0001628280-23-022819.txt : 20230621 0001628280-23-022819.hdr.sgml : 20230621 20230621061003 ACCESSION NUMBER: 0001628280-23-022819 CONFORMED SUBMISSION TYPE: 6-K PUBLIC DOCUMENT COUNT: 1 CONFORMED PERIOD OF REPORT: 20230531 FILED AS OF DATE: 20230621 DATE AS OF CHANGE: 20230621 FILER: COMPANY DATA: COMPANY CONFORMED NAME: TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD CENTRAL INDEX KEY: 0001046179 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 000000000 FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 6-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-14700 FILM NUMBER: 231027365 BUSINESS ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 BUSINESS PHONE: 886-3-5636688 MAIL ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 6-K 1 tsm-monthend6kx20230625.htm 6-K Document

1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of June 2023
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Ltd.
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  x            Form 40-F  o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o



SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


Taiwan Semiconductor Manufacturing Company Ltd.
Date:   June 21, 2023By   /s/ Wendell Huang
  Wendell Huang
   Vice President and Chief Financial Officer
   




Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) the unsecured bonds issued by TSMC and its subsidiaries for the month of May 2023.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
TitleNameNumber of shares held as ofChanges
4/30/20235/31/2023
ChairmanMark Liu12,961,87812,962,473595
Senior Vice President and Chief Information Security OfficerJ.K. Lin13,740,46213,804,46264,000
Senior Vice PresidentCliff Hou479,755481,6261,871
Senior Vice PresidentY.J. Mii1,014,2731,016,2732,000
Vice President and Chief Financial OfficerWendell Huang1,660,0401,660,05515
Vice PresidentJonathan Lee382,849385,1372,288
Vice PresidentRay Chuang277,132285,3188,186
Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Inapplicable.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
Fixed-income investment: NT$32.8 billion of acquisition.
Equity investment: US$20.0 million of acquisition.
4.The capital appropriations approved by TSMC board of directors:

Real estate and capitalized leased assets: US$0.4 billion.



5.The unsecured bonds issued by TSMC and its subsidiaries:
IssuanceTrancheIssuance PeriodTotal Amount
(in billions)
Coupon Rate Repayment and Interest Payment
112-2AMay 2023 ~ May 2028NT$13.11.60%Bullet repayment; interest payable annually
BMay 2023 ~ May 2030NT$2.31.65%
CMay 2023 ~ May 2033NT$5.31.82%