0001564590-22-021205.txt : 20220525 0001564590-22-021205.hdr.sgml : 20220525 20220525060023 ACCESSION NUMBER: 0001564590-22-021205 CONFORMED SUBMISSION TYPE: 6-K PUBLIC DOCUMENT COUNT: 1 CONFORMED PERIOD OF REPORT: 20220525 FILED AS OF DATE: 20220525 DATE AS OF CHANGE: 20220525 FILER: COMPANY DATA: COMPANY CONFORMED NAME: TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD CENTRAL INDEX KEY: 0001046179 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 000000000 FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 6-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-14700 FILM NUMBER: 22958814 BUSINESS ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 BUSINESS PHONE: 886-3-5636688 MAIL ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 6-K 1 tsm-6k_20220525.htm 6-K tsm-6k_20220525.htm

 

 

 

 

 

 

 

 

 

 

 

 

1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of May 2022

(Commission File Number: 001-14700)

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  ☒            Form 40-F  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):□

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):□

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

May 25, 2022

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 

 


 

 


 

 

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

 

 

 

 

 

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of April 2022.

 

 

 

 

 

1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

 

 

Title

Name

Number of shares held as of

Changes

03/31/2022

04/30/2022

 

Senior Vice President

Cliff Hou

447,995

448,907

912

 

Senior Vice President

Kevin Zhang

80,000

85,000

5,000

 

Vice President and

Chief Financial Officer

Wendell Huang

1,651,769

1,651,779

10

 

Vice President

Jun He

9,000

11,000

2,000

 

Vice President

Geoffrey Yeap

40,000

44,000

4,000

 

Vice President

Jonathan Lee

334,800

335,165

365

 

Vice President

K.C. Hsu

16,000

22,000

6,000

 

Note: Shareholdings include shares held by the related parties.

 

2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable

 

 

 

 

 

 

3. The acquisition and disposition of assets by TSMC and its subsidiaries:

Fixed-income investment: NT$13.7 billion of acquisition.

 

4. The capital appropriations approved by TSMC board of directors: Inapplicable.

 

 


 

5. The unsecured bonds issued by TSMC and its subsidiaries 

 

Overseas US$ Unsecured Bond

 

 

Issuance Period

Total Amount
(in billions)

Coupon
Rate

Repayment

and
Interest Payment

 

 

April 2022 ~ April 2027

US$1.0

3.875%

Bullet repayment (callable at any time, in whole or in part, at the relevant redemption price according to relevant agreements); interest payable semi-annually

 

 

April 2022 ~ April 2029

US$0.5

4.125%

 

 

April 2022 ~ April 2032

US$1.0

4.250%

 

 

April 2022 ~ April 2052

US$1.0

4.500%