0001564590-21-037677.txt : 20210723 0001564590-21-037677.hdr.sgml : 20210723 20210723060028 ACCESSION NUMBER: 0001564590-21-037677 CONFORMED SUBMISSION TYPE: 6-K PUBLIC DOCUMENT COUNT: 1 CONFORMED PERIOD OF REPORT: 20210723 FILED AS OF DATE: 20210723 DATE AS OF CHANGE: 20210723 FILER: COMPANY DATA: COMPANY CONFORMED NAME: TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD CENTRAL INDEX KEY: 0001046179 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] IRS NUMBER: 000000000 FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 6-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-14700 FILM NUMBER: 211108958 BUSINESS ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 BUSINESS PHONE: 886-3-5636688 MAIL ADDRESS: STREET 1: NO. 8, LI-HSIN ROAD 6 STREET 2: SCIENCE-BASED INDUSTRIAL PARK CITY: HSINCHU STATE: F5 ZIP: 00000 6-K 1 tsm-6k_20210723.htm 6-K tsm-6k_20210723.htm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of July 2021

(Commission File Number: 001-14700)

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  ☒            Form 40-F  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):□

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):□

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

July 23, 2021

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 

 


 

 


 

 

 

 

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

 

 

 

 

 

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of June 2021.

 

 

 

 

 

1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

 

Title

Name

Number of shares held as of

Changes

05/31/2021

06/30/2021

 

Senior Vice President

Cliff Hou

438,587

439,263

676

 

Vice President

Connie Ma

187,000

197,000

10,000

 

Vice President and

Chief Financial Office

Wendell Huang

1,651,653

1,651,667

14

 

Vice President

Jonathan Lee

330,169

330,508

339

 

Note: Shareholdings include shares held by the related parties.

 

2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable

 

 

 

 

 

 

3. The acquisition and disposition of assets by TSMC and its subsidiaries:

(1) Fixed-income investment: NT$3.4 billion of acquisition and NT$2.6 billion of disposition.

(2) Disposal of machinery equipment.: NT$1.1 billion of disposition

 

4. The capital appropriations approved by TSMC board of directors:

(1) Machinery equipment for advanced technology capacity: NT$191.8 billion;

(2) Machinery equipment for specialty technology capacity: NT$0.3 billion;

(3) Machinery equipment for R&D capital investments and sustaining capital expenditures: NT$8.9 billion;

(4) Real estate and capitalized leased assets: NT$54.5 billion.

 

 


 

 

 

5. The unsecured bonds issued by TSMC and its subsidiaries

 

Issuance

Tranche

Issuance Period

Total Amount
(in billions)

Coupon
Rate

Repayment

and
Interest Payment

 

 

110-3

A

June 2021 ~ June 2026

NT$6.9

0.52%

Bullet repayment; interest payable annually

 

 

B

June 2021 ~ June 2028

NT$7.9

0.58%

 

 

C

June 2021 ~ June 2031

NT$4.9

0.65%