of our materials on a purchase order basis and have no long-term contracts with any suppliers. From time to time, vendors have extended lead times or limited the supply of required materials to us because of vendor capacity constraints and, consequently, we have experienced difficulty in obtaining acceptable materials on a timely basis. Our business and results could be negatively impacted if our ability to obtain sufficient quantities of materials and other supplies in a timely manner were substantially diminished or if there were significant increases in the cost of materials that we could not pass on to our customers.

If we are unable to obtain capital equipment in a timely manner, we may be unable to meet the increased demands of our customers which could result in a decrease in our revenues.

Our facilities currently have sufficient packaging and test services capacity to meet the current and expected demands of our customers. Nonetheless, in the event there are significant increases in overall semiconductor demand or demand for some of our products and services, we may not be able to meet those increased demands of our customers. Moreover, because the semiconductor packaging and test services business requires investment in expensive capital equipment and is characterized, from time to time, by intense demand, limited supply and long delivery cycles, we may not be able to readily increase our operating capacity. This would lead to a loss of sales of our packaging and test services, could ultimately lead to a loss in market share and have a negative impact on our results of operations.

We depend upon intellectual property and license critical technology from third parties in order to develop and provide advanced packaging technologies and designs for our customers. To the extent these licenses are not perpetual and irrevocable, our net revenues could be materially adversely affected if our rights under these licenses expire or are terminated.

Our ability to develop and provide advanced packaging technologies and designs for our customers depends in part on our proprietary know-how, trade secrets and other patented and non-patented, confidential technologies, which we either own or license from third parties. We seek to protect our proprietary information and know-how through the use of

5

trade secrets, confidentiality agreements and other security measures. We may not obtain patent protection for the patent applications that we file, or if we are granted patents, those patents may not offer meaningful protection. Additionally, we cannot assure you that our competitors will not develop, patent or gain access to similar know-how and technology, or reverse engineer our packaging services, or that any confidentiality agreements upon which we rely to protect our trade secrets and other proprietary information will be adequate to protect our proprietary technology.

We have licenses to use numerous third party patents, patent applications and other technology rights, as well as trademark rights, in the operation of our business. To the extent these licenses are not perpetual and irrevocable, we believe that these licenses are renewable under normal commercial terms once they expire. However, we may be unable to utilize the technologies under these licenses if they are not extended or otherwise renewed or if any of these licenses are terminated by the licensor due to our uncured breach or bankruptcy. Alternatively, if we are able to renew these arrangements, we cannot assure you that they will be on the same terms as currently exist. Any failure to extend or renew these license arrangements could cause us to incur substantial liabilities and to suspend the packaging services and processes that utilized these technologies.

The loss of our skilled technical, marketing and sales personnel or our key executive officers could have a material adverse effect on our research and development, marketing and sales efforts.

Our competitiveness will depend in large part upon whether we can attract and retain skilled technical, marketing and sales personnel and can retain members of our executive team. Competition for skilled personnel is intense, and we may not be

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successful in attracting and retaining the technical personnel or executive managers we require to develop new and enhanced packaging and test services and to continue to grow and operate profitably. If we cannot attract or retain skilled personnel, we may not be able to operate successfully in the future.

If we encounter future labor problems, we may fail to deliver our products in a timely manner which could adversely affect our revenues and profitability.

Our employees at our Ichon, South Korea facility are represented by ChipPAC Korea Labor Union and are covered by collective bargaining and wage agreements. Both the wage agreement and the collective bargaining agreement, which covers basic union activities, working conditions and welfare programs, among other things, are effective to May 1, 2003. As of December 31, 2002, approximately 78% of our South Korean employees were represented by the ChipPAC Korea Labor Union. In addition, one of our Chinese subsidiaries experienced labor protests and a two-day work stoppage in July 1998 in connection with proposed work force reductions. We cannot assure you that issues with the labor union or other employees will be resolved favorably for us in the future, that we will not experience significant work stoppages in future years or that we will not record significant charges related to those work stoppages. In addition, potential efficiency enhancement efforts, including personnel reductions, following our acquisition of the Malaysian business may create the risk of labor problems in Malaysia or at other facilities.

New laws and regulations, currency devaluation and political instability in foreign countries, particularly in China, Malaysia and South Korea could make it more difficult for us to operate successfully.

For the years ended December 31, 2002, 2001 and 2000, we generated approximately 11.3%, 8.1% and 16.7% of total revenues, respectively, from international markets, primarily from customers in Southeast Asia and Europe. In addition, all of the facilities currently used to provide our packaging services are located in China, Malaysia and South Korea. Moreover, many of our customers’ operations are located in countries outside of the United States. We cannot determine if our future operations and earnings will be affected by new laws, new regulations, a volatile political climate, changes in or new interpretations of existing laws or regulations or other consequences of doing business outside the U.S., particularly in China, Malaysia and South Korea. In particular, we risk terrorism against U.S. companies in Malaysia and the instability that would accompany any type of armed conflict with North Korea. If future operations are negatively affected by these changes, our sales or profits may suffer.

Fluctuations in the exchange rate of the U.S. dollar and foreign currencies could have a material adverse effect on our financial performance and profitability.

A portion of our costs are denominated in foreign currencies, like the South Korean Won, the Chinese Renminbi or RMB and the Malaysian Ringgit. As a result, changes in the exchange rates of these currencies or any other applicable currencies to the U.S. dollar will affect our costs of goods sold and operating margins and could result in exchange losses. We cannot fully predict the impact of future exchange rate fluctuations on our profitability. From time to time, we may engage in exchange rate hedging activities in an effort to mitigate the impact of exchange rate fluctuations. However, we cannot assure you that any hedging technique we may implement will be effective. If it is not effective, we may experience reduced operating margins.

We could suffer adverse tax and other financial consequences if U.S. or foreign taxing authorities do not agree with our interpretation of applicable tax laws.

Our corporate structure is based, in part, on assumptions about the various tax laws, including withholding tax, and other relevant laws of applicable non-U.S. jurisdictions. We cannot assure you that foreign taxing authorities will agree with our interpretations or that they will reach the same conclusions. For example, the Korean National Tax Administration has informed us that it has made an assessment of

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approximately $13.3 million against us relating to withholding tax collected on a loan between our subsidiaries in Korea and Hungary. We believe that no withholding on the transaction in question is required under the prevailing tax treaty. We have appealed this assessment and believe it will be overturned. However, our interpretations are not binding on any taxing authority and, if these foreign jurisdictions were to change or to modify the relevant laws, we could suffer adverse tax and other financial consequences or have the anticipated benefits of our corporate structure materially impaired.

Because the Malaysian business previously operated as a subsidiary of Intersil, our future financial results may be significantly different from those experienced historically.

Prior to our acquisition of our Malaysian business in 2000, it was operated as a subsidiary of Intersil. All the historical revenues of the Malaysian business represent intercompany sales to Intersil on terms determined by Intersil. Although we expect to retain this business pursuant to a five-year supply agreement with Intersil, volume, product mix and pricing may change in the future, and we cannot assure you that Intersil will perform under our supply agreement.

We entered into supply contracts with Intersil in connection with our acquisition of our Malaysian business and with Fairchild Semiconductor following Fairchild’s acquisition of Intersil’s discrete power business, and any decrease in the purchase requirements of Intersil or Fairchild or the inability of Intersil or Fairchild to meet its contractual obligations could substantially reduce the financial performance of our Malaysian subsidiary.

Historically, the Malaysian business generated all of its revenues from the sale of products and services to affiliated Intersil companies. The revenue of the Malaysian business for the first six months of 2000 prior to our acquisition of it and for all of 1999 was $41.9 million and $101.9 million, respectively. As a result of our acquisition of the Malaysian business, we have numerous arrangements with Intersil, including arrangements relating to packaging and test services as a vendor to affiliated Intersil companies and other services. Any material adverse change in the purchase requirements of Intersil or in its ability to fulfill its other contractual obligations could have a material adverse effect on our Malaysian subsidiary. Moreover, we may be unable to sell any products and services to affiliated Intersil companies beyond the term of our five-year supply agreement with Intersil.

In connection with Fairchild Semiconductor’s acquisition of Intersil’s discrete power business, we entered into an assignment agreement that assigned Intersil’s portion of the supply agreement relating to this business to Fairchild. We have also entered into a three-year IT services agreement with Intersil under which the Malaysian business will continue to obtain a number of these services from Intersil. We cannot assure you that Fairchild will perform under the supply agreement or that Intersil will perform under the supply and services agreements or that upon termination of these agreements we will be able to obtain similar services on comparable terms.

We may not be able to consummate future acquisitions, and consequences of those acquisitions which we do complete may adversely affect us.

We plan to continue to pursue additional acquisitions of related businesses. The expense incurred in consummating the future acquisition of related businesses, or our failure to integrate those businesses successfully into our existing business, could result in our incurring unanticipated expenses and losses. We plan to continue to pursue additional acquisitions of related businesses in the future. We may be unable to identify or finance additional acquisitions or realize any anticipated benefits from those acquisitions.

Should we successfully acquire another business, the process of integrating acquired operations into our existing operations may result in unforeseen operating difficulties and may require significant financial resources that would otherwise be

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available for the ongoing development or expansion of our existing operations. Possible future acquisitions could result in the incurrence of contingent liabilities and amortization expenses related to goodwill and other intangible assets, all of which could have a material adverse effect on our financial condition and operating results.

In addition, we may finance future acquisitions with additional indebtedness. We have a substantial amount of outstanding indebtedness and will, subject to compliance with our debt instruments, have the ability to incur additional indebtedness. We will be required to generate cash flow from operations to service that indebtedness and there can be no assurance that we will generate sufficient cash flow to service that indebtedness. We may be required to refinance our indebtedness upon its maturity, and we cannot assure you that we will be able to refinance our indebtedness at all or on terms acceptable to us.

Terrorist attacks, such as the attacks that occurred in New York and Washington, D.C. on September 11, 2001, and other acts of violence or war, such as war with Iraq, may affect the markets on which our securities trade, the markets in which we operate, our operations and our profitability.

Terrorist attacks may negatively affect our operations and your investment. There can be no assurance that there will not be further terrorist attacks against the United States or United States businesses. These attacks or hostilities may directly impact our physical facilities or those of our suppliers or customers. For example, several terrorist groups have called for targeting U.S. interests, including U.S. companies in Southeast Asia. Our current facilities include administrative, sales, and R&D facilities in the United States and manufacturing facilities in China, Malaysia and South Korea. Furthermore, these attacks may make travel and the transportation of our supplies and products more difficult and more expensive and ultimately affect the sales of our products in the United States and overseas.

Also as a result of terrorism, the United States may enter into an armed conflict which could have a further impact on our domestic and international sales, our supply chain, our production capability and our ability to deliver product to our customers. Political and economic instability in some regions of the world may also result and could negatively impact our business. In particular, the United States may enter into an armed conflict with North Korea or on the Korean peninsula, which could affect our suppliers or our manufacturing facilities. War with Iraq may negatively impact the prices of our supplies and the condition of our national and global economy. The consequences of any of these hostilities are unpredictable, and we may not be able to foresee events that could have an adverse effect on our business or your investment.

A limited number of persons indirectly control us and may exercise their control in a manner adverse to your interests.

At March 20, 2003, Citicorp Venture Capital, Ltd. and its affiliates owned or had the right to acquire 23,854,379 shares or approximately 25.1% of our outstanding Class A common stock. At March 20, 2003, funds affiliated with Bain Capital, Inc. owned 21,387,396 shares or approximately 22.5% of our outstanding Class A common stock. By virtue of this stock ownership, these entities collectively have substantial power to direct our affairs and will be able to significantly affect the outcome of all matters required to be submitted to stockholders for approval, including the election of a majority of our directors, any merger, consolidation or sale of all or substantially all of our assets and amendment of our certificate of incorporation. Because a limited number of persons control us, transactions could be difficult or impossible to complete without the support of those persons. It is possible that these persons will exercise their control over us in a manner adverse to your interests.

If our relationship with Hynix Semiconductor, our previous owner, deteriorates, our business could be adversely affected.

Our facilities in Ichon, South Korea occupy a portion of a building located on property owned by Hynix Semiconductor, a current stockholder and former majority owner. In addition, Hynix Semiconductor is one of our current customers. An

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unfavorable change in our relations with Hynix Semiconductor could adversely effect services we receive from them at this facility and the revenue we derive from the products and services we provide to them.

Environmental, health and safety laws could require us to incur capital and operational costs to maintain compliance and could impose liability to remedy the effects of hazardous substance contamination.

We are subject to liabilities and compliance obligations arising under environmental, health and safety laws. These laws impose various controls on the quality of our air and water discharges, on the storage, handling, discharge and disposal of chemicals the company uses, and on employee exposure to hazardous substances in the workplace. Environmental, health and safety laws could require us to incur capital and operational costs to maintain compliance and could impose liability to remedy the effects of hazardous substance contamination. We cannot assure you that applicable environmental, health and safety laws will not in the future impose the need for additional capital equipment or other process requirements upon the company, curtail its operations, or restrict its ability to expand its operations. The adoption of new environmental, health and safety laws, the failure to comply with new or existing laws, or issues relating to hazardous substance contamination could subject the company to future material liability.

Risks Relating to Our Class A Common Stock

Our stock price has fluctuated significantly in the past, and the market price of our Class A common stock may be lower than you expect.

Since our initial public offering on August 8, 2000, the closing price of our Class A common stock has fluctuated significantly, ranging from a low of $0.99 to a high of $18.50 per share. Fluctuations in our stock price could continue. Among the factors that could affect our stock price are:

• quarterly variations in our operating results;

• rating changes by research analysts;

• strategic actions by us or our competitors, such as acquisitions;

• general market conditions; and

• general economic factors unrelated to our performance.

The stock markets in general, and the markets for technology companies in particular, have experienced a high degree of volatility not necessarily related to the operating performance of particular companies. We cannot provide assurances as to our stock price.

Some of our long-time stockholders have the right to require us to register the public sale of their shares; all of our total outstanding shares of Class A common stock may be sold into the market; future sales of those shares could depress the market price of our Class A common stock.

The public market for our Class A common stock includes 11,500,000 shares of Class A common stock that we sold in our initial public offering, an additional 11,445,600 shares of Class A common stock that we sold to the public in January 2002 and an additional 12,000,000 shares that we sold to the public in May 2002. At the time of our initial public offering, there were 55,631,718 additional shares of our Class A common stock outstanding. Those people and entities who were our stockholders prior to our initial public offering are able to sell their shares in the public market, subject to legal restrictions on transfer. Some of our stockholders prior to our initial public offering are parties to agreements with us that provide for demand registration rights to cause us to register under the Securities Act of 1933, as amended, or the Securities Act, all or part of their shares of our Class A common stock, as well as piggyback registration rights. Currently, approximately 46,415,147 shares of our Class A common stock have

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restrictions on resale and are subject to these registration rights. We believe that all of the other shares of our Class A common stock are freely tradable. Registration of the sale of these restricted shares of our Class A common stock would permit their sale into the market immediately. If our stockholders sell a large number of shares, the market price of our Class A common stock could decline, as these sales may be viewed by the public as an indication of an upcoming or recently occurring shortfall in the financial performance of our company. Moreover, the perception in the public market that these stockholders might sell shares of our Class A common stock could depress the market price of the Class A common stock.

As of March 20, 2003, we had 94,983,299 shares of our Class A common stock outstanding. All of these shares are freely tradeable without restriction under the Securities Act, except for any shares which may be held or acquired by an affiliate of our company, as that term is defined in Rule 144 promulgated under the Securities Act. We believe that affiliates hold approximately 41,078,535 shares of common stock, and that those shares could only be sold over the next 12 months in accordance with the volume and manner of sale limitations set forth in Rule 144.

Provisions of our charter documents could discourage potential acquisition proposals and could delay, deter or prevent a change in control.

Provisions of our certificate of incorporation and by-laws may inhibit changes in control of our company not approved by our board of directors and would limit the circumstances in which a premium may be paid for our Class A common stock in proposed transactions, or a proxy contest for control of the board may be initiated. These provisions provide for:

• a prohibition on stockholder action through written consents;

• a requirement that special meetings of stockholders be called only by our chief executive officer or the board of directors;

• advance notice requirements for stockholder proposals and nominations;

• limitations on the ability of stockholders to amend, alter or repeal the by-laws; and

• the authority of the board to issue, without stockholder approval, preferred stock with terms as the board may determine.

Your right to receive payments on the Class A common stock is junior to the company’s existing and, possibly future, senior and subordinated indebtedness. It is possible, therefore, that you may receive no compensation of any kind relating to the Class A common stock if there is a bankruptcy, liquidation or similar proceeding affecting us.

The Class A common stock ranks behind all of our existing indebtedness, including our guarantees of our subsidiary’s obligations under the senior credit facility and our subsidiary’s 12 ³/4% senior subordinated notes and our obligations under our 8% convertible subordinated notes. The Class A common stock also ranks behind all of our future borrowings, except any future indebtedness that expressly provides that it ranks with, or subordinated in right of payment to, the Class A common stock. As a result, upon any distribution to our creditors, in a bankruptcy, liquidation or reorganization or similar proceeding relating to us or our property, we will have to pay the holders of debt senior to the Class A common stock in full before we can make any payment on the Class A common stock. Moreover, the Class A common stock will be structurally subordinated to all liabilities, including trade payables, of our subsidiaries and any subsidiaries upon their liquidation or reorganization, and the rights of the holders of the Class A common stock to share in those assets, would be subordinate to the claims of the subsidiaries’ creditors.

In addition, all payments on the Class A common stock will be blocked in the event of a payment default on our senior and subordinated debt, including borrowings under the senior credit facility, and may be blocked for specified periods in the event of

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non-payment defaults on certain senior debt.

Risks Relating to Our 8% Convertible Subordinated Notes

Your right to receive payments on the 8% convertible subordinated notes is junior to the company’s existing and, possibly future, senior indebtedness. It is possible, therefore, that you may receive no compensation of any kind relating to the notes if there is a bankruptcy, liquidation or similar proceeding affecting us.

We may not have sufficient funds to satisfy our obligations relating to the 8% convertible subordinated notes. The 8% convertible subordinated notes rank behind all of our existing indebtedness, including our guarantees of our subsidiary’s obligations under the senior credit facility and our subsidiary’s 12 ³/4% senior subordinated notes. The 8% convertible subordinated notes will also rank behind all of our future borrowings, except any future indebtedness that expressly provides that it ranks with, or subordinated in right of payment to, the convertible subordinated notes. In total as of December 31, 2002, the amount of our indebtedness which constitutes senior indebtedness was $201.2 million. As a result, upon any distribution to our creditors, in a bankruptcy, liquidation or reorganization or similar proceeding relating to us or our property, we will have to pay the holders of debt senior to the 8% convertible subordinated notes in full before we can make any payment on the 8% convertible subordinated notes. Moreover, the 8% convertible subordinated notes will be structurally subordinated to all liabilities, including trade payables, of our subsidiaries and any subsidiaries upon their liquidation or reorganization, and the rights of the holders of the convertible subordinated notes to share in those assets, would be subordinate to the claims of the subsidiaries’ creditors.

In addition, all payments on the 8% convertible subordinated notes will be blocked in the event of a payment default on our senior debt, including borrowings under the senior credit facility, and may be blocked for specified periods in the event of non-payment defaults on certain senior debt.

As a holder of debt securities, you would typically have equal rights to your ratable share, along with all of our suppliers and vendors to which we owe money, who are commonly referred to as trade creditors, and other holders of debt of the same class as the notes, of any assets remaining after we have paid off all of the debt senior to the notes. However, the indenture governing the 8% convertible subordinated notes requires that amounts otherwise payable to holders of the convertible subordinated notes in a bankruptcy, liquidation or similar proceeding be paid to holders of debt senior to the convertible subordinated notes instead. Consequently, holders of the 8% convertible subordinated notes may receive less, ratably, than holders of trade payables or other debt of the same class in this type of proceeding.

We are a holding company and conduct all of our operations through our subsidiaries, which may affect our ability to make payments on the 8% convertible subordinated notes.

All of our manufacturing services are conducted through our subsidiaries. As a result, our cash flow and our ability to service our debt, including the 8% convertible subordinated notes, depend upon the earnings of our subsidiaries. In addition, we depend on the distribution of earnings, loans or other payments by our subsidiaries to us.

Our subsidiaries are separate and distinct legal entities. Our subsidiaries have no obligation to pay any amounts due on the 8% convertible subordinated notes. Our subsidiaries are not required to provide us with funds for our payment obligations, whether by dividends, distributions, loans or other payments. In addition, any payment of dividends, distributions, loans or advances by our subsidiaries to us could be subject to statutory or contractual restrictions. Payments to us by our subsidiaries will also be contingent upon our subsidiaries’ earnings and business considerations.

We may not have the ability to raise the funds necessary to finance the change in control offer required by the indenture governing the 8% convertible subordinated

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notes.

If the company undergoes a change in control (as defined in the indenture governing the 8% convertible subordinated notes) we may need to refinance large amounts of our debt, including our 12 ³/4% senior subordinated notes, these 8% convertible subordinated notes and borrowings under the senior revolving credit facility. If a change in control occurs, we must offer to buy back the 8% convertible subordinated notes for a price equal to 100.0% of the principal amount of the 8% convertible subordinated notes, plus any accrued and unpaid interest. We cannot assure you that there will be sufficient funds available for us to make any required repurchases of the 8% convertible subordinated notes upon a change in control. In addition, our senior revolving credit facility will prohibit us from repurchasing the 8% convertible subordinated notes until we first repay the senior revolving credit facility in full and the indenture governing our 12 ³/4% senior subordinated notes requires us to meet financial tests before prepaying subordinated debt like the 8% convertible subordinated notes. If we fail to repurchase the 8% convertible subordinated notes in that circumstance, we will go into default under the indenture governing the 8% convertible subordinated notes and by virtue of the cross-default provisions contained in the notes, the senior revolving credit facility and the indenture governing our 12 ³/4% senior subordinated notes.

A change in control for purposes of the indenture governing the 8% convertible subordinated notes may also constitute a change in control under the indenture governing our 12 ³/4% senior subordinated notes, which would require that we offer to buy back the 12 ³/4% senior subordinated notes prior to these notes. Any future debt which we incur may also contain restrictions on repayment upon a change in control. If any change in control occurs, we cannot assure you that we will have sufficient funds to satisfy all of the company’s debt obligations. These buyback requirements may also delay or make it harder for others to effect a change in control. However, certain other corporate events, such as leveraged recapitalizations that would increase our level of indebtedness, would not constitute a change in control under the indenture governing the 8% convertible subordinated notes.

Federal and state laws allow courts, under specific circumstances, to void debts and require holders of debt securities to return payments received from debtors.

All of the net proceeds from the initial private placement of the 8% convertible subordinated notes were used to repay our existing senior credit facility. If a bankruptcy proceeding or a lawsuit is initiated by the company’s unpaid creditors, the debt which we incurred to repay our existing credit facility, including the notes, may be reviewed under federal bankruptcy laws and comparable provisions of state fraudulent transfer laws. Under these laws, the debt of the company could be voided, or claims in respect of the debt could be subordinated to all other debt if, among other things, the company:

• received less than reasonably equivalent value or fair consideration for the incurrence of such debt;

• was insolvent or rendered insolvent by reason of such incurrence;

• was engaged in a business or transaction for which the remaining assets of the company constituted unreasonably small capital; or

• intended to incur, or believed that the company would incur, debts beyond our ability to pay such debts as they mature.

In addition, you may be required to return to fund for the benefit of creditors, any payments received from us in respect of the 8% convertible subordinated notes.

The measures of insolvency will vary depending upon the fraudulent transfer law applied in any proceeding to determine whether such a transfer has occurred. Generally, however, a debtor would be considered insolvent if:

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• the sum of its debts, including contingent liabilities, was greater than the fair saleable value of all of its assets;

• the present fair saleable value of its assets were less than the amount that would be required to pay its probable liability on existing debts, including contingent liabilities, as they become absolute and mature; or

• it could not pay its debts as they become due.

On the basis of historical financial information, recent operating history and other factors, we believe that we are not insolvent, do not have unreasonably small capital for the business in which we are engaged and have not incurred debts beyond our ability to pay such obligations as they mature. We cannot assure you, however, as to what standard a court would apply in making such determination, or that a court would agree with our conclusion in this regard.

We cannot assure you that an active trading market will develop for the 8% convertible subordinated notes.

There has been no public market for the 8% convertible subordinated notes. In addition, both the liquidity and the market price quoted for these notes may be adversely affected by changes in the price of our Class A common stock, changes in the overall market for convertible securities and by changes in our financial performance or prospects, or in the prospects for companies in our industry generally. In particular, the price of our 8% convertible subordinated notes may fluctuate with our stock price since the notes are convertible into stock. As a result, we cannot assure you that an active or stable trading market will develop or continue for these 8% convertible subordinated notes. We also cannot guarantee that the 8% convertible subordinated notes will trade in the same or like manner as our 12 ³/4% senior subordinated notes.

Risks Relating to Our 12 ³/4% Senior Subordinated Notes

ChipPAC International Company Limited does not have an independent source of income from which to satisfy obligations of the 12 ³/4% senior subordinated notes.

ChipPAC International Company Limited or ChipPAC International will rely on intercompany loans through its direct and indirect subsidiaries to satisfy obligations of its indebtedness; as a result, if these subsidiaries are not able to make payments on these intercompany loans, we may not be able to pay our noteholders interest on the 12 ³/4% senior subordinated notes when due.

The only source of cash for ChipPAC International to pay principal and interest on the 12 ³/4% senior subordinated notes will be through payments of interest and principal on intercompany notes, capital contributions from the parent company or dividends or distributions from ChipPAC International’s subsidiaries, which dividends or distributions would be funded through payments on intercompany notes. We will rely principally on funds generated by ChipPAC International’s operating subsidiaries to fund payments on the notes and other indebtedness. If these subsidiaries are unable to make payments on their intercompany loans, we may not be able to satisfy obligations under our debt instruments, including payment of interest on the senior revolving credit facility and these 12 ³/4% senior subordinated notes.

Our ability to pay our obligations under the 12 ³/4% senior subordinated notes may be reduced because ChipPAC International’s Chinese operating subsidiary, which holds 27.7% of our consolidated assets and generated 18.6% of our consolidated revenue for the year ended December 31, 2002, is not a guarantor of the notes.

Our Chinese subsidiary is not a guarantor of the notes. For the year ended December 31, 2002, the total revenue for our Chinese subsidiary was $67.8 million, representing approximately 18.6% of our consolidated revenue. Our Chinese subsidiary had combined assets of approximately $130.1 million at December 31, 2002, representing approximately 27.7% of our consolidated assets.

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Claims of creditors of our Chinese operating subsidiary, including trade creditors, secured creditors and creditors holding indebtedness or a guarantee issued by this subsidiary, will generally have priority on the assets and earnings of this subsidiary, over the claims of creditors of our company, including holders of our 12 ³/4% senior subordinated notes, even if the obligations of our Chinese operating subsidiary do not constitute senior indebtedness. Since our Chinese subsidiary will not guarantee the 12 ³/4% senior subordinated notes, holders of the notes will have to rely solely on dividends or distributions from the company’s Korean, Malaysian and British Virgin Islands subsidiaries to satisfy their respective obligations under the notes should our Chinese subsidiary be unable to make dividends or distributions.

We may not have the ability to raise the funds necessary to finance the change of control offer required by the indenture governing the 12 ³/4% senior subordinated notes.

If the company undergoes a change of control (as defined in the indenture governing the 12 ³/4% senior subordinated notes) we may need to refinance large amounts of our debt, including the 12 ³/4% senior subordinated notes and borrowings under the senior revolving credit facility. If a change of control occurs, we must offer to buy back the 12 ³/4% senior subordinated notes for a price equal to 101% of the principal amount of the notes, plus any accrued and unpaid interest. We cannot assure you that there will be sufficient funds available for us to make any required repurchases of the 12 ³/4% senior subordinated notes upon a change of control. In addition, our senior revolving credit facility will prohibit us from repurchasing the notes until we first repay the senior revolving credit facility in full. If we fail to repurchase the 12 ³/4% senior subordinated notes in that circumstance, we will go into default under both the indenture governing the notes and the senior revolving credit facility. Any future debt which we incur may also contain restrictions on repayment upon a change of control. If any change of control occurs, we cannot assure you that we will have sufficient funds to satisfy all of the company’s debt obligations. These buyback requirements may also delay or make it harder for others to effect a change of control. However, certain other corporate events, such as leveraged recapitalizations that would increase our level of indebtedness, would not constitute a change of control under the indenture governing the notes.

We cannot assure you that an active trading market will develop or continue for the 12 ³/4% senior subordinated notes.

The 12 ³/4% senior subordinated notes are publicly traded but do not necessarily trade actively. In addition, both the liquidity and the market price quoted for these notes may be adversely affected by changes in the price of our Class A common stock, changes in the overall market for convertible securities and by changes in our financial performance or prospects, or in the prospects for companies in our industry generally. As a result, we cannot assure you that an active or stable trading market will develop or continue for these 12 ³/4% senior subordinated notes. We also cannot guarantee that the 12 ³/4% senior subordinated notes will trade in the same or like manner as our 8% convertible subordinated notes.

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EX-99.2

Exhibit 99.2

CHIPPAC, INC.

CERTIFICATION OF PRINCIPAL EXECUTIVE OFFICER PURSUANT TO SECTION 906

OF THE SARBANES-OXLEY ACT OF 2002

I, Dennis P. McKenna, in my capacity as Chief Executive Officer of ChipPAC, Inc., a Delaware corporation (“ChipPAC”), and in connection with the Annual Report on Form 10-K filed by ChipPAC with the Securities and Exchange Commission on March 31, 2003 (the “Report”), hereby certify that:

1. The Report fully complies with the requirements of Section 13(a) or 15(d) of the Securities Exchange Act of 1934.

2. The information contained in the Report fairly presents, in all material respects, the financial condition and results of operations of ChipPAC.

IN WITNESS WHEREOF, the undersigned has executed this CEO Certification as of the 31st day of March, 2003.

/s/    DENNIS P. MCKENNA      

Dennis P. McKenna

Chief Executive Officer

A signed original of this written statement required by Section 906 has been provided to ChipPAC, Inc. and will be retained by ChipPAC, Inc. and furnished to the Securities and Exchange Commission or its staff upon request.

EX-99.3

Exhibit 99.3

CHIPPAC, INC.

CERTIFICATION OF PRINCIPAL FINANCIAL OFFICER PURSUANT TO SECTION 906

OF THE SARBANES-OXLEY ACT OF 2002

I, Robert Krakauer, in my capacity as Chief Financial Officer of ChipPAC, Inc., a Delaware corporation (“ChipPAC”), and in connection with the Annual Report on Form 10-K filed by ChipPAC with the Securities and Exchange Commission on March 31, 2003 (the “Report”), hereby certify that:

1. The Report fully complies with the requirements of Section 13(a) or 15(d) of the Securities Exchange Act of 1934.

2. The information contained in the Report fairly presents, in all material respects, the financial condition and results of operations of ChipPAC.

IN WITNESS WHEREOF, the undersigned has executed this CFO Certification as of the 31st day of March, 2003.

/s/    ROBERT KRAKAUER      

Robert Krakauer

Chief Financial Officer

A signed original of this written statement required by Section 906 has been provided to ChipPAC, Inc. and will be retained by ChipPAC, Inc. and furnished to the Securities and Exchange Commission or its staff upon request.